JPS61158192A - Flexible circuit board with temperature sensor - Google Patents

Flexible circuit board with temperature sensor

Info

Publication number
JPS61158192A
JPS61158192A JP27667084A JP27667084A JPS61158192A JP S61158192 A JPS61158192 A JP S61158192A JP 27667084 A JP27667084 A JP 27667084A JP 27667084 A JP27667084 A JP 27667084A JP S61158192 A JPS61158192 A JP S61158192A
Authority
JP
Japan
Prior art keywords
thermistor
temperature sensor
temperature
circuit board
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27667084A
Other languages
Japanese (ja)
Inventor
和夫 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP27667084A priority Critical patent/JPS61158192A/en
Publication of JPS61158192A publication Critical patent/JPS61158192A/en
Pending legal-status Critical Current

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  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 「産業上の利用分針」 本発明は、セラミックシート製ベース部材にサーミスタ
を設けて全体を任意形状の薄型に構成可能な温度センサ
を備えた可撓性回路基板に関する。
DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Minute Hand" The present invention relates to a flexible circuit board equipped with a temperature sensor that can be configured to have an arbitrary shape and a thin shape by providing a thermistor on a base member made of a ceramic sheet.

「従来の技術」 温度測定に使用される従来の温度センサは、感温センサ
部を金属製ケースに収容し、該ケースを被測定体に接触
させた。状態で温度測定に供されるような形態のものが
ある。このような構造の感温センナ部は、所謂負性抵抗
特性を有するサーミースタで構成され、被測定体の種類
に応じてその感温特性を種々のものに調定することが容
易であって、被測定体の温度変化を高精度に検知するよ
うな用途に広く採用されている。
"Prior Art" In a conventional temperature sensor used for temperature measurement, a temperature-sensitive sensor section is housed in a metal case, and the case is brought into contact with an object to be measured. There is a type that can be used for temperature measurement in a state. The temperature sensing sensor section having such a structure is composed of a thermistor having so-called negative resistance characteristics, and its temperature sensing characteristics can be easily adjusted to various values depending on the type of object to be measured. It is widely used in applications such as detecting temperature changes in a measured object with high precision.

「発明が解決しようとする問題点」 斯かる構造の温度センサは、その感温センサ部を金属製
ケースに収容して構成されているので、感温センサ部は
被測定体の温度を間接的に検知する状態となり、・従っ
て、検知応答特性の悪化或いは検知温度の脈動などの不
都合があった。また、金属製ケース封入型の構造である
為、外形形状は一般的に大きなものとなり、狭い個所の
肢測定体部分における装着性ないしは利用度は相肖な制
約を受けるという問題もあった。
"Problems to be Solved by the Invention" A temperature sensor with such a structure is constructed by housing the temperature sensor section in a metal case, so the temperature sensor section can indirectly measure the temperature of the object to be measured. Therefore, there were problems such as deterioration of the detection response characteristics or pulsation of the detected temperature. Furthermore, since the structure is enclosed in a metal case, the external shape is generally large, and there is also the problem that the fit or usability of the device in a narrow area of the limb measurement body is subject to corresponding restrictions.

「問題点を解決するための手段」 本発明は、この種のサーミスタの本来的な特性を最大限
に発揮させ得るように小型薄型に構成し、例えば狭い個
所での被測定体にも直接的に接触させて検知動作を好適
に行なわせることの可能な温度センサを備えた可撓性回
路基板を提供することを目的とするもので、その為に、
本発明によれば、セラミックペーパないしはセラミック
シートからなる可撓性ベース部材上にサーミスタを任意
の形状で印刷、焼成して形成し、該サーミスタに接続す
べきリード用導体パターンをもベース部材に適宜蒸着形
成するように構成したものである。
"Means for Solving the Problems" The present invention is designed to be small and thin so that the inherent characteristics of this type of thermistor can be maximized, and it can be used directly on the object to be measured in a narrow place, for example. The purpose of the present invention is to provide a flexible circuit board equipped with a temperature sensor that can be brought into contact with a temperature sensor to suitably perform a detection operation, and for that purpose,
According to the present invention, a thermistor is printed and fired in an arbitrary shape on a flexible base member made of ceramic paper or a ceramic sheet, and a conductor pattern for a lead to be connected to the thermistor is also appropriately attached to the base member. It is configured to be formed by vapor deposition.

