JP3546170B2 - Laser beam oscillation structure and cutting device with laser beam oscillator - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a laser beam oscillating structure and a cutting device with a laser beam oscillator, and particularly to a cutting device for building wood processing, and particularly to a cutting ink provided in various directions and angles on a cut portion in a processing step. Laser beam oscillating structure that can perform cutting work accurately and quickly and safely by aligning and setting the beam line of the device, and can always show the cutting position and direction, enabling smooth cutting work The present invention relates to a cutting device with a laser beam oscillator. It can be used in the technical field of cutting equipment for various steel materials and plastics, including the construction field of sawing wood.
[0002]
[Prior art]
When cutting wood, etc. with a conventional wood processing sawing device, set the direction and angle of the saw blade, and then directly apply the saw blade to the cutting ink attached to the part to be cut and position it. Was cutting. Although there were sawing machines and cutting machines equipped with a dimension positioning device that adjusts the laser beam to the cutting dimension line, the beam was projected only in a point shape, making it difficult to set various cutting directions and cutting angles for the saw blade. was there.
[0003]
[Problems to be solved by the invention]
The problem with these methods is that the beam to be cut is generally applied only to the point to be cut. In other words, conventional cutting devices require a lot of advanced technology and time and effort to perform cutting work accurately and quickly and safely along cutting ink in various directions and angles attached by craftsmen. There was a lot of cutting failure and waste.
[0004]
An object of the present invention is to solve the above-mentioned problem, by allowing a cutting progress line of a saw blade to be projected onto a portion to be cut by a linear beam, so that a saw blade is attached to the cutting portion. An object of the present invention is to provide a laser beam oscillation structure and a cutting device with a laser beam oscillator that can cut accurately, are safe in operation, and can easily set the direction and angle of the cutting device.
[0005]
[Means for Solving the Problems]
The invention claimed in the present application to achieve the above object is as follows.
(1) A laser beam oscillator for oscillating a laser beam, and a lot lens provided ahead of the laser beam and capable of converting the oscillated laser beam into a linear beam for cutting an object to be cut. A laser beam oscillating structure that can be used for cutting positioning of an object to be cut in the cutting device , wherein the laser beam oscillating structure is configured to directly irradiate a thickness surface of the saw blade of the cutting device. The saw blade is fixed to an upper safety hood or a fixing device, and is configured to irradiate a linear beam having a thickness greater than the thickness of the saw blade in a thickness plane direction of the saw blade. A laser beam oscillating structure characterized by being configured to irradiate a linear beam parallel to a side surface .
[0006]
(2) A cutting device with a laser beam oscillator, comprising: a saw blade for cutting an object to be cut; and a laser beam oscillator for irradiating the object with a laser beam used for cutting positioning. A laser beam oscillating structure is provided in front of the oscillator with a lot lens capable of converting the oscillated beam into a linear beam , and the laser beam oscillating structure has a thickness of a saw blade of the cutting device. The surface of the saw blade is fixed to a safety hood or a fixture above the saw blade so as to irradiate the surface directly, and a linear beam thicker than the thickness of the saw blade is irradiated in the thickness direction of the saw blade. A cutting device with a laser beam oscillator, wherein the cutting device is configured to irradiate a linear beam parallel to the side surface of the saw blade .
[0007]
(3) The cutting device with a laser beam oscillator according to (2), wherein the laser beam oscillation structure is provided directly above a thickness plane of the saw blade .
[0008]
(4) A cutting device with a laser beam oscillator, comprising: a saw blade for cutting an object to be cut; and a laser beam oscillator for irradiating the object with a laser beam used for cutting positioning. A laser beam oscillating structure is provided at the end of the oscillator, which is provided with a lot lens capable of converting the oscillated beam into a linear beam, and the laser beam oscillating structure has a thickness of a saw blade of the cutting device. The laser beam oscillating structure is fixed to a safety hood or fixture directly above the saw blade so that the surface can be directly illuminated, and the laser beam oscillation structure applies a linear beam thicker than the saw blade to the saw blade. It is configured to be capable of irradiating in the thickness plane direction, and is configured to be capable of irradiating a linear beam parallel to the side surface of the saw blade. To the surface direction When irradiating a linear beam thicker than the thickness of the saw blade, the linear beam is blocked by the saw blade, so that an interval between the saw blades is two on the workpiece. A cutting device with a laser beam oscillator, which is capable of projecting a line.
[0009]
In other words, in the present invention, as a means for obtaining a linear beam, a round lot lens is set at the tip of the laser beam emitted from the laser oscillator, so that the beam is perpendicular to the long axis of the lens when the beam passes through the lens. Utilizing the fact that a linear beam in each direction is obtained.
[0010]
The cutting device with a laser beam oscillator according to the present invention is a laser irradiation type cutting device that solves the problems of the conventional cutting device by utilizing such features of a laser beam and a lot lens. As shown in the drawing, a laser beam oscillator and a lot lens for converting a beam emitted from the laser beam oscillator into a linear beam are provided above or directly above the portion to be cut with the saw blade interposed therebetween. This configuration allows the width of the linear beam to be adjusted by adjusting the diameter of the emitted beam.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings by using an example of a tabletop circular saw with a saw blade positioning device using a linear beam for wood processing.
[0012]
FIG. 1 is an explanatory diagram showing the configuration of the laser beam oscillation structure of the present invention.
The present laser beam oscillation structure includes a laser beam oscillator (red laser oscillator) 1 and a lot lens 2 provided ahead of the laser beam oscillator and capable of converting an oscillated beam 3 into a linear beam 4. The laser beam 3 emitted from the laser beam oscillator 1 becomes a linear beam 4 as shown in the figure while passing through the lot lens 2, making the diameter of the beam 3 larger than the thickness of the saw blade and parallel to the side surface of the saw blade. By irradiating from above, the irradiated linear beam 4 is cut in half by the saw blade 6 of a circular saw, and becomes two lines 5 and 5 ′. To be cut.
[0013]
The lines projected as the two parallel lines 5, 5 'on the object 7 to be cut are matched with the cutting ink. In addition, the width of the two lines and the width of the line are exactly the cutting margin of the saw blade.
[0014]
FIG. 2 is a side view showing a configuration of a woodworking cutting device (table top saw) according to an embodiment of the cutting device with a laser beam oscillator of the present invention. Also,
Figure 3 is a likewise a front view thereof. In these figures, the main body of the cutting device itself is a configuration of a tabletop circular saw often used by carpenters and craftsmen, 6 is a saw blade, 10 is a base of a tabletop circular saw, and 8 is a rotating saw. A hood 7 for securing safety from the blade, and 7 is a timber that is an object to be cut. As shown in the figure, when the laser oscillator 1 and the lot lens 2 are fixed to a hood 8 or a fixture directly above a saw blade 6 of a tabletop circular saw, and a laser beam is applied to a square bar 7 of a workpiece, the saw blade Regardless of the angle or direction of 6, it is possible to cut in the direction of the line projected by the beam.
[0015]
Since the cutting device with a laser beam oscillator of the present invention has the above-described characteristics, when it is used for wood processing, a linear laser beam 4 is applied to a cutting ink applied to a square bar 7 to be cut. By adjusting the saw blade 6 so as to match the lines 5 and 5 'projected on the square bar 7, the tabletop circular saw can process the square bar 7 according to the cut ink applied without any deviation.
[0016]
As described above, in the method of combining the laser oscillator 1 and the lot lens 2 with the saw blade 6 and irradiating the linear beam 4, any material can be used for the object 7 to be cut, and various steel materials, plastics and the like can be used. It can also be used in the technical field of cutting equipment. Needless to say, it can be used with saws other than round saws.
[0017]
【The invention's effect】
As described above in detail, according to the laser beam oscillation structure and the cutting device with a laser beam oscillator of the present invention, even when cutting various materials, the line of the laser beam irradiated to the marking such as blacking Can be adjusted and cut, so that the fine adjustment of the saw blade is easy, the work can be performed accurately and quickly, and the workability can be improved. Also, beam rays are projected onto the workpiece during work, which allows the worker to be more careful not to place his or her hand or finger on the tip of the saw blade, thus improving safety and improving professionalism. The work becomes easy for beginners.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a configuration of a laser beam oscillation structure of the present invention.
FIG. 2 is a side view of a wood processing and cutting apparatus according to an embodiment of the present invention.
FIG. 3 is a front view of a wood processing and cutting apparatus according to an embodiment of the present invention.
[Explanation of symbols]
1 laser beam oscillator (red laser oscillator)
2 Lot lens 3 Laser beam emitted from an oscillator 4 Linear beam 5, 5 'after passing through a lot lens Beam beam projected on square material of material to be sawed 6 Saw blade 7 Square material 8 Safety hood 9 of round saw 9 Round Saw rotation axis 10 Desktop round saw base

