JP2011043486A - Temperature sensor - Google Patents

Temperature sensor Download PDF

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JP2011043486A
JP2011043486A JP2009193668A JP2009193668A JP2011043486A JP 2011043486 A JP2011043486 A JP 2011043486A JP 2009193668 A JP2009193668 A JP 2009193668A JP 2009193668 A JP2009193668 A JP 2009193668A JP 2011043486 A JP2011043486 A JP 2011043486A
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metal tube
temperature sensor
thermal element
thermal
pair
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Hitoshi Inaba
均 稲場
Kensho Nagatomo
憲昭 長友
Yoshinori Adachi
美紀 足立
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to CN2010102512453A priority patent/CN101995302A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature sensor capable of further improving thermal response properties as a temperature sensor for measuring temperature of an EGR (Exhaust Gas Recirculation) gas, or the like. <P>SOLUTION: The temperature sensor includes: a closed-end cylindrical metal tube 2; a heat-sensitive element 4 which is installed on an inner surface of the bottom of the metal tube 2 and on which a pair of terminal electrodes is formed; and a pair of lead wires 5 connected to the pair of terminal electrodes. A recess 2a along an outer shape of the heat-sensitive element 4 is formed on an inner surface of the bottom of the metal tube 2, and a bottom face and a side face of the heat-sensitive element 4 are adhered while the heat-sensitive element 4 is embedded into the recess 2a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えばＥＧＲ(Exhaust Gas Recirculation)ガスの温度測定に好適な温度センサに関する。   The present invention relates to a temperature sensor suitable for temperature measurement of, for example, EGR (Exhaust Gas Recirculation) gas.

ディーゼルエンジンを搭載した自動車等では、Ｏ２の少ない排気ガスを再び燃焼工程へ送り燃焼温度を下げることで、窒素酸化物（ＮＯｘ）の排出量を低減させるＥＧＲ(Exhaust Gas Recirculation：排気ガス再循環)システムが採用されている。
このＥＧＲシステムでは、ＥＧＲバルブ（排ガス還流制御弁）の吸入ポートにＥＧＲガスの温度を検出するための温度センサが取り付けられ、最適な酸素濃度制御が行われている。 In automobiles equipped with diesel engines, exhaust gas recirculation (EGR) that reduces the emission of nitrogen oxides (NOx) by reducing the combustion temperature by sending exhaust gas with low O 2 to the combustion process again. ) The system is adopted.
In this EGR system, a temperature sensor for detecting the temperature of EGR gas is attached to an intake port of an EGR valve (exhaust gas recirculation control valve), and optimal oxygen concentration control is performed.

従来、ＥＲＧガス等の温度検出用の温度センサとしては、例えば、特許文献１及び２には、円錐状のガラスタイプサーミスタをセメントやシリコーンオイル等の充填剤と共に金属管に挿入したサーミスタ温度センサが提案されている。
また、特許文献３には、セラミックスリード保持部上に感温抵抗体膜を形成し、セラミックスリード保持部を金属管の底にロウ等で接着した技術が提案されている。 Conventionally, as temperature sensors for temperature detection of ERG gas or the like, for example, Patent Documents 1 and 2 include a thermistor temperature sensor in which a conical glass type thermistor is inserted into a metal tube together with a filler such as cement or silicone oil. Proposed.
Patent Document 3 proposes a technique in which a temperature sensitive resistor film is formed on a ceramic lead holding part and the ceramic lead holding part is bonded to the bottom of a metal tube with a solder or the like.

