JPH0650822A - Contact type thermistor - Google Patents

Contact type thermistor

Info

Publication number
JPH0650822A
JPH0650822A JP4204736A JP20473692A JPH0650822A JP H0650822 A JPH0650822 A JP H0650822A JP 4204736 A JP4204736 A JP 4204736A JP 20473692 A JP20473692 A JP 20473692A JP H0650822 A JPH0650822 A JP H0650822A
Authority
JP
Japan
Prior art keywords
recess
heat
temperature
contact type
thermistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4204736A
Other languages
Japanese (ja)
Inventor
Takeshi Nagai
彪 長井
Katsumi Sasada
勝視 佐々田
Sadao Nakagawa
貞雄 中川
Shuji Ito
修治 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4204736A priority Critical patent/JPH0650822A/en
Publication of JPH0650822A publication Critical patent/JPH0650822A/en
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Non-Adjustable Resistors (AREA)
  • Thermistors And Varistors (AREA)

Abstract

PURPOSE:To provide a contact type thermistor having high resistance to heat and high-speed response by constructing it of a plate-shaped metal support having a recess in the central part and of a temperature detector disposed in the recession. CONSTITUTION:A recess 61 is provided in the central part of a plate-shaped metal support 6 and a temperature detector 7 is disposed in this recess 61. A stainless steel plate is used for the support 6. The detector 7 is constructed by disposing a thin film thermistor element 71 on an alumina support 72 and then by covering the periphery of the element with glass 73. The element 71 is constructed by forming an electrode film and a temperature-sensitive resistor film on the surface of an alumina substrate and lead wires 74 and 74' are led out of the electrode film. No organic substance such as resin is used in this constitution and, therefore, resistance to heat of 200 deg. or above is obtained. When a thermistor 6 thus constructed is brought into contact with an object, a heat flow occurs in a concentrated manner through the recess 61 of a small area and, therefore, heat response is high. The heat response of still higher speed is obtained by disposing a heat sinker between the inner surface of the recess 61 and the outer surface of the support 72.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は対象物表面と機械的に接
触して、その表面温度を検出できる表面温度センサに関
するものであって、200℃以上の高温度まで使用でき
る接触型薄膜サーミスタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface temperature sensor capable of detecting the surface temperature of an object by mechanically contacting the surface of the object, and more particularly to a contact type thin film thermistor which can be used at a high temperature of 200 ° C. or higher. It is a thing.

【0002】[0002]

【従来の技術】従来、この種の表面温度センサは、図3
に示すように、硝子封止型サーミスタ1から成る温度検
知素子にリード線2、2′を接続し、前記硝子封止型サ
ーミスタ1を金属板3に樹脂4で接着して構成される。
前記金属板3を対象物の表面にビス止めなどにより機械
的に接触させて、その表面温度を検出していた。なお、
金属板3は、通常、被測温体への取り付け穴5などを有
している。(例えば、特開昭60−1255345号公
報、特開昭60−125535号公報)
2. Description of the Related Art Conventionally, a surface temperature sensor of this type is shown in FIG.
As shown in FIG. 2, the temperature detection element composed of the glass-sealed thermistor 1 is connected to the lead wires 2 and 2 ′, and the glass-sealed thermistor 1 is bonded to the metal plate 3 with the resin 4.
The metal plate 3 is mechanically brought into contact with the surface of the object by screwing or the like to detect the surface temperature. In addition,
The metal plate 3 usually has a mounting hole 5 or the like to the temperature-measured body. (For example, JP-A-60-1255345 and JP-A-60-125535)

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記の
ような構成では、硝子封止型サーミスタ1が金属板3に
樹脂4で接着されており、樹脂4の耐熱温度は通常、約
200℃以下であるので、最高使用温度も約200℃以
下に制限されるという問題があった。
However, in the above configuration, the glass-sealed thermistor 1 is bonded to the metal plate 3 with the resin 4, and the heat resistant temperature of the resin 4 is usually about 200 ° C. or less. Therefore, there is a problem that the maximum operating temperature is limited to about 200 ° C. or less.