Claims (4)

A cutting device for cutting a workpiece, comprising a laser beam oscillator for oscillating a laser beam, and a lot lens provided ahead of the laser beam and capable of converting the oscillated laser beam into a linear beam. A laser beam oscillating structure that can be used for cutting positioning of an object to be cut , wherein the laser beam oscillating structure is capable of directly irradiating the thickness surface of the saw blade of the cutting device so that the safety surface above the saw blade can be directly irradiated. The saw blade is fixed to a hood or a fixture, and is configured to irradiate a linear beam thicker than the thickness of the saw blade in the thickness direction of the saw blade, and is parallel to the side surface of the saw blade. A laser beam oscillating structure characterized by being configured to irradiate a simple linear beam . A cutting device with a laser beam oscillator, comprising: a saw blade for cutting an object to be cut; and a laser beam oscillator for irradiating the object with a laser beam used for cutting positioning. In addition, a lot lens capable of converting the oscillated beam into a linear beam is provided to constitute a laser beam oscillation structure, and the laser beam oscillation structure reduces a thickness surface of a saw blade of the cutting device. It is provided fixed to a safety hood or a fixture above the saw blade so that it can be directly irradiated, and a linear beam thicker than the thickness of the saw blade can be irradiated in the thickness plane direction of the saw blade. And a laser beam oscillator-equipped cutting device configured to irradiate a linear beam parallel to the side surface of the saw blade . The cutting device with a laser beam oscillator according to claim 2, wherein the laser beam oscillation structure is provided directly above a thickness surface of the saw blade . A cutting device with a laser beam oscillator, comprising: a saw blade for cutting an object to be cut; and a laser beam oscillator for irradiating the object with a laser beam used for cutting positioning. The laser beam oscillating structure is provided by providing a lot lens capable of converting the oscillated beam into a linear beam, and the laser beam oscillating structure directly contacts the thickness surface of the saw blade of the cutting device. The laser beam oscillating structure is fixed to the safety hood or fixture directly above the saw blade so as to be able to irradiate, and the laser beam oscillating structure applies a linear beam thicker than the thickness of the saw blade to the thickness plane of the saw blade. It is configured to be able to irradiate in a direction, and is configured to be able to irradiate a linear beam parallel to the side surface of the saw blade. For the saw blade When a linear beam that is thicker than the thickness is applied, the linear beam is blocked by the saw blade, so that two lines whose interval is the cutting allowance of the saw blade are projected on the workpiece. A cutting device with a laser beam oscillator.

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