JPS61166998A - Method for coating molded plastic article with paint by electrodeposition - Google Patents

Method for coating molded plastic article with paint by electrodeposition

Info

Publication number
JPS61166998A
JPS61166998A JP785385A JP785385A JPS61166998A JP S61166998 A JPS61166998 A JP S61166998A JP 785385 A JP785385 A JP 785385A JP 785385 A JP785385 A JP 785385A JP S61166998 A JPS61166998 A JP S61166998A
Authority
JP
Japan
Prior art keywords
plating
film
paint
electrodeposition
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP785385A
Other languages
Japanese (ja)
Inventor
Shigemitsu Kawagishi
川岸 重光
Toshiyuki Yadera
矢寺 敏幸
Kaoru Naito
薫 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP785385A priority Critical patent/JPS61166998A/en
Publication of JPS61166998A publication Critical patent/JPS61166998A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To form a paint film having superior adhesion, insulation and decorativeness on a molded plastic article by subjecting the article to electroless plating, electroplating and composite Ni plating in an Ni plating bath contg. plastic powder and by coating the article with paint by electrodeposition. CONSTITUTION:The surface of a plastic article is washed and roughened by etching. A Cu or Ni film of about 0.3mum thickness is formed on the roughened surface by electroless plating, the surface of the electrically conductive film is electroplated with Cu or Ni, and a composite Ni layer contg. plastic powder is formed in an Ni electroplating bath contg. dispersed plastic powder. The plastic article is then coated with paint by electrodeposition. A paint film having superior adhesion, insulation and decorativeness can be formed.

Description

【発明の詳細な説明】 !jiJ:(2夏1立! 本発明は、プラスチック成形品にめっきを施した後、絶
縁、防食等のための塗膜を形成させる方法に関する。
[Detailed description of the invention]! jiJ: (2 Summer 1 Stand!) The present invention relates to a method of forming a coating film for insulation, corrosion prevention, etc. after plating a plastic molded product.

来の 術 びその問題 プラスチック成形品に装飾性や導電性を付与する目的で
めっき処理を施す方法は公知である。このようなめつき
処理を施したプラスチック成形品では、めっき皮膜の耐
食性向上や絶縁性付与のためにめっき皮膜の上に絶縁性
皮膜を形成させることを要する場合がある。
Current Techniques and Problems There are known methods of plating plastic molded products for the purpose of imparting decorative properties and conductivity. In plastic molded products subjected to such plating treatment, it may be necessary to form an insulating film on the plating film in order to improve the corrosion resistance of the plating film and impart insulation properties.

例えば、近年電磁波障害による電子機器の誤動作等を防
止するために、電子機器のケースに1!磁波シールド(
以下、EMIシールドという)のための処理を施すこと
が要求されているが、このための方法としては、電子機
器のケースを金属製にする方法、プラスチックケースに
導電性塗料を塗布する方法、プラスチックケースに湿式
めっきを施す方法、などが知られている。このようなE
MIシールドのために導電性を付与したケースでは、ケ
ース表面の絶縁、防食、装飾などの目的で導電性皮膜の
上にへヶ塗り、スプレー塗装などの方法で塗膜を形成さ
せることが行なわれている。
For example, in recent years, in order to prevent electronic equipment from malfunctioning due to electromagnetic interference, 1! Magnetic shield (
(Hereinafter referred to as EMI shielding), methods for this purpose include making the case of electronic equipment made of metal, applying conductive paint to the plastic case, and applying conductive paint to the plastic case. A method of applying wet plating to the case is known. E like this
For cases that have been given conductivity for MI shielding, a coating film is formed on the conductive film by methods such as dipping or spray painting for purposes such as insulation, corrosion prevention, and decoration on the case surface. ing.

しかしながら、へヶ塗りやスプレー塗装により形成させ
た塗膜では、塗膜の膜厚が不均一となり、ケースの寸法
安定性が悪くなることや、塗膜の密着性が悪く容易に剥
離することなどの問題がある。
However, with paint films formed by flattening or spray painting, the thickness of the paint film becomes uneven, resulting in poor dimensional stability of the case, poor adhesion of the paint film, and easy peeling. There is a problem.

また、めっき処理を行なった後、スプレー塗装やハケ塗
りで塗膜を形成させる方法では、製造上−員作業が不可
能であり、処理に長時間を要することや5121J!!
!費用が高価となることなどの欠点がある。
In addition, if a coating film is formed by spray painting or brushing after plating, it is impossible for manufacturing personnel to work, and the process takes a long time. !
! There are disadvantages such as high cost.