特開平７−４３２２０号公報JP 7-43220 A 特開２００３−２３４２０３号公報JP 2003-234203 A 特開昭６０−２１５５８４号公報Japanese Patent Application Laid-Open No. 60-215584

上記従来の技術には、以下の課題が残されている。
すなわち、従来の特許文献１及び２に記載されている技術のように、セメントやシリコーンオイル等の充填剤を金属管に挿入している場合、熱容量が大きくなるため、熱応答性が悪くなり、ＥＧＲガスの温度測定のように高速熱応答性が要求される場合には不適であるという不都合があった。また、特許文献３に記載されている技術のように、金属管の底に感温抵抗体膜が形成された板状の素子を接着した場合、応答性は向上するが、さらなる熱応答性の高速化が要望されている。 The following problems remain in the conventional technology.
That is, as in the techniques described in the conventional patent documents 1 and 2, when a filler such as cement or silicone oil is inserted in the metal tube, the heat capacity is increased, so that the thermal responsiveness is deteriorated, There is an inconvenience that it is not suitable when high-speed thermal response is required as in the temperature measurement of EGR gas. In addition, as in the technique described in Patent Document 3, when a plate-like element having a temperature-sensitive resistor film formed on the bottom of a metal tube is bonded, the responsiveness is improved, but the further thermal responsiveness is increased. There is a demand for higher speed.

本発明は、前述の課題に鑑みてなされたもので、ＥＧＲガス等の温度測定用として、熱応答性をさらに向上させることができる温度センサを提供することを目的とする。   The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a temperature sensor that can further improve thermal responsiveness for temperature measurement of EGR gas or the like.

本発明は、前記課題を解決するために以下の構成を採用した。すなわち、本発明の温度センサは、有底筒状の金属管と、該金属管の底部内面に設置され一対の端子電極が形成された感熱素子と、前記一対の端子電極に接続された一対のリード線と、を備え、前記金属管の底部内面に前記感熱素子の外形状に沿った凹部が形成され、該凹部に前記感熱素子が嵌め込まれた状態で該感熱素子の底面及び側面が接着されていることを特徴とする。   The present invention employs the following configuration in order to solve the above problems. That is, the temperature sensor of the present invention includes a bottomed cylindrical metal tube, a thermal element installed on the inner surface of the bottom of the metal tube and having a pair of terminal electrodes, and a pair of terminal electrodes connected to the pair of terminal electrodes. A recess formed along the outer shape of the thermal element on the inner surface of the bottom of the metal tube, and the bottom and side surfaces of the thermal element are bonded to each other with the thermal element fitted into the recess. It is characterized by.

すなわち、この温度センサでは、金属管の底部内面に感熱素子の外形状に沿った凹部が形成され、該凹部に感熱素子が嵌め込まれた状態で該感熱素子の底面及び側面が接着されているので、感熱素子の底面だけでなく側面が金属管の凹部に接触して接触面積が増大することで、熱応答性が向上すると共に金属管と感熱素子との接合強度が向上する。特に、凹部によって薄肉化された部分に感熱素子が実装されるため、さらに熱応答性が向上する。   That is, in this temperature sensor, a recess is formed on the inner surface of the bottom of the metal tube along the outer shape of the thermal element, and the bottom and side surfaces of the thermal element are bonded to each other with the thermal element fitted in the recess. The contact area is increased by contacting not only the bottom surface of the thermal element but also the side surface thereof with the concave portion of the metal tube, so that the thermal response is improved and the bonding strength between the metal tube and the thermal element is improved. In particular, since the thermosensitive element is mounted on the portion thinned by the recess, the thermal response is further improved.

また、本発明の温度センサは、前記感熱素子が、絶縁基板上にサーミスタ薄膜が成膜された薄膜サーミスタ素子であることを特徴とする。
すなわち、この温度センサでは、感熱素子が、絶縁基板上にサーミスタ薄膜が成膜された薄膜サーミスタ素子であるので、感熱素子自体の熱容量も小さく、熱応答性をより向上させることができる。また、薄板状の感熱素子となるので、金属管の底部内面に形成する凹部の深さも浅く済むことから金属管の厚みも薄く設定することが可能になり、金属管自体の熱容量も小さくすることができる。 In the temperature sensor of the present invention, the thermosensitive element is a thin film thermistor element in which a thermistor thin film is formed on an insulating substrate.
That is, in this temperature sensor, since the thermal element is a thin film thermistor element in which a thermistor thin film is formed on an insulating substrate, the thermal capacity of the thermal element itself is small, and the thermal responsiveness can be further improved. In addition, since it is a thin plate-like thermal element, the depth of the recess formed on the inner surface of the bottom of the metal tube can be reduced, so that the thickness of the metal tube can be set thin, and the heat capacity of the metal tube itself can be reduced. Can do.

