JP2007095368A - Connector with electronic component - Google Patents

Connector with electronic component Download PDF

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Publication number
JP2007095368A
JP2007095368A JP2005280332A JP2005280332A JP2007095368A JP 2007095368 A JP2007095368 A JP 2007095368A JP 2005280332 A JP2005280332 A JP 2005280332A JP 2005280332 A JP2005280332 A JP 2005280332A JP 2007095368 A JP2007095368 A JP 2007095368A
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connector
electronic component
conductive paste
lead
semiconductor package
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JP2005280332A
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Japanese (ja)
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Shinji Usui
進二 臼井
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Tokai Rika Co Ltd
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Tokai Rika Co Ltd
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Priority to JP2005280332A priority Critical patent/JP2007095368A/en
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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector with an electronic component improved in reliability against damage. <P>SOLUTION: In a buckle switch related to this invention, a semiconductor package 16 is jointed to leads 14 fixed to a connector part 24 by conductive paste 18. The conductive paste 18 is easily deformed as compared with solder and hardly causes damage such as a crack even when difference in thermal expansion between the semiconductor package 16 and the leads 14 is large. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、コネクタに固定されたリードに電子部品を電気接続させてなる電子部品付きコネクタに関する。   The present invention relates to a connector with an electronic component in which an electronic component is electrically connected to a lead fixed to the connector.

スイッチなどでは、電子部品（半導体パッケージなど）がコネクタのリードやコネクタ一体型のインシュレータに接続された電子部品付きコネクタが多用されている。従来、この接続は、半田付けによって、機械的接続、電気的接続が行われている（例えば特許文献１参照）。   In a switch or the like, a connector with an electronic component in which an electronic component (semiconductor package or the like) is connected to a connector lead or a connector-integrated insulator is often used. Conventionally, this connection has been mechanically connected or electrically connected by soldering (see, for example, Patent Document 1).

しかし、電子部品とリードとの線膨張係数の違いが比較的大きい。このため、温度変化（サイクル状の温度変化など）が生じると、主として半田にクラック等の損傷が生じることがある。このため、損傷に対する信頼性を更に向上させたいという要望が出されていた。
特開２００４−１４４６０１号公報 However, the difference in coefficient of linear expansion between the electronic component and the lead is relatively large. For this reason, when a temperature change (cycle temperature change or the like) occurs, damage such as cracks may mainly occur in the solder. For this reason, there has been a demand for further improving the reliability against damage.
JP 2004-144601 A

本発明は、上記事実を考慮して、損傷に対する信頼性を向上させた電子部品付きコネクタを提供することを課題とする。   In view of the above fact, an object of the present invention is to provide a connector with an electronic component with improved reliability against damage.

本発明者は、電子部品とリードとの線膨張係数の違いが比較的大きく、このため、温度変化によって半田に損傷が生じることに着目した。そして、半田に損傷が生じないような接合形態を鋭意検討した。そして、リードに電子部品を接合する際、半田付け以外の形態で接合すること考え付き、更に検討を重ね、本発明を完成するに至った。   The present inventor has paid attention to the fact that the difference in the coefficient of linear expansion between the electronic component and the lead is relatively large, so that the solder is damaged by the temperature change. Then, the joint form that does not cause damage to the solder was intensively studied. And when joining an electronic component to a lead | read | reed, it came up with thinking about joining in forms other than soldering, repeated examination, and came to complete this invention.

請求項１に記載の発明は、コネクタに固定されたリードに電子部品を電気接続させてなる電子部品付きコネクタであって、前記電子部品が前記リードに導電性ペーストで接合されていることを特徴とする。   The invention according to claim 1 is a connector with an electronic component in which an electronic component is electrically connected to a lead fixed to the connector, and the electronic component is joined to the lead with a conductive paste. And

導電性ペーストは、半田に比べて変形し易く、電子部品とリードとの熱膨張差が大きくてもクラック等の損傷が生じ難い。従って、請求項１に記載の発明により、損傷に対する信頼性を向上させた電子部品付きコネクタとすることができる。   The conductive paste is more easily deformed than solder, and even if the difference in thermal expansion between the electronic component and the lead is large, damage such as cracks hardly occurs. Therefore, according to the first aspect of the present invention, it is possible to provide a connector with an electronic component with improved reliability against damage.