問題点を解決するための手段 本発明者は、上記した如き従来技術の問題点に鑑みて、
鋭意研究を重ねた結果、プラスチック成形品に無電解め
っきを施して導電性を付与した後、電気めっきを施し、
次いでプラスチックパウダーを含む複合ニッケルめっき
を行なった後、電着塗装性によって塗膜を形成させるこ
とにより、−貫した工程でプラスチック成形品にめっき
皮膜及び塗膜を形成させることが可能となり、また得ら
れた塗膜は、均一で密着性が良好であり、更に絶縁性、
装飾性にも優れたものであることを見出した。
Means for Solving the Problems In view of the problems of the prior art as described above, the inventor of the present invention
As a result of extensive research, we applied electroless plating to plastic molded products to make them conductive, and then electroplated them.
Next, after performing composite nickel plating containing plastic powder, a coating film is formed using electrodeposition coating, which makes it possible to form a plating film and a coating film on a plastic molded product in a one-step process, and is also advantageous. The resulting coating film is uniform and has good adhesion, as well as insulation and
It was also found that it has excellent decorative properties.

即ち、本発明は、プラスチック成形品に無電解めっきを
施した後、電気めっきを施し、次いでプラスチックパウ
ダーを含む複合ニッケルめっき皮膜を形成させた後、電
着塗装を行なうことを特徴とするプラスチック成形品の
電着塗装方法に係るものである。
That is, the present invention provides a plastic molding characterized in that a plastic molded product is subjected to electroless plating, then electroplated, and then a composite nickel plating film containing plastic powder is formed, and then electrodeposition coating is performed. This relates to the electrodeposition coating method for products.

本発明では、まず、プラスチック成形品を常法に従って
洗浄した侵、プラスチック成形品の種類に応じて、公知
のエツチング液、例えばH2804−CrO2、塩酸、
NaOHなどから適宜選択したエツチング液を用いて、
該成形品の表面粗化を行なう。
In the present invention, first, a plastic molded article is cleaned in accordance with a conventional method, and then, depending on the type of plastic molded article, a known etching solution such as H2804-CrO2, hydrochloric acid,
Using an etching solution appropriately selected from NaOH etc.
The surface of the molded article is roughened.

次いで、プラスチック成形品表面に無電解めつき用触媒
を付着させる。触媒付着方法は、常法に従って行なえば
よく、例えば、センシタイザーーアクチベーター法、キ
ャタリスト−アクセラレータ−法などによって処理すれ
ばよい。
Next, an electroless plating catalyst is attached to the surface of the plastic molded product. The catalyst may be attached using a conventional method, such as a sensitizer-activator method or a catalyst-accelerator method.

触媒を付着させた後は、無電解銅めっきまたは無電解ニ
ッケルめっきを行なってプラスチックケ  1 ・。
After attaching the catalyst, electroless copper plating or electroless nickel plating is applied to the plastic.

−スに導電性を付与する。無電解銅めっきまたは無電解
ニッケルめっきの膜厚は、導電性の付与のためには、0
.3μm程度で充分であるが、更に厚くめっきをしても
かまわない。無電解銅めっき及び無電解ニッケルめっき
のめつき液の種類やめつき条件は、特に限定されず、常
法に従えばよい。
- imparts electrical conductivity to the base. The film thickness of electroless copper plating or electroless nickel plating must be 0 to provide conductivity.
.. Approximately 3 μm is sufficient, but plating may be made thicker. The type of plating solution and plating conditions for electroless copper plating and electroless nickel plating are not particularly limited, and may be according to conventional methods.

無電解めっきによってプラスチック成形品に導電性を付
与した後は、電気めっきを施す。電気めっきの種類は、
目的に応じて適宜決定すればよいが、例えば、ニッケル
めっき、銅めっき、亜鉛めっき、すずめつき、各種の合
金めっきなど各種のめっきを施すことが可能である。ま
た、電気めっきの膜厚も、目的に応じて適宜決定すれば
よい。
After imparting conductivity to the plastic molded product through electroless plating, electroplating is performed. The types of electroplating are
Although it may be determined as appropriate depending on the purpose, various platings such as nickel plating, copper plating, zinc plating, tin plating, and various alloy platings can be applied. Moreover, the film thickness of electroplating may be appropriately determined depending on the purpose.