本発明によれば、以下の効果を奏する。
すなわち、本発明に係る温度センサによれば、金属管の底部内面に感熱素子の外形状に沿った凹部が形成され、該凹部に感熱素子が嵌め込まれた状態で該感熱素子の底面及び側面が接着されているので、感熱素子と金属管との接触面が増え、熱応答性がさらに向上すると共に金属管と感熱素子との接合強度が向上する。したがって、本発明の温度センサは、高い熱応答性及び信頼性が得られ、ＥＧＲガスの温度検出用として好適である。 The present invention has the following effects.
That is, according to the temperature sensor of the present invention, a recess is formed on the inner surface of the bottom of the metal tube along the outer shape of the thermal element, and the bottom and side surfaces of the thermal element are in a state where the thermal element is fitted in the recess. Since they are bonded, the contact surface between the thermal element and the metal tube is increased, the thermal response is further improved, and the bonding strength between the metal tube and the thermal element is improved. Therefore, the temperature sensor of the present invention has high thermal responsiveness and reliability, and is suitable for temperature detection of EGR gas.

本発明に係る温度センサの一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the temperature sensor which concerns on this invention. 本実施形態の温度センサにおいて、要部を拡大した断面図である。It is sectional drawing to which the principal part was expanded in the temperature sensor of this embodiment. 本実施形態の温度センサにおいて、感熱素子を示す平面図である。In the temperature sensor of this embodiment, it is a top view which shows a thermal element. 本実施形態の温度センサにおいて、金属管の底部内面を示す図、凹部に接着剤を形成した際のＡ−Ａ線断面図及び感熱素子を嵌め込んだ状態を示す図である。In the temperature sensor of this embodiment, it is a figure which shows the state which inserted the figure which shows the bottom inner surface of a metal tube, the AA sectional view at the time of forming an adhesive agent in a recessed part, and the thermal element.

以下、本発明に係る温度センサの一実施形態を、図１から図４を参照しながら説明する。なお、以下の説明に用いる各図面では、各部材を認識可能又は認識容易な大きさとするために縮尺を適宜変更している。   Hereinafter, an embodiment of a temperature sensor according to the present invention will be described with reference to FIGS. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

本実施形態の温度センサ１は、図１及び図２に示すように、例えばディーゼルエンジンのＥＧＲガスの温度検出用としてＥＧＲバルブの吸入ポートに取り付けられる温度センサであって、有底筒状の金属管２と、該金属管２の底部内面に設置され一対の端子電極３が形成された感熱素子４と、一対の端子電極３に接続された一対のリード線５と、金属管２の開口端部に取り付けられたコネクタ６と、を備えている。   As shown in FIGS. 1 and 2, the temperature sensor 1 of the present embodiment is a temperature sensor that is attached to an intake port of an EGR valve, for example, for detecting the temperature of EGR gas in a diesel engine. A tube 2, a thermal element 4 provided on the bottom inner surface of the metal tube 2 and having a pair of terminal electrodes 3 formed thereon, a pair of lead wires 5 connected to the pair of terminal electrodes 3, and an open end of the metal tube 2 And a connector 6 attached to the section.

上記金属管２は、例えば有底円筒状のＳＵＳ（ステンレス）管である。
この金属管２の底部内面には、図３及び図４に示すように、感熱素子４の外形状に沿ったザグリである凹部２ａが形成され、該凹部２ａに感熱素子４が嵌め込まれた状態で該感熱素子４の底面及び側面が接着されている。すなわち、薄板状かつ平面視長方形状の感熱素子４に対応して、平面視長方形状の凹部２ａが、感熱素子４の厚さに対応した深さで金属管２の底部内面の中央に形成されている。
この凹部２ａと感熱素子４とは、隙間を埋めるようにロウ等の接着剤７で接着されている。 The metal tube 2 is, for example, a bottomed cylindrical SUS (stainless steel) tube.
As shown in FIGS. 3 and 4, a concave portion 2 a which is a counterbore along the outer shape of the thermal element 4 is formed on the inner surface of the bottom of the metal tube 2, and the thermal element 4 is fitted into the concave portion 2 a. Thus, the bottom and side surfaces of the thermal element 4 are bonded. That is, a concave portion 2 a having a rectangular shape in plan view is formed at the center of the inner surface of the bottom portion of the metal tube 2 at a depth corresponding to the thickness of the thermal element 4, corresponding to the thin plate-shaped and rectangular shape in the plan view. ing.
The recess 2a and the thermal element 4 are bonded with an adhesive 7 such as wax so as to fill the gap.

