JPH0434434Y2 - - Google Patents

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Publication number
JPH0434434Y2
JPH0434434Y2 JP1984196729U JP19672984U JPH0434434Y2 JP H0434434 Y2 JPH0434434 Y2 JP H0434434Y2 JP 1984196729 U JP1984196729 U JP 1984196729U JP 19672984 U JP19672984 U JP 19672984U JP H0434434 Y2 JPH0434434 Y2 JP H0434434Y2
Authority
JP
Japan
Prior art keywords
heat
insulating substrate
thin film
film sheet
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984196729U
Other languages
Japanese (ja)
Other versions
JPS61114339U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984196729U priority Critical patent/JPH0434434Y2/ja
Publication of JPS61114339U publication Critical patent/JPS61114339U/ja
Application granted granted Critical
Publication of JPH0434434Y2 publication Critical patent/JPH0434434Y2/ja
Expired legal-status Critical Current

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  • Fixing For Electrophotography (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

【考案の詳細な説明】 〔考案の技術分野〕 本考案は、複写機内部に設けられた加熱定着装
置の定着ローラのような回転体の表面温度を検出
する温度センサに関する。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a temperature sensor that detects the surface temperature of a rotating body such as a fixing roller of a heat fixing device provided inside a copying machine.

〔考案の技術的背景およびその問題点〕[Technical background of the invention and its problems]

電子複写機の加熱定着装置に使用される表面に
テフロンをコーテイングしたアルミニウムのシリ
ンダー状の定着ローラの表面温度を検出する温度
検出装置としては、前記回転する定着ローラの表
面に温度センサを直接に接触させて検出する方法
が一番有効であつた。
A temperature detection device for detecting the surface temperature of an aluminum cylindrical fixing roller whose surface is coated with Teflon used in a heat fixing device of an electronic copying machine includes a temperature sensor that is brought into direct contact with the surface of the rotating fixing roller. The most effective method was to detect the

このような方法として、実公昭59−39625号公
報記載の温度センサが知られている。
As such a method, a temperature sensor described in Japanese Utility Model Publication No. 59-39625 is known.

この温度センサは、塩化ビニール、ポリエステ
ル、ポリエチレン、ポリイミド等の樹脂、或いは
フツ素系樹脂等の柔軟性のある厚さ25〜200μm
の絶縁薄膜シート上に2本の導体箔を形成し、更
にその上に接着等の方法で前記の絶縁薄膜シート
と同材質の絶縁薄膜シートを形成した所謂フレキ
シブルプリント基板が使用されている。
This temperature sensor is made of flexible resin such as vinyl chloride, polyester, polyethylene, polyimide, or fluorine resin with a thickness of 25 to 200 μm.
A so-called flexible printed circuit board is used, in which two conductor foils are formed on an insulating thin film sheet, and an insulating thin film sheet made of the same material as the above-mentioned insulating thin film sheet is further formed thereon by a method such as adhesion.

そして、この絶縁薄膜シートに開孔部を形成し
てこれに感熱素子を搭載してフレキシブルプリン
ト基板の一部を保持体で保持させ、回転体の表面
に感熱素子の部分を密に接触させるものである。
Then, an opening is formed in this insulating thin film sheet, a heat-sensitive element is mounted thereon, a part of the flexible printed circuit board is held by a holder, and the part of the heat-sensitive element is brought into close contact with the surface of the rotating body. It is.

これにより、回転体の温度は薄い絶縁薄膜シー
トを介して感熱素子に伝達され、正確な温度の検
出が可能となる。
Thereby, the temperature of the rotating body is transmitted to the heat-sensitive element via the thin insulating thin film sheet, making it possible to accurately detect the temperature.

しかしながら、この温度センサはフレキシブル
プリント基板によつて構成されているために、そ
の柔軟性によつて回転体に対する接触圧を充分に
取ることができず、定着速度を上げるために定着
ローラの回転速度を早くすると、フレキシブルプ
リント基板が振動を生じ、感熱素子の密着が完全
ではなくなつて正確な温度検出ができなくなる欠
点があつた。
However, since this temperature sensor is constructed from a flexible printed circuit board, its flexibility does not allow for sufficient contact pressure against the rotating body. If the temperature is increased too quickly, the flexible printed circuit board will vibrate, and the heat-sensitive elements will not be in perfect contact with each other, making accurate temperature detection impossible.

