JPS61166562U - - Google Patents
Info
- Publication number
- JPS61166562U JPS61166562U JP4811885U JP4811885U JPS61166562U JP S61166562 U JPS61166562 U JP S61166562U JP 4811885 U JP4811885 U JP 4811885U JP 4811885 U JP4811885 U JP 4811885U JP S61166562 U JPS61166562 U JP S61166562U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- copper foil
- semiconductor chip
- circuit board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図から第４図はこの考案の一実施例を示す
製造工程図、第５図ａ，ｂは従来例を示す工程図
である。 １１……プラスチツクフイルム、１１ａ……突
起、１２……銅箔、１３……半導体チツプ。
製造工程図、第５図ａ，ｂは従来例を示す工程図
である。 １１……プラスチツクフイルム、１１ａ……突
起、１２……銅箔、１３……半導体チツプ。
Claims (1)
- プラスチツクフイルムに突起を形成すると共に
、その上に銅箔を形成し、この銅箔の上に半導体
チツプを取付けたことを特徴とするフイルム回路
基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4811885U JPS61166562U (ja) | 1985-04-02 | 1985-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4811885U JPS61166562U (ja) | 1985-04-02 | 1985-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61166562U true JPS61166562U (ja) | 1986-10-16 |
Family
ID=30564067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4811885U Pending JPS61166562U (ja) | 1985-04-02 | 1985-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166562U (ja) |
-
1985
- 1985-04-02 JP JP4811885U patent/JPS61166562U/ja active Pending