【0004】また、金属板3は、被測温体への取り付け
穴5などを有し、また、硝子封止型サーミスタ1のリー
ド線2、2′の一部もまた樹脂4で接着されるので、温
度測定に必要な最小の面積(硝子封止型サーミスタ1の
接着された面積のみ)以上の面積を必要とした。このた
め、温度検出器の熱容量が必要以上に大きくなり、熱応
答性が遅くなるという問題もあった。
Further, the metal plate 3 has a mounting hole 5 for mounting a temperature measuring object, etc., and a part of the lead wires 2, 2'of the glass-sealed thermistor 1 are also bonded with a resin 4. Therefore, an area larger than the minimum area required for temperature measurement (only the area where the glass-sealed thermistor 1 is bonded) is required. For this reason, there has been a problem that the heat capacity of the temperature detector becomes unnecessarily large and the thermal response becomes slow.

【0005】本発明はかかる従来の問題点を解消するも
ので、従来よりも高耐熱性で、高速応答性にすることを
目的にしている。
The present invention solves the above-mentioned problems of the prior art, and an object of the present invention is to provide higher heat resistance and faster response than those of the prior art.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に、中央部に凹部を有する板状金属支持体と前記凹部に
配置された温度検出器とから成る構成を備えたものであ
る。
In order to solve the above-mentioned problems, the present invention is provided with a structure comprising a plate-shaped metal support having a recess in the center and a temperature detector arranged in the recess.

【0007】[0007]

【作用】本発明は上記した構成によって、樹脂などの有
機物材料をまったく使用していないので、最高使用温度
は高くなる。すなわち、温度検出器として、通常、サー
ミスタが用いられ、これは感温セラミック、焼成硝子被
覆などから構成される。これらは高温焼成工程を経て形
成されるので、従来以上の高耐熱性を容易に得られる。
According to the present invention, since the organic material such as the resin is not used at all in the present invention, the maximum operating temperature becomes high. That is, a thermistor is usually used as the temperature detector, which is composed of a temperature-sensitive ceramic, a firing glass coating, or the like. Since these are formed through a high temperature firing step, higher heat resistance than ever can be easily obtained.

【0008】また、温度検出器は金属支持体の凹部に配
置される。この凹部の形状は、温度検出器が収納される
に充分で、かつ、最小の大きさでよい。この小さな凹部
の外表面が被測温体と接着し、温度検出器周辺部のみが
加熱、または冷却されるので、高速熱応答性が得られ
る。
Further, the temperature detector is arranged in the recess of the metal support. The shape of this recess may be sufficient to accommodate the temperature detector and be of a minimum size. The outer surface of the small recess is adhered to the temperature-measured body, and only the peripheral portion of the temperature detector is heated or cooled, so that high-speed thermal response can be obtained.

【0009】[0009]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。図1は検出器として薄膜サーミスタ素子を用いた
ときの本発明の接触型サーミスタの一実施例を示す断面
図である。板状金属支持体6の中央部に凹部61を設
け、この凹部61に温度検出器7を配置した。板状金属
支持体6はステンレス板(厚さ0.5mm)を用い、直径
18mm、凹部61は直径8mmとした。検出器7は、薄膜
サーミスタ素子71をアルミナ支持体72の上に配置し
た後、薄膜サーミスタ素子71の周囲を硝子73で被覆
して構成した。薄膜サーミスタ素子は、アルミナ基板の
表面に電極膜と感温抵抗体膜を形成して構成されるが、
図1では省略している。電極膜からリード線74、7
4′を取り出した。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the contact type thermistor of the present invention when a thin film thermistor element is used as a detector. A recess 61 was provided in the center of the plate-shaped metal support 6, and the temperature detector 7 was placed in this recess 61. A stainless steel plate (thickness 0.5 mm) was used as the plate-shaped metal support 6, the diameter was 18 mm, and the recess 61 was 8 mm in diameter. The detector 7 is configured by disposing the thin film thermistor element 71 on the alumina support 72 and then covering the thin film thermistor element 71 with glass 73. The thin film thermistor element is constructed by forming an electrode film and a temperature sensitive resistor film on the surface of an alumina substrate.
It is omitted in FIG. Lead wires 74, 7 from electrode film
I took out 4 '.