接着剤７について、ロウ材を使用する場合は、メタライズ不要の活性銀ロウを使用する。予め基板にペースト状のロウ材を塗布しておき、Ａｒ雰囲気で７８０〜８００℃、５ｍｉｎ保持することで、セラミックス基板とステンレスの金属とが接続可能となる。また、予めセラミックス基板をメタライズ処理（Ｍｏ−Ｍｎ、又はＭｏ−Ｗ、又はＴｉにＮｉ、Ａｕめっき）し、Ａｇロウを使用することも可能である。
また、アルミナ基板に対して、セラミックス接着剤を使用する場合は、アルミナの熱膨張率７．９×１０−６ ／Ｋとステンレスの熱膨張率１６．６×１０−６ ／Ｋとの中間に熱膨張率が位置するマグネシア系接着剤（１２．６×１０−６ ／Ｋ）が最適であり、セラミック基板に塗布した後、９３℃、２ｈでキュアして接着を行う。なお、アルミナ系接着剤も、使用環境の温度差が比較的少ない環境ならば使用可能である。 For the adhesive 7, when using a brazing material, an active silver brazing that does not require metallization is used. By applying a paste-like brazing material to the substrate in advance and holding at 780 to 800 ° C. for 5 minutes in an Ar atmosphere, the ceramic substrate and the stainless steel metal can be connected. It is also possible to pre-metallize the ceramic substrate (Mo—Mn, Mo—W, or Ti, Ni, Au plating) and use Ag brazing.
In addition, when a ceramic adhesive is used for an alumina substrate, the thermal expansion coefficient of alumina is 7.9 × 10 −6 / K and the thermal expansion coefficient of stainless steel is 16.6 × 10 −6 / K. A magnesia-based adhesive (12.6 × 10 −6 / K) in which the coefficient of thermal expansion is located is optimal, and after being applied to a ceramic substrate, it is cured at 93 ° C. for 2 hours for adhesion. Alumina-based adhesives can also be used in environments where the temperature difference in the usage environment is relatively small.

上記感熱素子４は、アルミナ又は窒化アルミニウム等のセラミックス基板である絶縁基板８上にサーミスタ薄膜９が成膜された薄膜サーミスタ素子である。
例えば、感熱素子４としては、Ｍｎ−Ｃｏ系複合金属酸化物（例えば、Ｍｎ３Ｏ４−Ｃｏ３Ｏ４系複合金属酸化物）又はＭｎ−Ｃｏ系複合金属酸化物にＮｉ、Ｆｅ、Ｃｕの少なくとも一種類を含む複合金属酸化物（例えば、Ｍｎ３Ｏ４−Ｃｏ３Ｏ４−Ｆｅ２Ｏ３系複合金属酸化物）からなる複合金属酸化物膜のサーミスタ薄膜９と、この複合金属酸化物膜上に形成された櫛形電極等の一対の膜上電極（図示略）と、これら膜上電極に接続された上記端子電極３と、を備えた薄膜サーミスタ素子を採用している。また、サーミスタ薄膜９を覆う形態でＳｉＯ２、Ｓｉ３Ｎ４、ＨｆＯ２等の保護膜を形成することで、外気からのＯ２の進入を阻止することが可能となり、電気特性が安定する。 The thermal element 4 is a thin film thermistor element in which a thermistor thin film 9 is formed on an insulating substrate 8 which is a ceramic substrate such as alumina or aluminum nitride.
For example, as the thermal element 4, Mn—Co based composite metal oxide (for example, Mn 3 O 4 —Co 3 O 4 based composite metal oxide) or Mn—Co based composite metal oxide may be made of Ni, Fe, or Cu. A thermistor thin film 9 of a composite metal oxide film comprising a composite metal oxide containing at least one kind (for example, Mn 3 O 4 —Co 3 O 4 —Fe 2 O 3 composite metal oxide), and the composite metal oxide A thin film thermistor element including a pair of on-film electrodes (not shown) such as comb electrodes formed on the film and the terminal electrode 3 connected to these on-film electrodes is employed. Further, by forming a protective film such as SiO 2 , Si 3 N 4 , or HfO 2 so as to cover the thermistor thin film 9, it becomes possible to prevent the ingress of O 2 from the outside air, and the electrical characteristics are stabilized.

