JPS6116682Y2 - - Google Patents
Info
- Publication number
- JPS6116682Y2 JPS6116682Y2 JP1977056098U JP5609877U JPS6116682Y2 JP S6116682 Y2 JPS6116682 Y2 JP S6116682Y2 JP 1977056098 U JP1977056098 U JP 1977056098U JP 5609877 U JP5609877 U JP 5609877U JP S6116682 Y2 JPS6116682 Y2 JP S6116682Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- resin
- electrolytic capacitor
- silicone resin
- elastic sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
【考案の詳細な説明】
本考案は樹脂封口した電解コンデンサに関する
もので、特にプリント配線基板(以下基板とい
う)組立時の洗浄液の侵入を防ぐ構造に関するも
のである。[Detailed Description of the Invention] The present invention relates to a resin-sealed electrolytic capacitor, and particularly to a structure that prevents the intrusion of cleaning liquid during assembly of a printed wiring board (hereinafter referred to as a board).
電解コンデンサその他の電子部品は、基板に取
付けて使用されることが多い。この基板組立に際
しては、基板に部品を取付け、半田付を行つた
後、半田付用のフラツクスその他の汚れを除去す
るために、トリクロールエチレン、トリクロール
エタン等の塩化系洗浄液で基板全体を洗浄するこ
とが通常行われている。とこが電解コンデンサは
塩素に弱く、封口部のすき間から僅かでも前記の
塩素系洗浄液が浸入すると、コンデンサは徐々に
腐食してゆき、開弁、断線等の事故を起し、機器
の信頼性を損ねる結果となる。このため従来は洗
浄液対策として、コンデンサの弾性封口体の上
を、熱硬化性のエポキシ樹脂等で覆うことが行わ
れてきたが、熱硬化性エポキシ樹脂による封口で
は、電解コンデンサを基板に取付ける際のリード
線にかゝる折曲げ、その他の力により、リード線
と樹脂との間に剥離を生じたり、半田付時の熱に
よる膨張率の差により、リード線と樹脂の接触面
が離れたりして、洗浄に際し接着不十分なリード
線部より洗浄液が侵入することがあり、十分な洗
浄液対策とは言えない。またエポキシ樹脂でも第
1図のように、エポキシ樹脂層5を十分に厚く
(数mm以上)すれば、リード線3の折り曲げ等に
よるリード線3と樹脂層5とが剥離しにくゝなる
が、コンデンサの全長が長くなり、小型化を要求
される現今の電子部品においては決して良い対策
ではない。 Electrolytic capacitors and other electronic components are often attached to circuit boards. When assembling this board, after attaching the components to the board and performing soldering, the entire board is cleaned with a chloride-based cleaning solution such as trichlorethylene or trichlorethane to remove soldering flux and other contaminants. It is usually done. However, electrolytic capacitors are sensitive to chlorine, and if even a small amount of the above-mentioned chlorine-based cleaning solution infiltrates through the gap in the sealing part, the capacitor will gradually corrode, causing accidents such as valve opening and wire breakage, and reducing the reliability of the equipment. This will result in a loss. For this reason, in the past, the capacitor's elastic sealing body was covered with thermosetting epoxy resin as a countermeasure against cleaning fluids. Bending or other forces on the lead wire may cause separation between the lead wire and the resin, or the contact surface between the lead wire and the resin may separate due to a difference in expansion coefficient due to heat during soldering. Therefore, during cleaning, the cleaning liquid may enter through the lead wire portions that are insufficiently bonded, and this cannot be said to be a sufficient measure against cleaning liquid. Also, with epoxy resin, as shown in Fig. 1, if the epoxy resin layer 5 is made sufficiently thick (several mm or more), the lead wire 3 and the resin layer 5 will be difficult to separate due to bending of the lead wire 3, etc. This is by no means a good measure in today's electronic components, where the overall length of the capacitor is long and miniaturization is required.
そこで本考案は第2図のように、電解コンデン
サの弾性封口体4の上を常温硬化性シリコン樹脂
6で覆い、常温硬化させる構造としたものであ
る。 Therefore, as shown in FIG. 2, the present invention has a structure in which the elastic sealing member 4 of the electrolytic capacitor is covered with a silicone resin 6 that hardens at room temperature, and is cured at room temperature.
尚図面に於て1は電解コンデンサ素子、2はケ
ース、3はリード線である。 In the drawing, 1 is an electrolytic capacitor element, 2 is a case, and 3 is a lead wire.