斯かる構造の温度センサを備えた可撓性回路基板は、可
撓性ベース部材自体が十分な耐熱性を具備することと相
俟って、直接接触型として全体を温度検知動作に最適な
任意形状に構成可能であり、特には、小型薄型化を達成
する上で大きな有利性をもつ。また、被測定体が回転体
であるような場合の温度検知用途には、サーミスタ面上
に耐摩耗性に富むガラス材等を被着させる構成も採用可
能である。
A flexible circuit board equipped with a temperature sensor having such a structure is a direct contact type, and the flexible base member itself has sufficient heat resistance. It can be configured in any shape, and is particularly advantageous in achieving miniaturization and thinning. Furthermore, for temperature detection applications where the object to be measured is a rotating body, a configuration in which a glass material or the like having high abrasion resistance is coated on the thermistor surface can also be adopted.

「実 施 例」 第1図及び第2図は、本発明の一実施例に基づく温度セ
ンサを備えた可撓性回路基板の概念的な要部平面構成図
及び要部断面構成図を示し、両図において、1はベース
部材、2はサーミスタ、3はサーミスタ2に対するリー
ド用導体パターン、そして、4は被回転測定体等の温度
を接触状態で直接的に検知するような用途の場合に設は
得るサーミスタ2上の例えばガラス材を示す。ベース部
材1は、セラミックペーパないしはセラミックシート等
の可撓性であって耐熱性に富む部材を適用し、斯かるベ
ース部材1上には印刷、焼成手段によって一適宜形状の
サーミスタ2を形成するものである。このサーミスタ2
は、所謂半導体サーミスタの一種に属するような素材に
適当なバインダ等を混入して被測定体の温度検知に最適
な温度特性並びに耐熱6機械的特性を具備するように構
成され得るものであり、特には、微細かつ薄型に形成す
ることも可能なものである。斯かるサーミスタ2の検知
作用を出力させる為のリード用導体パターン3は、銅又
はニッケル等の導体素材をベース部材1に蒸着手段で形
成し、好ましくは耐食性等耐環境性を施すようにするの
が望ましいが、この導体パターン3を耐食性の良好な素
材で・直接的に蒸着形成する場合には、その限りではな
い。
"Example" FIG. 1 and FIG. 2 show a conceptual plan view and a cross-sectional view of the main part of a flexible circuit board equipped with a temperature sensor according to an example of the present invention, In both figures, 1 is a base member, 2 is a thermistor, 3 is a lead conductor pattern for the thermistor 2, and 4 is a part designed for applications where the temperature of a rotating object to be measured, etc. is directly detected in a contact state. indicates, for example, a glass material on the thermistor 2 to be obtained. The base member 1 is made of a flexible and heat-resistant member such as ceramic paper or a ceramic sheet, and a thermistor 2 of an appropriate shape is formed on the base member 1 by printing and firing means. It is. This thermistor 2
can be constructed by mixing a suitable binder etc. into a material belonging to a type of so-called semiconductor thermistor so as to have temperature characteristics and heat resistance 6 mechanical characteristics optimal for detecting the temperature of the object to be measured. In particular, it is possible to form it finely and thinly. The lead conductor pattern 3 for outputting the detection action of the thermistor 2 is formed by depositing a conductive material such as copper or nickel on the base member 1, and preferably has environmental resistance such as corrosion resistance. However, this is not the case if the conductor pattern 3 is formed of a material with good corrosion resistance by direct vapor deposition.

このような構造のものは、サーミスタ2の部分を被測定
体に直接的に接触させて温度検知動作に供されるもので
あり、その小型化。
Such a structure is used for temperature sensing operation by bringing the thermistor 2 into direct contact with the object to be measured, and is miniaturized.