請求項２に記載の発明は、前記導電性ペーストがシリコーン系導電性ペーストであることを特徴とする。   The invention according to claim 2 is characterized in that the conductive paste is a silicone-based conductive paste.

シリコーン系導電性ペーストは、銀エポキシ系導電性ペーストやポリイミド系導電性ペーストに比べ、より柔軟で変形し易いため、応力吸収をし易い。従って、請求項２に記載の発明により、より信頼性を高めた電子部品付きコネクタとすることができる。   Silicone type conductive paste is more flexible and easily deformed than silver epoxy type conductive paste and polyimide type conductive paste, so that it is easy to absorb stress. Therefore, according to the invention described in claim 2, it is possible to provide a connector with electronic parts with higher reliability.

請求項３に記載の発明は、前記導電性ペーストを防湿する防湿手段が設けられていることを特徴とする。   The invention described in claim 3 is characterized in that moisture-proofing means for moisture-proofing the conductive paste is provided.

これにより、マイグレーションや、卑金属（Ｓｎなど）と貴金属（Ａｇなど）との組み合わせで起きるガルバニック腐食を防止することができ、信頼性が向上する。   As a result, migration and galvanic corrosion caused by a combination of a base metal (such as Sn) and a noble metal (such as Ag) can be prevented, and reliability is improved.

請求項４に記載の発明は、前記防湿手段として、ホットメルトで前記電子部品を被覆した被覆部が形成されていることを特徴とする。   The invention according to claim 4 is characterized in that a coating portion that covers the electronic component with hot melt is formed as the moisture-proof means.

ホットメルトは成形温度が比較的低くて取扱いが容易である。従って、請求項４に記載の発明により、高い生産効率でバックルスイッチを製造することができる。   Hot melt has a relatively low molding temperature and is easy to handle. Therefore, according to the invention described in claim 4, the buckle switch can be manufactured with high production efficiency.

本発明は上記構成としたので、以下の効果を奏することができる。   Since the present invention has the above configuration, the following effects can be obtained.

請求項１に記載の発明によれば、損傷に対する信頼性を向上させた電子部品付きコネクタとすることができる。   According to invention of Claim 1, it can be set as the connector with an electronic component which improved the reliability with respect to damage.

請求項２に記載の発明によれば、より信頼性を高めた電子部品付きコネクタとすることができる。   According to invention of Claim 2, it can be set as the connector with an electronic component which improved reliability more.

請求項３に記載の発明によれば、耐湿性に対する信頼性が向上する。   According to invention of Claim 3, the reliability with respect to moisture resistance improves.

請求項４に記載の発明によれば、高い生産効率でバックルスイッチを製造することができる。   According to invention of Claim 4, a buckle switch can be manufactured with high production efficiency.

以下、電子部品付きコネクタとしてバックルスイッチの実施形態を挙げ、本発明の実施の形態について説明する。図１、図２に示すように、本発明の一実施形態に係るバックルスイッチ１０（図２参照）は、コネクタ一体型インシュレータ１２と、コネクタ一体型インシュレータ１２のリード１４Ａ、１４Ｂに接合された半導体パッケージ１６と、半導体パッケージ１６を覆う被覆部２０と、を備えている。半導体パッケージ１６は、シリコーン系の導電性ペースト１８でリード１４に接合されている。   Hereinafter, embodiments of the present invention will be described with reference to an embodiment of a buckle switch as a connector with electronic components. As shown in FIGS. 1 and 2, a buckle switch 10 (see FIG. 2) according to an embodiment of the present invention includes a connector-integrated insulator 12 and a semiconductor bonded to leads 14 </ b> A and 14 </ b> B of the connector-integrated insulator 12. A package 16 and a covering portion 20 that covers the semiconductor package 16 are provided. The semiconductor package 16 is bonded to the leads 14 with a silicone-based conductive paste 18.

本実施形態では、半導体パッケージ１６は、リード有りパッケージ、リードレスパッケージ（例えばＣＬＣＣ）、ＳＭＤ部品（例えばセラミックコンデンサ）の何れであってもよい。   In the present embodiment, the semiconductor package 16 may be any of a leaded package, a leadless package (for example, CLCC), and an SMD component (for example, a ceramic capacitor).