【0010】このようにして構成された本発明の接触型
薄膜サーミスタ構成では、従来例に比べ、樹脂などの有
機物が全く使用されていないので、最高使用温度を20
0℃以上にできる。すなわち、薄膜サーミスタ素子7
1、アルミナ支持体72、硝子73などは、すべて無機
物であり、しかも700℃以上の焼成工程を経て形成さ
れるので、200℃以上の耐熱性を容易に得られる。従
って、本実施例の耐熱性は、結局、感温抵抗体膜の耐熱
性に依存する。この耐熱性は感温抵抗体膜の材質、形成
条件により決められる。感温抵抗体膜として、複合金属
酸化物、Ge、Si、SiCなどの蒸着膜、スパッタ
膜、印刷・焼成厚膜など種々あるが、なかでもSiCス
パッタ感温抵抗体膜は500℃の耐熱性を有すると共に
0〜500℃の広い温度範囲を検出するのに適した抵抗
温度特定を有する点で優れている。
In the contact type thin film thermistor structure of the present invention thus constituted, compared with the conventional example, since no organic substance such as resin is used, the maximum operating temperature is 20.
It can be higher than 0 ° C. That is, the thin film thermistor element 7
1, the alumina support 72, the glass 73, etc. are all inorganic substances and are formed through a firing process at 700 ° C. or higher, so that heat resistance at 200 ° C. or higher can be easily obtained. Therefore, the heat resistance of this example ultimately depends on the heat resistance of the temperature-sensitive resistor film. This heat resistance is determined by the material of the temperature sensitive resistor film and the forming conditions. There are various types of temperature-sensitive resistor films, such as composite metal oxides, vapor-deposited films of Ge, Si, SiC, etc., sputtered films, printed / fired thick films, among others, the SiC sputtered temperature-sensitive resistor film has a heat resistance of 500 ° C. And having resistance temperature specification suitable for detecting a wide temperature range of 0 to 500 ° C.

【0011】また、本実施例の接触型サーミスタおよび
凹部61と外周辺部62とを同一平面で構成した以外同
一構成のサーミスタをそれぞれ対象物の表面に密着させ
て、90%熱応答時間を測定した結果、前者は約8se
c、後者は約10secの熱応答性を示した。本実施例
の接触型サーミスタが対象物に接触したとき、小さな面
積の凹部61を通して集中的に熱流が流れるので、熱応
答性が速くなる。これに対して、凹部61と外周辺部6
2とを同一平面で構成した場合、熱流は大きな面積の接
触部を通して分散して流れるので、熱応答性が遅くなる
と思われる。
The contact type thermistor of this embodiment and the thermistor having the same structure except that the recess 61 and the outer peripheral portion 62 are formed on the same plane are brought into close contact with the surface of the object, and the 90% thermal response time is measured. As a result, the former is about 8se
c, the latter showed a thermal response of about 10 sec. When the contact type thermistor of this embodiment contacts an object, the heat flow intensively flows through the recess 61 having a small area, so that the thermal response becomes faster. On the other hand, the concave portion 61 and the outer peripheral portion 6
If 2 and 2 are formed on the same plane, the heat flow is dispersed and flows through the contact portion having a large area, so that the thermal response seems to be slow.

【0012】なお、凹部61の内表面とアルミナ支持体
72の外表面の間にヒートシンカを配置した場合、90
%熱応答時間は約6secとなり、一層の高速熱応答性
が得られた。これは、凹部61とアルミナ支持体72の
間の熱抵抗が減少したことに起因する。また、リード線
74、74′は板状金属支持体6に対して垂直方向に取
り出すことが望ましい。温度検出器7は、凹部61に配
置されるので、リード線74、74′が板状金属支持体
6と平行方向に取り出された場合、リード線74、7
4′が板状金属支持体6の外周辺部62と接触する恐れ
があるからである。また、本実施例の接触型サーミスタ
を対象物に固定する必要がある場合、板状金属支持体の
外周囲部62に取付用穴を設ければよい。
When a heat sinker is arranged between the inner surface of the recess 61 and the outer surface of the alumina support 72, 90
The% thermal response time was about 6 seconds, and further high-speed thermal response was obtained. This is because the thermal resistance between the recess 61 and the alumina support 72 is reduced. Further, it is desirable that the lead wires 74, 74 ′ be taken out in a direction perpendicular to the plate-shaped metal support 6. Since the temperature detector 7 is arranged in the recess 61, when the lead wires 74, 74 ′ are taken out in the direction parallel to the plate-shaped metal support 6, the lead wires 74, 7 ′ are formed.
This is because 4'may contact the outer peripheral portion 62 of the plate-shaped metal support 6. When it is necessary to fix the contact type thermistor of this embodiment to an object, a mounting hole may be provided in the outer peripheral portion 62 of the plate-shaped metal support.