プラスチック成形品に電磁波シールド効果を付与するた
めには、電気めっきとしては銅めっき又はニッケルめっ
きが好ましく、銅めっきが特に好ましい。銅めっきの種
類としては、特に制限はなく、例えば、公知の硫酸銅め
っき浴(CuSOt 。
In order to impart an electromagnetic shielding effect to a plastic molded product, copper plating or nickel plating is preferable as electroplating, and copper plating is particularly preferable. There are no particular restrictions on the type of copper plating, and for example, a known copper sulfate plating bath (CuSOt).

・5H20200〜250Q/Q 1H2Soム40〜
60Q/Q、光沢剤適量)、ビロリン酸銅めっき浴(ビ
ロリン酸銅70〜90にJ/Q1ビロリン酸カリウム3
40〜380g/Q、アンモニア水1〜3112/Q、
光沢剤適量)などが使用でき、常法に従ってめっきを行
なえばよい。電磁波シールド効果を付与するためには、
めっき皮膜の膜厚は、通常5〜25μm程度とすること
が好ましい。
・5H20200~250Q/Q 1H2Som40~
60Q/Q, appropriate amount of brightener), copper birophosphate plating bath (copper birophosphate 70-90 J/Q1 potassium birophosphate 3
40-380g/Q, ammonia water 1-3112/Q,
An appropriate amount of brightener) can be used, and plating can be carried out according to a conventional method. In order to provide electromagnetic shielding effect,
The thickness of the plating film is usually preferably about 5 to 25 μm.

次いで、電気めっきにより形成しためつき皮膜の上に、
プラスチックパウダーを分散させた電気ニッケルめっき
液を用いて複合ニッケル皮膜を形成させる。この複合ニ
ッケルめっき皮膜は、プラスチックパウダーを共析した
形態となっており、次いで行なう電着塗装による塗膜が
、共析したプラスチックパウダーと強固に結合し、密着
性に優れた塗膜が得られる。プラスチックパウダーとし
ては、エポキシ、アクリル、ポリカーボネート、ナイロ
ン、ポリエステル、スチレンなどのものが使用でき、共
析囲を多くするためには、粒径1〜50μm1好ましく
は1〜10μmのものを使用する。プラスチックパウダ
ーを分散させるめっき液としては、通常のニッケルめっ
き液が使用でき、例えばワット浴(硫酸ニッケル230
〜250g/Q、塩化ニッケル40〜50にJ/Q、ホ
ウ酸30〜40Q/(i)、スルファミン酸ニッケルめ
っき浴(スルファミン酸ニッケル400〜500Q/Q
 、硼I!30〜40Q/Q、塩化ナトリウム5〜10
g/+1)などが使用できる。プラスチックパウダーの
ニッケルめっき浴への分散囲は5〜100Q/Q程度と
することが好ましい。めっき浴の温度は、通常のニッケ
ルめつぎ浴と同様でよく、めっき浴を充分に撹拌しなが
ら2〜5A/ds2程度のwi流重密度めっきを行なえ
ばよい。めっき皮膜の膜厚は、2〜50μm1好ましく
は3〜7μm程度とし、膜厚が薄すぎる場合には、プラ
スチックパウダーの共析量が少なくなるので好ましくな
い。
Next, on top of the plating film formed by electroplating,
A composite nickel film is formed using an electrolytic nickel plating solution in which plastic powder is dispersed. This composite nickel plating film is in the form of eutectoid plastic powder, and the subsequent electrodeposited coating strongly bonds with the eutectoid plastic powder, resulting in a coating film with excellent adhesion. . As the plastic powder, epoxy, acrylic, polycarbonate, nylon, polyester, styrene, etc. can be used, and in order to increase the number of eutectoids, one having a particle size of 1 to 50 μm, preferably 1 to 10 μm is used. As a plating solution for dispersing plastic powder, a normal nickel plating solution can be used, such as Watt bath (nickel sulfate 230
~250g/Q, nickel chloride 40-50J/Q, boric acid 30-40Q/(i), nickel sulfamate plating bath (nickel sulfamate 400-500Q/Q
, 硼I! 30-40Q/Q, sodium chloride 5-10
g/+1) etc. can be used. The dispersion range of the plastic powder into the nickel plating bath is preferably about 5 to 100 Q/Q. The temperature of the plating bath may be the same as that of a normal nickel plating bath, and the plating bath may be sufficiently stirred to perform wi flow heavy density plating of about 2 to 5 A/ds2. The thickness of the plating film is about 2 to 50 μm, preferably about 3 to 7 μm. If the film thickness is too thin, the amount of eutectoid plastic powder will decrease, which is not preferable.