上記コネクタ６は、金属管２の開口端部を取り付けるネジ部１０と、温度検出回路等に接続された配線１１の端部が固定された本体部１２と、で構成されている。なお、金属管２内のリード線５は、ネジ部１０を挿通されて本体部１２内の配線１１と接続されている。このコネクタ６は、例えば樹脂成形で作製される。   The connector 6 includes a screw portion 10 to which an opening end portion of the metal tube 2 is attached, and a main body portion 12 to which an end portion of a wiring 11 connected to a temperature detection circuit or the like is fixed. The lead wire 5 in the metal tube 2 is inserted through the screw portion 10 and connected to the wiring 11 in the main body portion 12. This connector 6 is produced by resin molding, for example.

上記感熱素子４を金属管２に取り付けるには、図４の（ａ）に示すように、まず、金属管２の底部内面に感熱素子４の外形に合わせた矩形状のザグリである凹部２ａを形成しておく。また、予めリード線５と感熱素子４の端子電極３とを接合させておく。なお、この接合は、レーザー溶接又は抵抗溶接等で行う。
次に、図４の（ｂ）に示すように、凹部２ａの内面全て（底面及び内周面）にロウ等の接着剤７を形成する。なお、感熱素子４の裏面及び側面に、予めロウ等の接着剤７を形成しておいても構わない。 In order to attach the thermal element 4 to the metal tube 2, first, as shown in FIG. 4A, first, a concave portion 2 a that is a rectangular counterbore conforming to the outer shape of the thermal element 4 is formed on the bottom inner surface of the metal tube 2. Form it. Further, the lead wire 5 and the terminal electrode 3 of the thermal element 4 are bonded in advance. This joining is performed by laser welding or resistance welding.
Next, as shown in FIG. 4B, an adhesive 7 such as wax is formed on the entire inner surface (bottom surface and inner peripheral surface) of the recess 2a. Note that an adhesive 7 such as wax may be formed in advance on the back and side surfaces of the thermal element 4.

さらに、図５の（ｃ）に示すように、この凹部２ａ内に感熱素子４を嵌め込み、絶縁基板８の底面及び側面と凹部２ａの底面及び内周面とを接着剤７によって接着する。なお、感熱素子４を接着した後に、リード線５と端子電極３とを接合させても構わない。   Further, as shown in FIG. 5C, the thermal element 4 is fitted into the recess 2 a, and the bottom surface and side surface of the insulating substrate 8 and the bottom surface and inner peripheral surface of the recess 2 a are bonded with an adhesive 7. Note that the lead wire 5 and the terminal electrode 3 may be bonded after the thermal element 4 is bonded.