【0013】図1の実施例では、薄膜サーミスタ素子を
用いて説明したが、感温セラミック素子でも同様のこと
が言える。ただし、感温セラミック素子は円筒状でその
両端からリード線を取り出す型、もしくは円板状でその
両面からリード線を取り出す型が一般的である。このた
め平板状絶縁性支持体5と感温セラミック素子の間の熱
伝達が薄膜サーミスタ素子に比べ悪くなるので、熱応答
性は遅くなる。しかし、200℃以上の耐熱性は充分確
保できる。
In the embodiment of FIG. 1, the thin film thermistor element is used for explanation, but the same can be said for the temperature sensitive ceramic element. However, the temperature-sensitive ceramic element is generally cylindrical and has lead wires from both ends thereof, or disk-shaped and has lead wires from both sides thereof. For this reason, heat transfer between the flat plate-shaped insulating support 5 and the temperature-sensitive ceramic element becomes worse than that of the thin film thermistor element, so that the thermal response becomes slow. However, heat resistance of 200 ° C. or higher can be sufficiently ensured.

【0014】図2に本発明の他の実施例を示す。この実
施例は、測定すべき対象物が測定毎に異なる場合に適す
る。底部に凹部81を有し、下端部に複数個の引掛かり
部82を設けた円筒状金属容器8の凹部81に温度検出
器7を配置した。他方で、上方を下方より大径に形成し
た張出部91を有する円筒状ガイド9を準備し、円筒状
金属容器8の底部の周辺部83の内面と円筒状ガイド9
の張出部91の底面92の間に、圧縮された状態のスプ
リング10を配置した。円筒状金属容器8の引掛かり部
82は円筒状ガイドの張出部91の下側に位置させると
共に円筒状金属容器8と円筒状ガイド9の間に小間隙を
設けた。円筒状金属容器8と円筒状ガイド9は、圧縮さ
れたスプリング10により機械的に結合されると共に両
者の間は小間隙が設けられている。従って、例えば、円
筒状ガイド9を手で保持して、凹部81の外表面を対象
物に接触・押しつけたとき、円筒状金属容器8は押圧力
に応じて可動し、対象物表面に密着する。このように、
本実施例では、円筒状金属容器8が押圧力に応じて可動
して、対象物表面に密着するので、測定すべき対象物が
毎回異なる場合でも、容易に表面温度を検出できる。
FIG. 2 shows another embodiment of the present invention. This embodiment is suitable when the object to be measured is different for each measurement. The temperature detector 7 was arranged in the recess 81 of the cylindrical metal container 8 having the recess 81 at the bottom and the plurality of catches 82 at the lower end. On the other hand, the cylindrical guide 9 having the overhanging portion 91 whose upper portion is formed to have a larger diameter than the lower portion is prepared, and the inner surface of the peripheral portion 83 of the bottom portion of the cylindrical metal container 8 and the cylindrical guide 9 are prepared.
The compressed spring 10 is arranged between the bottom surfaces 92 of the overhanging portions 91. The catch 82 of the cylindrical metal container 8 is located below the overhanging portion 91 of the cylindrical guide, and a small gap is provided between the cylindrical metal container 8 and the cylindrical guide 9. The cylindrical metal container 8 and the cylindrical guide 9 are mechanically coupled by a compressed spring 10 and a small gap is provided between them. Therefore, for example, when the cylindrical guide 9 is held by hand and the outer surface of the recess 81 is brought into contact with and pressed against the object, the cylindrical metal container 8 moves according to the pressing force and adheres to the object surface. . in this way,
In this embodiment, the cylindrical metal container 8 moves according to the pressing force and comes into close contact with the surface of the object, so that the surface temperature can be easily detected even when the object to be measured is different each time.

【0015】[0015]

【発明の効果】以上述べてきたように、本発明によれば
次に示す効果が得られる。
As described above, according to the present invention, the following effects can be obtained.

【0016】(1)従来の表面温度センサに用いられて
きた樹脂を全く含まず、すべてセラミック、焼結体、な
ど無機物で構成されるので、高耐熱性に優れる。
(1) Since it does not contain the resin used in the conventional surface temperature sensor at all and is made of an inorganic material such as ceramics and sintered bodies, it has excellent high heat resistance.

【0017】(2)中央部に凹部を有する板状金属支持
体の凹部に温度検出器を配置しているので、本発明の接
触型サーミスタが対象物に接触したとき、小さな面積の
凹部を通して集中的に熱流が流れる。この結果、熱応答
性が速くなる。
(2) Since the temperature detector is arranged in the recess of the plate-shaped metal support having a recess in the center, when the contact type thermistor of the present invention contacts an object, the temperature is concentrated through the recess having a small area. Heat flow. As a result, the thermal response becomes faster.