次いで、複合ニッケルめっき皮膜上に電着塗装法によっ
て塗膜を形成させる。電着塗装用の塗料としては、特に
制限はなく、例えば熱硬化性アクリル樹脂、エポキシア
ミン樹脂などの樹脂分を主成分とし、必要に応じて顔料
などを添加した公知の電着塗装用水溶性塗料を使用する
ことができる。
Next, a coating film is formed on the composite nickel plating film by an electrodeposition coating method. There are no particular restrictions on the paint for electrodeposition, and examples include known water-soluble paints for electrodeposition that are mainly composed of thermosetting acrylic resins, epoxy amine resins, and other resins, with pigments added as necessary. can be used.

電着塗装の条件は、使用する塗料によって異なるが、通
常80〜150V程度で0.5〜3分程度7j1着を行
なう。211着塗装は、使用する′R着着装装用塗料種
類に応じて陰極又は陽極のどちらで行なってもよく、ま
た両者を併用してもよい。塗膜の膜厚は通常5〜25μ
m程度とすればよい。
Conditions for electrodeposition coating vary depending on the paint used, but 7j1 deposition is usually carried out at about 80 to 150 V for about 0.5 to 3 minutes. 211 coating may be carried out using either the cathode or the anode depending on the type of the 'R coating paint used, or both may be used in combination. The thickness of the coating film is usually 5-25μ
It may be about m.

電着塗装後は、電着した樹脂を焼付硬化させる。After electrodeposition coating, the electrodeposited resin is cured by baking.

焼付条件は、樹脂の種類によって決まり、例えば、熱硬
化性アクリル樹脂では150〜190℃程度の温度で1
5〜30分程゛度焼付ければよく、エポキシアミン樹脂
では、150〜170℃程度の温度で15〜30分程度
焼付ければよい。
Baking conditions are determined by the type of resin; for example, for thermosetting acrylic resin, baking conditions are 150 to 190°C.
It is sufficient to bake for about 5 to 30 minutes, and in the case of epoxy amine resin, it is sufficient to bake for about 15 to 30 minutes at a temperature of about 150 to 170°C.

本発明が適用できるプラスチック成形品の素材ば□、熱
変形温度が110℃以上の樹脂又は各種充填剤を含んだ
強化型樹脂であればよく、めっき用グレードのエンジニ
アリングプラスチックはすべて使用可能である。具体例
としては、ノリル、ポリカーボネート、ポリエステル、
ナイロンなどの熱可塑性樹脂、エポキシ、フェノールな
どの熱硬化性樹脂を挙げることができ、特に好ましいも
のは、軟化点が150℃以上の耐熱性樹脂である。
Materials for plastic molded products to which the present invention can be applied may be resins with a heat distortion temperature of 110° C. or higher or reinforced resins containing various fillers, and any plating-grade engineering plastics can be used. Specific examples include Noryl, polycarbonate, polyester,
Examples include thermoplastic resins such as nylon, thermosetting resins such as epoxy and phenol, and particularly preferred are heat-resistant resins with a softening point of 150° C. or higher.

発明の効果 ■ 電着塗装では、めっきに使用するものと同様の取付
器具を使用することができるので、めっき工程と塗装工
程とを分ける必要がなく、1ラインで連続的に処理をす
ることが可能であり、作朶性向上及び処理費用の低減が
図れる。
Effects of the invention ■ Electrodeposition coating can use the same mounting equipment as used for plating, so there is no need to separate the plating process and the painting process, and the process can be performed continuously in one line. It is possible to improve productivity and reduce processing costs.

■ Wi@塗装による塗膜は、つきまわり性に優れたも
のであり、従来へケ塗りやスプレー塗装が困難であった
部分も容易に被覆することができる。
■ The coating film produced by Wi@painting has excellent throwing power and can easily cover areas that were previously difficult to apply by brushing or spray painting.

■・I!電着塗装は、塗料のたまりやだれがなく、塗膜
の膜厚が均一となり、処理物の寸法安定性に優れている
■・I! Electrodeposition coating has no buildup or dripping of paint, the thickness of the coating film is uniform, and it has excellent dimensional stability of the treated product.

