JPS61165289A - Co2 laser beam processing machine - Google Patents

Co2 laser beam processing machine

Info

Publication number
JPS61165289A
JPS61165289A JP60005723A JP572385A JPS61165289A JP S61165289 A JPS61165289 A JP S61165289A JP 60005723 A JP60005723 A JP 60005723A JP 572385 A JP572385 A JP 572385A JP S61165289 A JPS61165289 A JP S61165289A
Authority
JP
Japan
Prior art keywords
cutting
laser beam
processing machine
laser
processing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60005723A
Other languages
Japanese (ja)
Inventor
Akiyasu Okazaki
岡崎 明泰
Michio Ichikawa
市川 三知男
Masao Kodera
小寺 正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60005723A priority Critical patent/JPS61165289A/en
Publication of JPS61165289A publication Critical patent/JPS61165289A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To obtain good cutting quality by placing a processing head for cutting of a combined CO2 laser beam processing machine to the final position on an optical path and placing an optical system for polarizing circularly the linearly polarized light just before said processing head. CONSTITUTION:The combined CO2 laser beam processing machine is so constituted that the linearly polarized beam 1 of the direction (a) outputted from a laser oscillator is polarized to the circularly polarized beam 4 by the optical system 3 for circular polarization on the optical path. The laser light 1 is reflected by a bent mirror 2 movable in the direction (b) perpendicular to the optical axis to process the work in the stage of a heat treatment such as hardening or welding. On the other hand, the mirror 2 is removed off the optical axis and the work is processed by reflecting the laser light 4 by a bent mirror 5 in the stage of cutting. The combined laser beam processing machine adequate for cutting is thus obtd.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はレーザ加工機に係り、特に、切断に好適な炭酸
ガスレーザ加工機に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser processing machine, and particularly to a carbon dioxide laser processing machine suitable for cutting.

〔発明の背景〕[Background of the invention]

従来の装置はレーザビームの偏光に対する考慮がなされ
ていなかった。そのため、金属の切断加工を行なう場合
に、切断の方向によって品質が異なり、良好な切断を行
なうことが難しかった。なお、この種の装置として関連
するものには例えば「機械と工具J 1984年4月号
、三ステーション式し−ザ加ニジステム等が挙げられる
Conventional devices do not take into consideration the polarization of the laser beam. Therefore, when cutting metal, the quality varies depending on the cutting direction, making it difficult to perform a good cut. Incidentally, related devices of this type include, for example, "Machine and Tools J, April 1984 issue, 3-station system".

〔発明の目的〕[Purpose of the invention]

本発明の目的は、良好な切断品質を得られる複合レーザ
加工機を提供することにある。
An object of the present invention is to provide a composite laser processing machine that can obtain good cutting quality.

〔発明の概要〕[Summary of the invention]

レーザビームが円偏光化されていないと、金属材料を切
断する場合に、切断の方向によってレーザ光の吸収率が
異なるため、切断品質が方向によってばらつく問題が生
じる。これは、切断の進行過程で、レーザ光の入射角が
90°近くになるため、ビームの偏光方向に対する吸収
率の差が大きくなるためである。しかし、焼入れや、溶
接などを行なう場合は、レーザ光の入射角は、はとんど
0°であるため、偏光方向に対する吸収率の差はほとん
ど生じない。従って、均質な切断を行なう場合は、レー
ザ光を円偏光化しなければならないが、切断以外の溶接
や、焼入れ時には、円偏光化しなくとも良い。むしろ、
直線偏光を円偏光化するための光学系でのパワーのロス
が加わるので、円偏光化せずにビームを照射した方が良
い。
If the laser beam is not circularly polarized, when cutting a metal material, the absorption rate of the laser beam differs depending on the cutting direction, resulting in a problem that the cutting quality varies depending on the direction. This is because the angle of incidence of the laser beam approaches 90° during the cutting process, and the difference in absorption rate with respect to the polarization direction of the beam increases. However, when hardening, welding, etc. are performed, the incident angle of the laser beam is almost 0°, so there is almost no difference in absorption rate with respect to the polarization direction. Therefore, when performing homogeneous cutting, the laser beam must be circularly polarized, but it is not necessary to circularly polarize the laser beam when welding other than cutting or during hardening. Rather,
Since power loss is added to the optical system for circularly polarizing linearly polarized light, it is better to irradiate the beam without circularly polarizing the light.