コネクタ一体型インシュレータ１２は、樹脂成形部２２にリード１４が一体的に設けられたものである。また、被覆部２０は、溶融状態のホットメルトを固化することによって形成されており、コネクタ部２４からリード先端にまで設けられている。   The connector-integrated insulator 12 is one in which a lead 14 is integrally provided on a resin molding portion 22. The covering portion 20 is formed by solidifying a molten hot melt and is provided from the connector portion 24 to the tip of the lead.

バックルスイッチ１０を製造するには、図１に示すように、コネクタ一体型インシュレータ１２のリード１４Ａ、１４Ｂに導電性ペースト１８を塗布し、塗布した導電性ペースト１８の上に半導体パッケージ１６を載置する。なお、導電性ペースト１８を半導体パッケージ１６に塗布しておき、リード１４Ａ、１４Ｂに載置してもよい。   To manufacture the buckle switch 10, as shown in FIG. 1, the conductive paste 18 is applied to the leads 14 </ b> A and 14 </ b> B of the connector-integrated insulator 12, and the semiconductor package 16 is placed on the applied conductive paste 18. To do. The conductive paste 18 may be applied to the semiconductor package 16 and placed on the leads 14A and 14B.

導電性ペーストの硬化後、ホットメルトで被覆部２０を形成する（図２参照）。   After the conductive paste is cured, the covering portion 20 is formed by hot melt (see FIG. 2).

以上説明したように、本実施形態では、半導体パッケージ１６をリード１４に導電性ペースト１８で直接に接合している。導電性ペースト１８は、半田に比べて変形し易く、半導体パッケージ１６とリード１４との熱膨張差が大きくてもクラック等の損傷が生じ難い。しかも、導電性ペースト１８として、応力吸収し易いシリコーン系の導電性ペーストを用いている。従って、現有設備を用い、低コストで、工程数を増やすことなく、損傷に対する信頼性を大幅に向上させたバックルスイッチ１０を製造することができる。   As described above, in this embodiment, the semiconductor package 16 is directly bonded to the lead 14 with the conductive paste 18. The conductive paste 18 is more easily deformed than solder, and even if the difference in thermal expansion between the semiconductor package 16 and the lead 14 is large, damage such as cracks is unlikely to occur. In addition, as the conductive paste 18, a silicone-based conductive paste that easily absorbs stress is used. Therefore, it is possible to manufacture the buckle switch 10 using the existing facilities, at low cost, and having greatly improved reliability against damage without increasing the number of processes.

また、導電性ペースト１８を防湿する防湿手段として被覆部２０が設けられている。これにより、吸湿によるマイグレーションやガルバニック腐食を防ぎ、耐湿性の信頼性を向上させることができる。   In addition, a coating portion 20 is provided as a moisture-proof means for preventing the conductive paste 18 from moisture. Thereby, migration due to moisture absorption and galvanic corrosion can be prevented, and the reliability of moisture resistance can be improved.

そして、この被覆部２０はホットメルトを空冷することによって形成されている。ホットメルトは成形温度が比較的低くて取扱いが容易なので、これにより、高い生産効率でバックルスイッチ１０を製造することができる。   And this coating | coated part 20 is formed by air-cooling a hot melt. Since the hot melt has a relatively low molding temperature and is easy to handle, the buckle switch 10 can be manufactured with high production efficiency.

また、リード１４をコネクタ部２４に直結させているので、従来必要であったコードを廃止することができ、省スペース化を実現できる。   In addition, since the lead 14 is directly connected to the connector portion 24, a cord that has been conventionally required can be eliminated, and space saving can be realized.

なお、コネクタ一体型インシュレータ１２に代えて、コネクタ部２４からリード１４が延び出したもの（樹脂成形部２２が設けられていないもの）を用いても、同様の効果を奏することができる。また、コネクタ一体型インシュレータ１２でなく、プリント回路基板に半導体パッケージ１６を導電性ペースト１８で接合し、被覆部２０を形成してもよい。   It should be noted that the same effect can be obtained by using the one in which the lead 14 extends from the connector portion 24 (one not provided with the resin molding portion 22) instead of the connector-integrated insulator 12. Alternatively, the cover portion 20 may be formed by bonding the semiconductor package 16 to the printed circuit board with the conductive paste 18 instead of the connector-integrated insulator 12.