又、温度センサの厚さが薄いために保持体に保
持させるのに、保持体である金属板の折曲げ、カ
シメ等で固定するか、ハトメのような固定具で固
定していたため精度の高い組立てや、小型化が困
難でもあつた。
In addition, since the temperature sensor is thin, it has to be held in the holder by bending or caulking the metal plate that is the holder, or by fixing it with a fixing device such as an eyelet, resulting in high accuracy. It was also difficult to assemble and downsize.

〔考案の目的〕[Purpose of invention]

本考案は、従来の温度センサの前述の欠点を除
去するためのもので、ポリイミド樹脂ガラス積層
板のような弾性体の絶縁基板によつて定着ローラ
の回転速度が早くなつた場合でも、十分な接触圧
によつて常に密着状態を保持し、正確な温度の検
出を可能ならしめると共に、保持体に対して精度
の高い組立ができ、小型化が可能な温度センサを
提供することを目的とするものである。
The present invention is intended to eliminate the above-mentioned drawbacks of conventional temperature sensors, and even when the rotation speed of the fixing roller is increased due to an elastic insulating substrate such as a polyimide resin glass laminate, the present invention provides a sufficient temperature sensor. The purpose of the present invention is to provide a temperature sensor that always maintains a close contact state by contact pressure, enables accurate temperature detection, can be assembled with high precision to a holder, and can be miniaturized. It is something.

〔考案の実施例〕[Example of idea]

以下に本考案の一実施例を、図面について説明
する。
An embodiment of the present invention will be described below with reference to the drawings.

1は、例えば厚さ0.4mmのポリイミド樹脂ガラ
ス積層板のような弾性体の絶縁基板で、その一面
には少くとも2本の銅箔等の導体箔2,2′がプ
リントされると共に、該導体箔2,2′間に、こ
れに隣接して開孔部3が形成されている。
1 is an elastic insulating substrate such as a polyimide resin glass laminate with a thickness of 0.4 mm, and at least two conductor foils 2 and 2' such as copper foil are printed on one side of the substrate. An opening 3 is formed between and adjacent to the conductor foils 2, 2'.

この開孔部3に感熱素子4を挿入してそのリー
ド線5,5′を導体箔2,2′に電気的に接続す
る。この接続方法としては、高温で使用される場
合には溶接が使用されるが、それ以外の場合には
ハンダ付けでよい。
A heat-sensitive element 4 is inserted into the opening 3, and its lead wires 5, 5' are electrically connected to the conductive foils 2, 2'. As this connection method, welding is used when used at high temperatures, but soldering may be used in other cases.

導体箔2,2′の他端には外部接続用の引出線
6がハンダ付けで電気的に接続されている。
A lead wire 6 for external connection is electrically connected to the other ends of the conductive foils 2, 2' by soldering.

7は、該引出線6を基板1に固定するためのチ
ユーブで、基板1にはチユーブ7を嵌着するため
の突片8が突設され、その先端はテーパ状の鉤止
部8′となつており、引出線6に嵌めたチユーブ
7を突片8に嵌めると、チユーブ7は鉤止部8′
で抜けなくなり、引出線6の基端が基板1に固定
される。
Reference numeral 7 designates a tube for fixing the lead wire 6 to the substrate 1, and the substrate 1 is provided with a protruding piece 8 for fitting the tube 7, the tip of which has a tapered hook portion 8'. When the tube 7 fitted to the leader wire 6 is fitted to the protrusion 8, the tube 7 is attached to the hooked part 8'.
The base end of the lead wire 6 is fixed to the substrate 1.

