JPS6116263U - polishing equipment - Google Patents
polishing equipmentInfo
- Publication number
- JPS6116263U JPS6116263U JP1984099057U JP9905784U JPS6116263U JP S6116263 U JPS6116263 U JP S6116263U JP 1984099057 U JP1984099057 U JP 1984099057U JP 9905784 U JP9905784 U JP 9905784U JP S6116263 U JPS6116263 U JP S6116263U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- disk
- polished
- polishing equipment
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａおよびｂは本考案の一実施例を示す平面図と側
断面図、第２図ａおよびｂは従来の研磨装置を説明する
ための平面図並びに側断面図である。
図中、１は円盤、２は軸、３は被研磨物、４は研磨剤、
５はノズル、６はリング、７は固定アーム、．８はロー
ラ、９はアーム固定ネジ、１０は研磨部材、１１は支持
円盤、１２は貫通孔、１３は限定された研磨コース、１
４は拡大された研磨コース、をそれぞれ示す。1A and 1B are a plan view and a sectional side view showing an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a sectional side view illustrating a conventional polishing apparatus. In the figure, 1 is a disk, 2 is a shaft, 3 is an object to be polished, 4 is an abrasive,
5 is a nozzle, 6 is a ring, 7 is a fixed arm, . 8 is a roller, 9 is an arm fixing screw, 10 is a polishing member, 11 is a support disk, 12 is a through hole, 13 is a limited polishing course, 1
4 indicates an enlarged polishing course.
Claims (1)
を行う研磨装置であって、前記回動する円盤上に所定位
置で自転運動を行うリングを設置し、さらに陪リング中
で前記回動円盤面に接して自転する支持円盤を付設し、
該支持円盤の中心部を除いｉコ部分に複数の貫通孔を設
け、該貫通孔中に前記被研磨物を取着した研磨部材を回
転自在に挿入して研磨を行うよう構成されてなることを
特徴とする研磨装置。A polishing device that brings the object to be polished into contact with a rotating disk and performs polishing using an abrasive agent. A supporting disk that rotates in contact with the moving disk surface is attached,
A plurality of through holes are provided in the I part of the support disk except for the center part, and the polishing member having the object to be polished is rotatably inserted into the through holes to perform polishing. A polishing device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984099057U JPS6116263U (en) | 1984-06-29 | 1984-06-29 | polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984099057U JPS6116263U (en) | 1984-06-29 | 1984-06-29 | polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6116263U true JPS6116263U (en) | 1986-01-30 |
Family
ID=30658573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984099057U Pending JPS6116263U (en) | 1984-06-29 | 1984-06-29 | polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116263U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100339412B1 (en) * | 1999-07-05 | 2002-05-31 | 박종섭 | device for grinding of semiconductor wafer |
-
1984
- 1984-06-29 JP JP1984099057U patent/JPS6116263U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100339412B1 (en) * | 1999-07-05 | 2002-05-31 | 박종섭 | device for grinding of semiconductor wafer |
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