JPS61163923A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS61163923A JPS61163923A JP443285A JP443285A JPS61163923A JP S61163923 A JPS61163923 A JP S61163923A JP 443285 A JP443285 A JP 443285A JP 443285 A JP443285 A JP 443285A JP S61163923 A JPS61163923 A JP S61163923A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- ion exchanger
- inorganic ion
- coupling agent
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- 229910001410 inorganic ion Inorganic materials 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 10
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 3
- 229910052723 transition metal Inorganic materials 0.000 claims description 5
- 150000003624 transition metals Chemical class 0.000 claims description 5
- 238000010298 pulverizing process Methods 0.000 claims description 2
- 238000005342 ion exchange Methods 0.000 abstract description 9
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052787 antimony Inorganic materials 0.000 abstract description 2
- 229910052797 bismuth Inorganic materials 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000003063 flame retardant Substances 0.000 abstract description 2
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004898 kneading Methods 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000001993 wax Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 9
- -1 chlorine ions Chemical class 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000035939 shock Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000003456 ion exchange resin Substances 0.000 description 4
- 229920003303 ion-exchange polymer Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP443285A JPS61163923A (ja) | 1985-01-14 | 1985-01-14 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP443285A JPS61163923A (ja) | 1985-01-14 | 1985-01-14 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163923A true JPS61163923A (ja) | 1986-07-24 |
| JPS6337126B2 JPS6337126B2 (enrdf_load_html_response) | 1988-07-22 |
Family
ID=11584081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP443285A Granted JPS61163923A (ja) | 1985-01-14 | 1985-01-14 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163923A (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4716184A (en) * | 1986-03-14 | 1987-12-29 | Matsushita Electric Works, Ltd. | Epoxy resin encapsulating composition with enhanced moisture resistance and method for producing the same |
| WO1997033932A1 (fr) * | 1996-03-15 | 1997-09-18 | Sony Chemicals Corporation | Composition de resine epoxy et support d'enregistrement d'information optique realise au moyen de cette composition |
| US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| US7569808B2 (en) | 2005-10-31 | 2009-08-04 | Ricoh Company, Ltd. | Rotary encoder, belt conveyance apparatus, and image forming apparatus |
-
1985
- 1985-01-14 JP JP443285A patent/JPS61163923A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4716184A (en) * | 1986-03-14 | 1987-12-29 | Matsushita Electric Works, Ltd. | Epoxy resin encapsulating composition with enhanced moisture resistance and method for producing the same |
| US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| WO1997033932A1 (fr) * | 1996-03-15 | 1997-09-18 | Sony Chemicals Corporation | Composition de resine epoxy et support d'enregistrement d'information optique realise au moyen de cette composition |
| US6121339A (en) * | 1996-03-15 | 2000-09-19 | Sony Chemicals Corporation | Cationically polymerizable epoxy resins and optical information recording medium made therefrom |
| US6447867B1 (en) | 1996-03-15 | 2002-09-10 | Sony Chemicals Corporation | Epoxy resin composition and optical information recording medium using the same |
| CN1092680C (zh) * | 1996-03-15 | 2002-10-16 | 索尼化学株式会社 | 环氧树脂组合物和使用这种组合物的光信息记录介质 |
| US7569808B2 (en) | 2005-10-31 | 2009-08-04 | Ricoh Company, Ltd. | Rotary encoder, belt conveyance apparatus, and image forming apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6337126B2 (enrdf_load_html_response) | 1988-07-22 |
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