導体箔2,2′を形成した基板1の反対面には、
回転する定着ローラとの接触をスムースにして定
着ローラの表面に傷を付けないために、ポリイミ
ド系樹脂、シリコン系樹脂、フツ素系樹脂等から
成る減摩性の薄膜シート9が接着等の手段で配設
される。
On the opposite side of the substrate 1 on which the conductor foils 2 and 2' were formed,
In order to make smooth contact with the rotating fixing roller and prevent scratches on the surface of the fixing roller, an anti-friction thin film sheet 9 made of polyimide resin, silicone resin, fluorine resin, etc. is used as an adhesive or other means. It will be arranged in

この薄膜シート9の厚さは、耐摩耗性、熱応答
性の両者を満足させるため25〜200μm程度が適
当であり、又材質としては前記の樹脂の他にポリ
イミド系樹脂、又はフツ素系樹脂中にカーボン、
グラフアイト、二硫化モリブデン、窒化ホウ素、
アルミナ等の減摩材の微細粉末を少くとも一種添
加したものを使用すれば、耐摩耗性、熱応答性は
一層向上する。
The thickness of this thin film sheet 9 is suitably about 25 to 200 μm in order to satisfy both abrasion resistance and thermal responsiveness, and the material is polyimide resin or fluorine resin in addition to the above-mentioned resins. Carbon inside,
graphite, molybdenum disulfide, boron nitride,
If at least one kind of fine powder of anti-friction material such as alumina is added, the wear resistance and thermal response will be further improved.

この薄膜シート9は、開孔部3を覆うので感熱
素子4の保護をも果すものであり、又感熱素子4
と開孔部3の空間にシリコンゴムや更に熱伝導の
良好な樹脂を充填する等によつて熱応答性を改善
することも可能である。
This thin film sheet 9 covers the aperture 3 and therefore protects the heat sensitive element 4.
It is also possible to improve the thermal response by filling the space between the openings 3 with silicone rubber or a resin with good thermal conductivity.

更に、感熱素子4の保護のために、基板1の導
体箔2,2′面にも薄膜シート10を接着、被覆
し、導体箔2,2′の保護を兼ねさせ、或いは絶
縁性樹脂を塗布して導体箔2,2′を保護するこ
ともある。
Furthermore, in order to protect the heat-sensitive element 4, a thin film sheet 10 is adhered to and coated on the conductor foils 2 and 2' of the substrate 1 to also serve as protection for the conductor foils 2 and 2', or an insulating resin is coated. The conductor foils 2, 2' may also be protected.

或いは開孔部3にグリースのような流動体を入
れる場合には、前記薄膜シート10がこれを密封
する役目を果す。
Alternatively, when a fluid such as grease is introduced into the opening 3, the thin film sheet 10 serves to seal it.

上記のように形成された基板1は、金属板で形
成した保持体11によつて保持されるものである
が、保持体11は第3図の形状、構造の方法に限
定されるものではなく、温度センサの取付方法や
取付空間等によつて自由に変形できるものであ
る。
The substrate 1 formed as described above is held by a holder 11 formed of a metal plate, but the holder 11 is not limited to the shape and structure shown in FIG. , which can be freely modified depending on the mounting method and mounting space of the temperature sensor.

又、基板1は前記のような弾性体であるため充
分な弾力性があるので、取付空間等に制限がある
場合には、基板1に取付用の孔を設け、直接に定
着ローラを支持する枠体にネジ等で取付けること
も可能で、この場合には保持体11は必要としな
い。
Further, since the substrate 1 is an elastic body as described above, it has sufficient elasticity, so if there is a limitation in the mounting space, a hole for mounting can be provided in the substrate 1 and the fixing roller can be directly supported. It is also possible to attach it to the frame with screws or the like, and in this case, the holder 11 is not required.

更に、基板1の角部によつて定着ローラのコー
テイング面を傷つけるおそれがある場合には、第
4図のように薄膜シート9を基板1の外まではみ
出すように大きくし、これを防止することもでき
る。
Furthermore, if there is a possibility that the coating surface of the fixing roller may be damaged by the corners of the substrate 1, the thin film sheet 9 should be made large enough to protrude outside the substrate 1 as shown in FIG. 4 to prevent this. You can also do it.