そこで、多目的加工を行なうレーザ加工機では、切断用
加工ヘッドを光路上の最後に置き、円偏光化のための光
学系をその直前に置くのが最も良い。
Therefore, in a laser processing machine that performs multi-purpose processing, it is best to place the cutting processing head at the end of the optical path, and the optical system for circularly polarizing light to be placed immediately before it.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第1図及び第2図により説明
する。第1図において、発振器から出力されたa方向の
直線偏光状態のレーザ光1は、光軸と直角なり方向に移
動可能なペンドミラー2で反射され、焼入れや、熱処理
に使用される。切断されたレーザ光4となり、ベンドミ
ラー5で反射されて、切断に使用される。全体の構成は
、第2図に示すように、ベンドミ”ラー2は、移動用の
レール6の上を、図示していない空気圧シリンダで移動
可能となっている。また、ペンドミラー2の下部には、
焼入れ用、又は溶接用の加工ヘッド7が、ベンドミラー
5の下部には、切断用の加工ヘッド8が取り付けられて
いる。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In FIG. 1, a laser beam 1 in a linearly polarized state in the a direction output from an oscillator is reflected by a pend mirror 2 movable in a direction perpendicular to the optical axis, and is used for hardening or heat treatment. The cut laser beam 4 is reflected by a bend mirror 5 and used for cutting. As shown in FIG. 2, the entire structure of the bend mirror 2 is movable on a moving rail 6 using a pneumatic cylinder (not shown). ,
A processing head 7 for hardening or welding is attached to the lower part of the bend mirror 5, and a processing head 8 for cutting is attached to the lower part of the bend mirror 5.

本発明によれば、切断に使用する場合のみ、レーザ光を
円偏光化し、良好な切断を行なうことができる。また、
切断以外の加工用途は、主に溶接と焼入れ等の熱処理で
あり、加工形状は、直線。
According to the present invention, laser light is circularly polarized only when used for cutting, and good cutting can be performed. Also,
Processing uses other than cutting are mainly heat treatment such as welding and hardening, and the processed shape is straight.

又は、円周形状程度である。従って、第3図に示すよう
に、被加工材料9をC方向に移動させる様な加工テーブ
ルを用いて、 直線又は円周上を溶接する場合に、加工の方向と直線偏
光の方向を一致させれば、円偏光で加工する場合よりも
、加工速度を速く、又は、溶は込みを深くすることがで
きる。第4図に示すように、溶接時の溶は込み深さdは
、(a)図の円偏光によるものよりも、(b)図の直線
偏光による方が、一般に30%程度深くなる。従って1
本発明によれば、直線偏光で溶接が効率良く行なえ、切
断は円偏光で高品質に行なうことができる。
Or, it has a circumferential shape. Therefore, as shown in Fig. 3, when welding in a straight line or on a circumference using a processing table that moves the workpiece material 9 in the C direction, it is necessary to make sure that the direction of processing and the direction of linearly polarized light match. If so, the processing speed can be faster or the melt penetration can be made deeper than when processing with circularly polarized light. As shown in FIG. 4, the penetration depth d during welding is generally about 30% deeper when using linearly polarized light as shown in FIG. 4(b) than when using circularly polarized light as shown in FIG.(a). Therefore 1
According to the present invention, welding can be performed efficiently using linearly polarized light, and cutting can be performed with high quality using circularly polarized light.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の一実施例の斜視図、第2図は本発明
の全体斜視図、第3図は加工状態の側面図、第4図は被
加工材料の断面図である。 1・・・直線偏光ビーム、3・・・円偏光化光学系、4
・・・円偏光ビーム、7・・・溶接又は焼入用加工ヘッ
ド、8・・・切断用加工ヘッド、9・・・被加工材料。 代理人 弁理士 高橋明−夫二− 小ノjレー、7.゛ 第 1 目
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of the entirety of the present invention, FIG. 3 is a side view of the processed state, and FIG. 4 is a sectional view of the material to be processed. 1...Linearly polarized beam, 3...Circularly polarized optical system, 4
. . . Circularly polarized beam, 7. Processing head for welding or hardening, 8. Processing head for cutting, 9. Material to be processed. Agent: Patent attorney Akira Takahashi - Yuji Kono J. Re, 7.゛1st item