【0018】(3)円筒状金属容器と円筒状ガイドを、
圧縮されたスプリングにより機械的に結合すると共に両
者の間に小間隙を設けることにより、凹部の外表面を対
象物に接触押しつけたとき、円筒状金属容器は押圧力に
応じて可動し、対象物表面に密着するので、測定すべき
対象物が毎回異なる場合でも容易に表面温度を検出でき
る。
(3) The cylindrical metal container and the cylindrical guide are
By mechanically connecting with a compressed spring and providing a small gap between them, when the outer surface of the recess is pressed against the object, the cylindrical metal container moves according to the pressing force, Since it adheres to the surface, the surface temperature can be easily detected even when the object to be measured is different each time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における接触型薄膜サーミス
タの断面図
FIG. 1 is a cross-sectional view of a contact type thin film thermistor according to an embodiment of the present invention.

【図2】本発明の他の実施例における接触型薄膜サーミ
スタの断面図
FIG. 2 is a sectional view of a contact type thin film thermistor according to another embodiment of the present invention.

【図3】従来の表面温度センサを示す断面図FIG. 3 is a sectional view showing a conventional surface temperature sensor.

【符号の説明】[Explanation of symbols]

6 板状金属支持体 61 凹部 7 温度検出器 6 plate-shaped metal support 61 recess 7 temperature detector

───────────────────────────────────────────────────── フロントページの続き (72)発明者 伊藤 修治 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuji Ito 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】中央部に凹部を有する板状金属支持体と、
前記凹部に配置された温度検出器とから成る接触型サー
ミスタ。
1. A plate-shaped metal support having a recess in the center,
A contact type thermistor comprising a temperature detector arranged in the recess.
【請求項2】凹部と温度検出器の間にヒートシンカを配
置した請求項1記載の接触型サーミスタ。
2. A contact type thermistor according to claim 1, wherein a heat sinker is arranged between the recess and the temperature detector.
【請求項3】温度検出器のリード線が板状金属支持体に
対して垂直方向に取り出された請求項1記載の接触型サ
ーミスタ。
3. The contact type thermistor according to claim 1, wherein the lead wire of the temperature detector is taken out in a direction perpendicular to the plate-shaped metal support.
【請求項4】底部に凹部を有し、下端部に複数個の引掛
かり部を設けた円筒状金属容器と、前記凹部に配置され
た温度検出器と、上方を下方より大径に形成した張出部
を有する円筒状ガイドと、前記円筒状金属容器の前記底
部周辺部の内面と前記円筒状ガイドの張出部底面の間に
配置されかつ圧縮されたスプリングとから成り、前記円
筒状金属容器の前記引掛かり部を前記円筒状ガイドの張
出部の下側に位置させると共に前記円筒状金属容器と前
記円筒状ガイドの間に小間隙を設けた接触型サーミス
タ。
4. A cylindrical metal container having a recess at the bottom and a plurality of catches at the lower end, a temperature detector arranged in the recess, and an upper part having a larger diameter than a lower part. A cylindrical guide having an overhang, a spring arranged between the inner surface of the bottom peripheral portion of the cylindrical metal container and the bottom of the overhang of the cylindrical guide, and compressed; A contact type thermistor in which the catching portion of the container is located below the overhanging portion of the cylindrical guide and a small gap is provided between the cylindrical metal container and the cylindrical guide.
JP4204736A 1992-07-31 1992-07-31 Contact type thermistor Pending JPH0650822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4204736A JPH0650822A (en) 1992-07-31 1992-07-31 Contact type thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4204736A JPH0650822A (en) 1992-07-31 1992-07-31 Contact type thermistor

Publications (1)

Publication Number Publication Date
JPH0650822A true JPH0650822A (en) 1994-02-25

Family

ID=16495466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4204736A Pending JPH0650822A (en) 1992-07-31 1992-07-31 Contact type thermistor

Country Status (1)

Country Link
JP (1) JPH0650822A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043486A (en) * 2009-08-24 2011-03-03 Mitsubishi Materials Corp Temperature sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136724A (en) * 1988-11-17 1990-05-25 Matsushita Electric Ind Co Ltd Temperature sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136724A (en) * 1988-11-17 1990-05-25 Matsushita Electric Ind Co Ltd Temperature sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043486A (en) * 2009-08-24 2011-03-03 Mitsubishi Materials Corp Temperature sensor
CN101995302A (en) * 2009-08-24 2011-03-30 三菱综合材料株式会社 Temperature sensor

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