〔考案の効果〕[Effect of idea]

本考案は、前記したように、耐熱性、弾性を有
する絶縁基板の開孔部に感熱素子を配置すると共
に、該絶縁基板の裏面に耐熱性の薄膜シートを接
着したので、感熱素子は薄膜シートを介して定着
ローラと対向することとなり、従つて、感熱素子
への熱伝導が良好となつて熱応答特性の優れた温
度センサを得ることができ、また、絶縁基板に形
成した導体箔に感熱素子のリード線を接続したの
で、感熱素子の絶縁基板への固定が簡単に行える
と共にリード線の断線の恐れもない等の効果を有
するものである。
As described above, in the present invention, a heat-sensitive element is placed in the opening of an insulating substrate having heat resistance and elasticity, and a heat-resistant thin film sheet is bonded to the back surface of the insulating substrate. Therefore, heat conduction to the heat-sensitive element is good, and a temperature sensor with excellent thermal response characteristics can be obtained. Since the lead wires of the elements are connected, the heat-sensitive element can be easily fixed to the insulating substrate, and there is no fear of breakage of the lead wires.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示すもので、第1図
は絶縁基板の平面図、第2図は感熱素子部での縦
断面図、第3図は斜面図、第4図は他の実施状態
の要部の斜面図である。 1……絶縁基板、2,2′……導体箔、3……
開孔部、4……感熱素子、5……感熱素子のリー
ド線、6……外部引出用の引出線、9……薄膜シ
ート。
The drawings show one embodiment of the present invention, in which Fig. 1 is a plan view of an insulating substrate, Fig. 2 is a vertical cross-sectional view of the heat-sensitive element section, Fig. 3 is a slope view, and Fig. 4 is a diagram of another embodiment. It is a perspective view of the main part of a state. 1... Insulating substrate, 2, 2'... Conductor foil, 3...
Opening portion, 4... Heat-sensitive element, 5... Lead wire of heat-sensitive element, 6... Lead wire for external extraction, 9... Thin film sheet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ポリイミド樹脂ガラス積層板からなる耐熱性、
弾性を有する絶縁基板と、該絶縁基板上に設けら
れた少なくとも2本の導体箔および該導体箔に隣
接して形成された開孔部と、前記導体箔にリード
線が電気的に接続されて前記開孔部に挿入されて
いる感熱素子と、前記導体箔に接続された外部導
出用の引出線と、前記絶縁基板の回転体発熱面に
接する面に前記開孔部を含んで接着されている耐
熱性の薄膜シートとより構成したことを特徴とす
る温度センサ。
Heat resistant, made of polyimide resin glass laminate
An elastic insulating substrate, at least two conductive foils provided on the insulating substrate, an opening formed adjacent to the conductive foil, and a lead wire electrically connected to the conductive foil. A heat-sensitive element inserted into the opening, an external lead wire connected to the conductor foil, and a surface of the insulating substrate that is in contact with the heat generating surface of the rotating body, including the opening, are bonded. A temperature sensor characterized by being composed of a heat-resistant thin film sheet.
JP1984196729U 1984-12-28 1984-12-28 Expired JPH0434434Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984196729U JPH0434434Y2 (en) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984196729U JPH0434434Y2 (en) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114339U JPS61114339U (en) 1986-07-19
JPH0434434Y2 true JPH0434434Y2 (en) 1992-08-17

Family

ID=30754582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984196729U Expired JPH0434434Y2 (en) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH0434434Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075497Y2 (en) * 1987-07-23 1995-02-08 株式会社テック Fixing device
EP2851664B1 (en) * 2012-05-14 2019-06-05 Shenzhen Minjie Electronic Technology Co., Ltd. Surface temperature measuring sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349484A (en) * 1976-10-18 1978-05-04 Ricoh Co Ltd Temperature detecting method
JPS561323A (en) * 1979-06-18 1981-01-09 Canon Inc Contact-type temperature detector
JPS59155732A (en) * 1983-02-25 1984-09-04 Kyushu Hitachi Maxell Ltd Electronic clinical thermometer
JPS5942932B2 (en) * 1979-04-26 1984-10-18 河村電器産業株式会社 Circuit breaker contact opening/closing mechanism

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942932U (en) * 1982-09-14 1984-03-21 石塚電子株式会社 thermal device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349484A (en) * 1976-10-18 1978-05-04 Ricoh Co Ltd Temperature detecting method
JPS5942932B2 (en) * 1979-04-26 1984-10-18 河村電器産業株式会社 Circuit breaker contact opening/closing mechanism
JPS561323A (en) * 1979-06-18 1981-01-09 Canon Inc Contact-type temperature detector
JPS59155732A (en) * 1983-02-25 1984-09-04 Kyushu Hitachi Maxell Ltd Electronic clinical thermometer

Also Published As

Publication number Publication date
JPS61114339U (en) 1986-07-19

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