以上、実施形態を挙げて本発明の実施の形態を説明したが、上記実施形態は一例であり、要旨を逸脱しない範囲内で種々変更して実施できる。また、本発明の権利範囲が上記実施形態に限定されないことは言うまでもない。   The embodiments of the present invention have been described with reference to the embodiments. However, the above embodiments are merely examples, and various modifications can be made without departing from the scope of the invention. Needless to say, the scope of rights of the present invention is not limited to the above embodiment.

図１（Ａ）及び（Ｂ）は、それぞれ、本発明の一実施形態で、リード上に半導体パッケージを導電性ペーストで接合したことを示す模式的側面断面図及び模式的平面図である。FIGS. 1A and 1B are a schematic side cross-sectional view and a schematic plan view showing a semiconductor package bonded to a lead with a conductive paste, respectively, according to an embodiment of the present invention. 本発明の一実施形態に係るバックルスイッチの模式的側面図である。It is a typical side view of the buckle switch concerning one embodiment of the present invention.

符号の説明Explanation of symbols

１０ バックルスイッチ１０
１４Ａ リード
１４Ｂ リード
１６ 半導体パッケージ（電子部品）
１８ 導電性ペースト
２０ 被覆部 10 Buckle switch 10
14A Lead 14B Lead 16 Semiconductor package (electronic component)
18 Conductive paste 20 Covering part

Claims (4)

コネクタに固定されたリードに電子部品を電気接続させてなる電子部品付きコネクタであって、
前記電子部品が前記リードに導電性ペーストで接合されていることを特徴とする電子部品付きコネクタ。 It is a connector with an electronic component obtained by electrically connecting an electronic component to a lead fixed to the connector,
A connector with an electronic component, wherein the electronic component is joined to the lead with a conductive paste. 前記導電性ペーストがシリコーン系導電性ペーストであることを特徴とする請求項１に記載の電子部品付きコネクタ。   The connector with electronic components according to claim 1, wherein the conductive paste is a silicone-based conductive paste. 前記導電性ペーストを防湿する防湿手段が設けられていることを特徴とする請求項１又は２に記載の電子部品付きコネクタ。   The connector with electronic parts according to claim 1, wherein moisture-proof means for preventing moisture from the conductive paste is provided. 前記防湿手段として、ホットメルトで前記電子部品を被覆した被覆部が形成されていることを特徴とする請求項３に記載の電子部品付きコネクタ。   The connector with an electronic component according to claim 3, wherein a coating portion in which the electronic component is coated with hot melt is formed as the moisture-proof means.
JP2005280332A 2005-09-27 2005-09-27 Connector with electronic component Pending JP2007095368A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1975999A1 (en) 2007-03-30 2008-10-01 Fujitsu Limited Electronic device and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6455535A (en) * 1987-08-26 1989-03-02 Matsushita Electric Ind Co Ltd Semiconductor connecting device
JPH0831470A (en) * 1994-07-12 1996-02-02 Kurabe Ind Co Ltd Connection structure of conductor
JPH09217039A (en) * 1996-02-08 1997-08-19 Toshiba Corp Inorganic adhesive, semiconductor device using the same and its production
JP2000323193A (en) * 1999-05-06 2000-11-24 Sony Corp Electronic part device
JP2001167852A (en) * 1999-12-07 2001-06-22 Tdk Corp Connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6455535A (en) * 1987-08-26 1989-03-02 Matsushita Electric Ind Co Ltd Semiconductor connecting device
JPH0831470A (en) * 1994-07-12 1996-02-02 Kurabe Ind Co Ltd Connection structure of conductor
JPH09217039A (en) * 1996-02-08 1997-08-19 Toshiba Corp Inorganic adhesive, semiconductor device using the same and its production
JP2000323193A (en) * 1999-05-06 2000-11-24 Sony Corp Electronic part device
JP2001167852A (en) * 1999-12-07 2001-06-22 Tdk Corp Connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1975999A1 (en) 2007-03-30 2008-10-01 Fujitsu Limited Electronic device and method of manufacturing the same

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