Claims (1)

【特許請求の範囲】[Claims] 1、直線偏光ビーム出力の炭酸ガスレーザ発振器と、切
断用加工ヘッドと、切断用以外の加工ヘッドとより成る
炭酸ガスレーザ加工機において、前記切断用加工ヘッド
を光路上の最後の位置に置き、直線偏光を円偏光化する
光学系を前記切断用加工ヘッドの直前に置いたことを特
徴とする炭酸ガスレーザ加工機。
1. In a carbon dioxide laser processing machine consisting of a carbon dioxide laser oscillator that outputs a linearly polarized beam, a cutting processing head, and a processing head other than cutting, the cutting processing head is placed at the last position on the optical path, and the linearly polarized beam is A carbon dioxide laser processing machine, characterized in that an optical system for circularly polarizing the light is placed immediately before the cutting processing head.
JP60005723A 1985-01-18 1985-01-18 Co2 laser beam processing machine Pending JPS61165289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60005723A JPS61165289A (en) 1985-01-18 1985-01-18 Co2 laser beam processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60005723A JPS61165289A (en) 1985-01-18 1985-01-18 Co2 laser beam processing machine

Publications (1)

Publication Number Publication Date
JPS61165289A true JPS61165289A (en) 1986-07-25

Family

ID=11619036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60005723A Pending JPS61165289A (en) 1985-01-18 1985-01-18 Co2 laser beam processing machine

Country Status (1)

Country Link
JP (1) JPS61165289A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0457024A2 (en) * 1990-05-14 1991-11-21 Daimler-Benz Aerospace Aktiengesellschaft Measure of laser-power
JP2007313511A (en) * 2006-05-23 2007-12-06 Nippon Steel Corp Method and apparatus of joining metallic sheet materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0457024A2 (en) * 1990-05-14 1991-11-21 Daimler-Benz Aerospace Aktiengesellschaft Measure of laser-power
JP2007313511A (en) * 2006-05-23 2007-12-06 Nippon Steel Corp Method and apparatus of joining metallic sheet materials

Similar Documents

Publication Publication Date Title
US4380694A (en) Laser cutting apparatus
US6410882B1 (en) Laser welding method
TW200518867A (en) Laser processing apparatus
CN112114434B (en) Optical device
Olsen Investigations in Optimizing the Laser Cutting Process.(Retroactive Coverage)
ES2050467T3 (en) DEVELOPING TOOL WITH SWINGING BLADE.
JPS59212185A (en) Laser working device
ATE460248T1 (en) ARRANGEMENT FOR LASER PROCESSING, IN PARTICULAR FOR LASER WELDING OF 3D COMPONENTS, WITH A FIRST OPTICAL ELEMENT FOR SPLITTING A LASER BEAM AND A SECOND OPTICAL ELEMENT FOR FOCUSING THE PARTIAL BEAMS
JPS61165289A (en) Co2 laser beam processing machine
DE3464303D1 (en) Laser device for material processing
JP6065518B2 (en) Cutting tool manufacturing method and manufacturing apparatus
JP2688547B2 (en) Device for recovering energy of laser beam and method of using the device
JP2000176669A (en) Laser beam cutting device
JP3397312B2 (en) Laser beam synthesizer and laser processing system
JP2001347387A (en) Laser beam machining head
JPS63194887A (en) Head for laser beam machine
JPS63299881A (en) Condensing apparatus for laser beam
JPS61262479A (en) Laser cutting method and its device
JPS56163088A (en) Butt-welding method of steel plate and its equipment
JPS60213384A (en) Laser cutting method
JPS63317270A (en) Laser beam machine
TW202216326A (en) Underwater cutting machine with function of tilted angle cutting
CN115832827A (en) Laser reflection device and laser
JPH06339783A (en) Method and device for inclined cutting laser machining of metal plate
JPS6316891A (en) Laser beam machine