■ 複合ニッケルめっき皮膜上の電着塗装による塗膜は
、強固な密着力を示すため処理物を長期間使用した場合
にも、塗膜の剥離がなく、絶縁、防食、酸化防止などの
作用を長期に亘って持続し得る。
■ The electrodeposited coating on the composite nickel plating film exhibits strong adhesion, so even if the treated product is used for a long period of time, the coating will not peel off, and it has properties such as insulation, anti-corrosion, and anti-oxidation. It can last for a long time.

■ 電着塗装による塗膜は、表面状態が均一かつ平滑で
あり、特に顔料を含むものでは、顔料の種類に応じて、
各棟の色に着色した装飾性の優れた塗膜が得られる。
■ Electrodeposition coatings have a uniform and smooth surface, and especially those containing pigments, depending on the type of pigment, the surface condition is uniform and smooth.
A highly decorative paint film colored in the color of each ridge can be obtained.

■ 電気めっきとして、銅めっき又はニッケルめっきを
施したものは、優れたEM(シールド効果を有する。
■ Copper plating or nickel plating as electroplating has excellent EM (shielding effect).

実  施  例 実施例1 ガラスフィラー20%及びワラストナイト25%を含有
するポリエチレンテレフタレト樹脂の成形品に次に示す
方法に従ってめっき皮膜及び12M塗装皮膜を形成させ
、塗膜の乾燥温度のみ異なる31!1!類の試料を作製
した。
Examples Example 1 A plating film and a 12M paint film were formed on a polyethylene terephthalate resin molded product containing 20% glass filler and 25% wollastonite according to the following method, and only the drying temperature of the paint film was different. 31!1! A similar sample was prepared.

oアルカリ樹脂:NaO8200g/Q水溶液に60℃
で10分間浸漬。
o Alkaline resin: NaO8200g/Q aqueous solution at 60℃
Soak for 10 minutes.

0エツチング:98%H2S Ot 5011Q/ Q
及び酸性弗化アン・モニウム(NH,F−HF)20Q
/Qからなるエツチング液に40℃で10分間浸漬。
0 etching: 98%H2S Ot 5011Q/Q
and acidic ammonium fluoride (NH,F-HF) 20Q
/Q for 10 minutes at 40°C.

0触媒付与:キャタリスト(商標“キャタリストC11
奥野製薬工業■製)に25℃で4分間浸漬し、水洗した
後、98%H2S Oa 50 Q / Q水溶液に4
0℃で3分間浸漬。
0 catalyst provision: Catalyst (trademark “Catalyst C11
Okuno Pharmaceutical Co., Ltd.) for 4 minutes at 25°C, washed with water, and then soaked in 98% H2S Oa 50 Q/Q aqueous solution for 4 minutes.
Soak for 3 minutes at 0°C.

0無電解鋼めつき:無電解銅めっき液(商標“トップ化
学銅メッキ500″奥野製薬工業■WJ)に25℃で1
5分間浸漬。
0 Electroless steel plating: Electroless copper plating solution (trademark “Top Chemical Copper Plating 500” Okuno Pharmaceutical Co., Ltd. WJ) at 25°C.
Soak for 5 minutes.

0活性化:98%H2S Ot 50 wd / Q水
溶液に50℃で1分間浸漬。
0 activation: immersed in 98% H2S Ot 50 wd/Q aqueous solution at 50°C for 1 minute.

O電気銅めつき: CUSOA  ・5H20200Q
/Q 、98%1ii1150にI/12 及び光tl
J (商標“トップルチナ81M”奥野製薬工業■製)
51111/Qからなる硫酸鋼めっき浴を用いて3A/
d■2で20分間めっき。
O electrolytic copper plating: CUSOA ・5H20200Q
/Q, 98% 1ii1150 to I/12 and light tl
J (Trademark “Top Lucina 81M” manufactured by Okuno Pharmaceutical Co., Ltd.)
3A/ using a sulfuric acid steel plating bath consisting of 51111/Q.
Plating with d■2 for 20 minutes.

0複合ニッケルめつき:N15Ot ・6H20240
Q/Q、N5CQ2  ・6H2045(J/Q 、H
3BO330Q/Q 、サッカリン0.5(J/Q及び
粒径2〜10μmのエポキシパウダー20 a/Qから
なる複合ニッケルめっき液を用いて、3A/d■2で1
0分間めっき。
0 composite nickel plating: N15Ot ・6H20240
Q/Q, N5CQ2 ・6H2045 (J/Q, H
Using a composite nickel plating solution consisting of 3BO330Q/Q, saccharin 0.5 (J/Q, and 20 a/Q of epoxy powder with a particle size of 2 to 10 μm, 1 at 3A/d■2
Plating for 0 minutes.