薄型化と相俟って温度検知のハイレスポンスビリティを
具現化できるのが大きな特徴である。一方、サーミスタ
2の面上にガラス材4等の耐摩耗性部材を備えるような
構造のものでは、例えば各種の加熱ローラ等に接触状態
で安定連続的に温度検知動作を行なえること、また、全
体が可撓性を具備する都合上、狭い錯雑なスペース内に
おいても温度測定の為の好適な組込み実装を容易化する
等の利点があるO 「発明の効果」 以上の説明から明らかな如く、本発明に係る温度センナ
を備えた可撓性回路基板は、耐熱性に富む可撓性ベース
部材上にサーミスタを適宜印刷、焼成し、このサーミス
タに対するリード用導体パターンをも蒸着形成すべく構
成したものであるので、被測定体に対する直接接触型温
度検知手段として各種分野の温度センサに広く適用でき
るという利点がある。
The main feature is that it is possible to achieve high responsiveness in temperature detection along with the thinness. On the other hand, if the thermistor 2 has a structure in which a wear-resistant member such as a glass material 4 is provided on the surface of the thermistor 2, it is possible to stably and continuously perform temperature detection operation while in contact with various heating rollers, etc. Since the entire structure is flexible, it has the advantage of facilitating suitable installation for temperature measurement even in narrow and complicated spaces. ``Effects of the Invention'' As is clear from the above explanation, A flexible circuit board equipped with a temperature sensor according to the present invention is constructed by appropriately printing and firing a thermistor on a highly heat-resistant flexible base member, and also forming a lead conductor pattern for the thermistor by vapor deposition. Therefore, it has the advantage that it can be widely applied to temperature sensors in various fields as a direct contact type temperature detection means for a measured object.

また、全体は可及的に小型薄型に構成することが容易で
あり、かつ、その可撓性と相俟って狭隘スペースでの温
度検知素子として高い組込み実装性を備えるという有利
性を備え、現今の各種機器等でのコンパクトな高精度温
度検出手段として最適な構造を有する。
In addition, the entire device can be easily configured to be as small and thin as possible, and combined with its flexibility, it has the advantage of being highly easy to mount as a temperature sensing element in a narrow space. It has an optimal structure as a compact, high-precision temperature detection means for various modern devices.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の一実施例に従って構成された温度セ
ンサを備えた可撓性回路基板の概念的な要部平面構成図
、そして、 第2図は、サーミスタ面に耐摩耗性処理を施すように構
成した場合の同様な要部断面構成図である。 1 :  耐熱性ベース部材 2 : サーミスタ 3  :   リード用導体パターン 4   :    ガ  ラ  ス  材量願人  日
本メクトロン株式会社 7#、1図 第2図
FIG. 1 is a conceptual plan view of essential parts of a flexible circuit board equipped with a temperature sensor configured according to an embodiment of the present invention, and FIG. 2 shows a thermistor surface subjected to wear-resistant treatment. FIG. 3 is a similar cross-sectional configuration diagram of a main part in a case where it is configured to be applied. 1: Heat-resistant base member 2: Thermistor 3: Lead conductor pattern 4: Glass Material quantity requester: Nippon Mectron Co., Ltd. 7#, 1 Figure 2

Claims (1)

【特許請求の範囲】 セラミックシートからなるベース部材上に 印刷、焼成して形成されたサーミスタを備え、該サーミ
スタに対するリード用導体パターンを蒸着形成するよう
に構成したことを特徴とする温度センサを備えた可撓性
回路基板。
[Scope of Claims] A temperature sensor comprising a thermistor formed by printing and firing on a base member made of a ceramic sheet, and a conductor pattern for a lead for the thermistor is formed by vapor deposition. flexible circuit board.
JP27667084A 1984-12-29 1984-12-29 Flexible circuit board with temperature sensor Pending JPS61158192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27667084A JPS61158192A (en) 1984-12-29 1984-12-29 Flexible circuit board with temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27667084A JPS61158192A (en) 1984-12-29 1984-12-29 Flexible circuit board with temperature sensor

Publications (1)

Publication Number Publication Date
JPS61158192A true JPS61158192A (en) 1986-07-17

Family

ID=17572677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27667084A Pending JPS61158192A (en) 1984-12-29 1984-12-29 Flexible circuit board with temperature sensor

Country Status (1)

Country Link
JP (1) JPS61158192A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110051778A1 (en) * 2008-02-19 2011-03-03 Epcos Ag Composite Material for Temperature Measurement, Temperature Sensor Comprising the Composite Material, and Method for Producing the Composite Material and the Temperature Sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110051778A1 (en) * 2008-02-19 2011-03-03 Epcos Ag Composite Material for Temperature Measurement, Temperature Sensor Comprising the Composite Material, and Method for Producing the Composite Material and the Temperature Sensor
US9341521B2 (en) * 2008-02-19 2016-05-17 Epcos Ag Composite material for temperature measurement, temperature sensor comprising the composite material, and method for producing the composite material and the temperature sensor

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