このように本実施形態の温度センサ１では、金属管２の底部内面に感熱素子４の外形状に沿った凹部２ａが形成され、該凹部２ａに感熱素子４が嵌め込まれた状態で該感熱素子４の底面及び側面が接着されているので、感熱素子４の底面だけでなく側面が金属管２の凹部２ａに接触して接触面積が増大することで、熱応答性が向上すると共に金属管２と感熱素子４との接合強度が向上する。特に、凹部２ａによって薄肉化された部分に感熱素子４が実装されるため、さらに熱応答性が向上する。   As described above, in the temperature sensor 1 of the present embodiment, the concave portion 2a along the outer shape of the thermal element 4 is formed on the inner surface of the bottom of the metal tube 2, and the thermal element 4 is fitted in the concave portion 2a. Since the bottom surface and the side surface of 4 are bonded, not only the bottom surface of the thermal element 4 but also the side surface contacts the recess 2a of the metal tube 2 to increase the contact area, thereby improving the thermal response and the metal tube 2. The bonding strength between the thermal element 4 and the thermosensitive element 4 is improved. In particular, since the thermal element 4 is mounted on the portion thinned by the recess 2a, the thermal response is further improved.

また、感熱素子４が、絶縁基板８上にサーミスタ薄膜９が成膜された薄膜サーミスタ素子であるので、感熱素子４自体の熱容量も小さく、熱応答性をより向上させることができる。また、薄板状の感熱素子４となるので、金属管２の底部内面に形成する凹部２ａの深さも浅く済むことから金属管２の厚みも薄く設定することが可能になり、金属管２自体の熱容量も小さくすることができる。   Further, since the thermal element 4 is a thin film thermistor element in which the thermistor thin film 9 is formed on the insulating substrate 8, the thermal capacity of the thermal element 4 itself is small, and the thermal response can be further improved. Further, since the thin plate-like thermal element 4 is formed, the depth of the concave portion 2a formed on the inner surface of the bottom of the metal tube 2 can be reduced, so that the thickness of the metal tube 2 can be set thin. The heat capacity can also be reduced.

なお、本発明の技術範囲は上記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。   The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

例えば、上記実施形態では、上述したように、サーミスタ薄膜を用いた薄膜サーミスタ素子を感熱素子とすることが好ましいが、バルクのサーミスタ素子を用いたチップサーミスタの感熱素子を採用しても構わない。この場合、浅い凹部に嵌め込み可能な薄型の板状とされたチップサーミスタを用いることが好ましい。   For example, in the above embodiment, as described above, it is preferable to use a thin film thermistor element using a thermistor thin film as the heat sensitive element, but a heat sensitive element of a chip thermistor using a bulk thermistor element may be adopted. In this case, it is preferable to use a chip thermistor having a thin plate shape that can be fitted into a shallow recess.

１…温度センサ、２…金属管、２ａ…凹部、３…端子電極、４…感熱素子、５…リード線、７…接着剤、８…絶縁基板、９…サーミスタ薄膜   DESCRIPTION OF SYMBOLS 1 ... Temperature sensor, 2 ... Metal pipe, 2a ... Recessed part, 3 ... Terminal electrode, 4 ... Thermal element, 5 ... Lead wire, 7 ... Adhesive, 8 ... Insulating substrate, 9 ... Thermistor thin film

Claims (2)

有底筒状の金属管と、
該金属管の底部内面に設置され一対の端子電極が形成された感熱素子と、
前記一対の端子電極に接続された一対のリード線と、を備え、
前記金属管の底部内面に前記感熱素子の外形状に沿った凹部が形成され、該凹部に前記感熱素子が嵌め込まれた状態で該感熱素子の底面及び側面が接着されていることを特徴とする温度センサ。 A bottomed cylindrical metal tube,
A thermal element installed on the bottom inner surface of the metal tube and having a pair of terminal electrodes formed thereon;
A pair of lead wires connected to the pair of terminal electrodes,
A concave portion is formed on the inner surface of the bottom portion of the metal tube along the outer shape of the thermal element, and the bottom surface and the side surface of the thermal element are bonded in a state where the thermal element is fitted in the concave portion. Temperature sensor. 請求項１に記載の温度センサにおいて、
前記感熱素子が、絶縁基板上にサーミスタ薄膜が成膜された薄膜サーミスタ素子であることを特徴とする温度センサ。 The temperature sensor according to claim 1,
The temperature sensor, wherein the thermosensitive element is a thin film thermistor element in which a thermistor thin film is formed on an insulating substrate.
JP2009193668A 2009-08-24 2009-08-24 Temperature sensor Pending JP2011043486A (en)

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