0電着塗装:熱硬化性水溶性アクリル樹脂電着塗料・(
商a[″ハニープライト”ハニー化成■製)を用いて試
料を陽極として電圧100V、浴温20℃で30秒間電
着。
0 electrodeposition coating: thermosetting water-soluble acrylic resin electrodeposition paint (
Electrodeposition was performed using Commercial A ["Honey Prite" manufactured by Honey Kasei ■] using the sample as an anode at a voltage of 100 V and a bath temperature of 20° C. for 30 seconds.

0乾燥:オーブン中で150℃、165℃、180℃の
各温度で20分間加熱。
0 Drying: Heating in an oven at 150°C, 165°C, and 180°C for 20 minutes.

上記した処理を施したポリエチレンテレフタレート樹脂
の成形品は、各試料ともに均一で平滑な外観を有してお
り、塗膜の膜厚は、約10μmであった。この塗膜につ
いてJIS  0 0202の方法に従って鉛筆硬度を
測定した結果150℃で硬化させたものはH〜2H,1
65℃で硬化させたものは2H〜3H,180℃で硬化
させたものは3H〜4日であり、充分な表面硬度であっ
た。
Each sample of molded articles made of polyethylene terephthalate resin subjected to the above-described treatment had a uniform and smooth appearance, and the thickness of the coating film was approximately 10 μm. The pencil hardness of this coating film was measured according to the method of JIS 0 0202, and the hardness of the film cured at 150°C was H~2H, 1
Those cured at 65°C took 2H to 3H, and those cured at 180°C took 3H to 4 days, indicating sufficient surface hardness.

また、電着塗装による塗膜の抵抗値を、テスター (M
ODEL3400、n’)7−II) 及ヒシート抵抗
測定器(K−705RD、■共和埋骨製)を用いて測定
したところ各試料ともに導電性はなく、良好な絶縁皮膜
であった。
In addition, the resistance value of the electrocoated film was measured using a tester (M
When measured using an ODEL3400, n')7-II) and Hi-Sheet resistance measuring device (K-705RD, manufactured by Kyowa Kaikou Co., Ltd.), each sample had no conductivity and was found to be a good insulating film.

また、塗膜に、ナイフを用いて、縦横11本の1+u/
il隔の直交する切り口を複合ニッケルめっき皮膜に達
するまで入れて、格子状に一辺1■の正方形を100個
作った後、接着テープをはりつけて、瞬時にはがした時
のはがれずに残った正方形の数を求めるという方法によ
り塗膜の密着性を測定したところ、各試料ともに剥離し
たものはなく、良好な密着性であった。
Also, on the coating film, using a knife, 1+u/
After making 100 squares of 1 square on each side in a lattice pattern by inserting the perpendicular cuts of the il spacings until they reach the composite nickel plating film, we applied adhesive tape and removed it instantly without leaving any residue. When the adhesion of the coating film was measured by calculating the number of squares, there was no peeling in any of the samples, and the adhesion was good.

また、上記しためつき処理及び電着塗装処理を施したプ
ラスチック成形品のEMIシールド効果をシールドボッ
クス法により、周波数0.1.〜100100Oの電界
波及び磁界波について測定した結果を第1図に示す。各
試料ともに第1図に示す結果と同様であった。第1図か
ら明らかな如く、本発明方法により処理したプラスチッ
ク成形品は電界波に対しては、115〜120dB以上
、磁界波に対しては、5〜120dBという良好なEM
Iシールド効果を示した。
In addition, the EMI shielding effect of the plastic molded product subjected to the above-mentioned tightening treatment and electrodeposition coating treatment was evaluated using the shield box method at a frequency of 0.1. The results of measurements of electric and magnetic field waves of ~100,100 O are shown in FIG. The results for each sample were similar to those shown in FIG. As is clear from Fig. 1, the plastic molded product treated by the method of the present invention has a good EM resistance of 115 to 120 dB or more against electric field waves and 5 to 120 dB against magnetic field waves.
It showed an I-shielding effect.