本考案の常温硬化性シリコン樹脂6は硬化後も
弾性を有するため、リード線3の折り曲げ、引張
りに対し十分な追従性を持ち、シリコン樹脂自体
が金属との接着性においてエポキシ樹脂に比べ優
れていることゝ併せて樹脂とリード線とが剥離す
ることはない。しかもシリコン樹脂耐熱性におい
ても優れ半田付けによる熱で樹脂が溶かされるこ
ともない。更にシリコン樹脂層はその弾性により
厚さ0.5mm程度あれば十分その目的を達成するこ
とができるので、第2図のようにケース2の封口
折巻き部分まで樹脂で覆えば十分で、ケースを長
くする必要はない。 The room-temperature curable silicone resin 6 of the present invention remains elastic even after curing, so it has sufficient ability to follow the bending and pulling of the lead wire 3, and the silicone resin itself has superior adhesion to metal compared to epoxy resin. At the same time, the resin and lead wire will not peel off. Furthermore, the silicone resin has excellent heat resistance, and the resin will not melt due to the heat generated by soldering. Furthermore, due to its elasticity, the silicone resin layer only needs to be about 0.5 mm thick to achieve its purpose, so it is sufficient to cover the sealing fold part of case 2 with resin as shown in Figure 2, and the case can be made longer. do not have to.
このように本考案は、基板洗浄液の侵入を確実
に防ぎ腐食発生の心配がなく、電解コンデンサの
寿命、信頼性に効果があり、しかも従来のコンデ
ンサよりもケースの形態が大きくなるという不利
益もない。 In this way, the present invention reliably prevents the intrusion of substrate cleaning liquid, eliminates the risk of corrosion, and has an effect on the lifespan and reliability of electrolytic capacitors. Moreover, it does not have the disadvantage of having a larger case than conventional capacitors. do not have.
第1図は従来の電解コンデンサの縦断正面図、
第2図は本考案の電解コンデンサの縦断正面図で
ある。
1……電解コンデンサ素子、2……ケース、3
……リード線、4……弾性封口体、5……エポキ
シ樹脂層、6……シリコン樹脂層。
Figure 1 is a longitudinal sectional front view of a conventional electrolytic capacitor.
FIG. 2 is a longitudinal sectional front view of the electrolytic capacitor of the present invention. 1... Electrolytic capacitor element, 2... Case, 3
... Lead wire, 4 ... Elastic sealing body, 5 ... Epoxy resin layer, 6 ... Silicone resin layer.
Claims (1)
電解コンデンサにおいて、その弾性封口体の外表
部を常温硬化性シリコン樹脂を塗着硬化させた層
で覆つたことを特徴とする電解コンデンサ。 An electrolytic capacitor sealed with an elastic sealing body made of rubber or the like, characterized in that the outer surface of the elastic sealing body is covered with a layer of a room-temperature curable silicone resin applied and cured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977056098U JPS6116682Y2 (en) | 1977-04-30 | 1977-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977056098U JPS6116682Y2 (en) | 1977-04-30 | 1977-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53150433U JPS53150433U (en) | 1978-11-27 |
JPS6116682Y2 true JPS6116682Y2 (en) | 1986-05-22 |
Family
ID=28952630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977056098U Expired JPS6116682Y2 (en) | 1977-04-30 | 1977-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6116682Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7139660B2 (en) * | 2018-04-02 | 2022-09-21 | 日本ケミコン株式会社 | Capacitor manufacturing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320694Y2 (en) * | 1972-06-12 | 1978-05-31 |
-
1977
- 1977-04-30 JP JP1977056098U patent/JPS6116682Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS53150433U (en) | 1978-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4818823A (en) | Adhesive component means for attaching electrical components to conductors | |
EP1593134A2 (en) | Protecting resin-encapsulated components | |
JP2003063325A (en) | Case for electric power steering controller | |
KR960705358A (en) | Method for assembling an electronic package | |
JPS6116682Y2 (en) | ||
JPS5721845A (en) | Mounting structure for miniaturized electronic parts | |
JP3191413B2 (en) | Solid electrolytic capacitors | |
JP3199580B2 (en) | Liquid crystal display | |
JPS6130308Y2 (en) | ||
JPH0798203A (en) | Strain gauge | |
JP3291762B2 (en) | Solid electrolytic capacitors | |
JPH0125388Y2 (en) | ||
JPS5880895A (en) | Both-side printed circuit board and both-side printed circuit board device as well as method of producing same | |
JPH0436121Y2 (en) | ||
JPH0590982U (en) | Component mounting structure on circuit board | |
JPS59181087A (en) | Flexible printed circuit board with reinforced plate | |
JP2007095368A (en) | Connector with electronic component | |
JPH0230832Y2 (en) | ||
JPH0533572U (en) | Printed circuit | |
JPS5963536A (en) | Manufacture of compound temperature detecting element | |
JPS6348078Y2 (en) | ||
JPH0729660Y2 (en) | Circuit device | |
JP3182595B2 (en) | Electronic component and method of manufacturing the same | |
JPS59140466U (en) | circuit board connection device | |
JPS62155509A (en) | Electronic parts |