比較例1 ・ 実施例1で使用した複合ニッケルめっき液からエポキシ
パウダーを除いたニッケルめっき液を使用する以外は、
実施例1と同様にして塗膜の加熱温度165℃でプラス
チック成形品にめっき皮膜及び電着塗装による塗膜を形
成させた。
Comparative Example 1 - Except for using a nickel plating solution obtained by removing the epoxy powder from the composite nickel plating solution used in Example 1,
A plating film and a coating film by electrodeposition were formed on a plastic molded article in the same manner as in Example 1 at a coating film heating temperature of 165°C.

この塗膜の密着性を実施例1と同様の方法で測定した結
果、100個の正方形のうちで剥離せずに残ったものは
55個であった。
The adhesion of this coating film was measured in the same manner as in Example 1, and as a result, out of 100 squares, 55 squares remained without being peeled off.

比較例2 実施例1と同様にして複合ニッケル皮膜を形成させた債
、スプレー塗装(商標“ドアアクロンH″束亜ペイント
■製を使用)を行ない、120”Cで30分間加熱して
約15μmの塗膜を形成させた。
Comparative Example 2 A bond with a composite nickel film formed in the same manner as in Example 1 was spray-painted (using trademark "Door Akron H" made by Tsukuba Paint) and heated at 120"C for 30 minutes to form a film of about 15 μm. A coating film was formed.

実施例1と同様の方法によって密着性を測定した結果、
1ooaの正方形のうちで剥離せずに残ったものは30
個であった。
As a result of measuring adhesion using the same method as in Example 1,
The number of squares of 1ooa that remained without peeling was 30.
It was.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明方法によって処理したプラスチック成
形品のEMIシールド効果の測定結果を示すグラフであ
る。 (以 上) ′−1・
FIG. 1 is a graph showing the results of measuring the EMI shielding effect of plastic molded products treated by the method of the present invention. (or more) ′−1・

Claims (1)

【特許請求の範囲】[Claims] (1)プラスチック成形品に無電解めつきを施した後、
電気めつきを施し、次いでプラスチックパウダーを含む
複合ニッケルめつき皮膜を形成させた後、電着塗装を行
なうことを特徴とするプラスチック成形品の電着塗装方
法。
(1) After applying electroless plating to the plastic molded product,
A method for electrocoating plastic molded products, which comprises electroplating, forming a composite nickel plating film containing plastic powder, and then applying electrocoating.
JP785385A 1985-01-18 1985-01-18 Method for coating molded plastic article with paint by electrodeposition Pending JPS61166998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP785385A JPS61166998A (en) 1985-01-18 1985-01-18 Method for coating molded plastic article with paint by electrodeposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP785385A JPS61166998A (en) 1985-01-18 1985-01-18 Method for coating molded plastic article with paint by electrodeposition

Publications (1)

Publication Number Publication Date
JPS61166998A true JPS61166998A (en) 1986-07-28

Family

ID=11677183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP785385A Pending JPS61166998A (en) 1985-01-18 1985-01-18 Method for coating molded plastic article with paint by electrodeposition

Country Status (1)

Country Link
JP (1) JPS61166998A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021131439A1 (en) * 2019-12-24 2021-07-01 住友ベークライト株式会社 Electromagnetically shielded housing, inverter component, air conditioner component, and automobile component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146936A (en) * 1977-05-30 1978-12-21 Hitachi Ltd Insulator plating method
JPS5956599A (en) * 1982-09-24 1984-04-02 Nippon Valqua Ind Ltd Method for coating fluororesin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146936A (en) * 1977-05-30 1978-12-21 Hitachi Ltd Insulator plating method
JPS5956599A (en) * 1982-09-24 1984-04-02 Nippon Valqua Ind Ltd Method for coating fluororesin

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021131439A1 (en) * 2019-12-24 2021-07-01 住友ベークライト株式会社 Electromagnetically shielded housing, inverter component, air conditioner component, and automobile component
JPWO2021131439A1 (en) * 2019-12-24 2021-12-23 住友ベークライト株式会社 Electromagnetic wave shielding housing, inverter parts, air conditioner parts and automobile parts
US11765872B2 (en) 2019-12-24 2023-09-19 Sumitomo Bakelite Co., Ltd. Electromagnetic wave shielding housing, inverter part, air conditioner part, and automotive part
EP4084596A4 (en) * 2019-12-24 2024-01-10 Sumitomo Bakelite Co Electromagnetically shielded housing, inverter component, air conditioner component, and automobile component

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