JPS5942932U - thermal device - Google Patents
thermal deviceInfo
- Publication number
- JPS5942932U JPS5942932U JP13834382U JP13834382U JPS5942932U JP S5942932 U JPS5942932 U JP S5942932U JP 13834382 U JP13834382 U JP 13834382U JP 13834382 U JP13834382 U JP 13834382U JP S5942932 U JPS5942932 U JP S5942932U
- Authority
- JP
- Japan
- Prior art keywords
- thermal device
- heat
- mounting part
- sensitive device
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の感熱装置の一例を示し、ａは平面図、ｂ
は同上のｂ−ｂ線断面図、第２〜５図は本考案に係る感
熱装置の実施例を示し、第２図は第１実施例の斜視図、
第３図は同上の■−■線断面図、第４図は第２実施例の
要部の平面図、第５因は第３実施例の断面図である。
１１−・・取付部、１ｌａ−・・受熱部、ＩＩＣ，ＩＩ
Ｃ”′・・・スリット、１１ｄ、 １１ｄ’・・・連
結部、２・・・感熱素子。Figure 1 shows an example of a conventional heat-sensitive device, where a is a plan view and b
is a cross-sectional view taken along line bb--b of the same as above, FIGS. 2 to 5 show an embodiment of the heat-sensitive device according to the present invention, and FIG. 2 is a perspective view of the first embodiment.
FIG. 3 is a sectional view taken along the line ■--■, same as above, FIG. 4 is a plan view of the main part of the second embodiment, and the fifth factor is a sectional view of the third embodiment. 11-...Mounting part, 1la-...Heat receiving part, IIC, II
C"'...Slit, 11d, 11d'...Connecting portion, 2...Thermosensitive element.
Claims (1)
も１重のスリットで囲まれる凹部に形成された受熱部を
、該取付部に対し回動可能となるように連結部を介して
形成し、かつ受熱部に感熱素子を取付けて成ることを特
徴とする感熱装置。A heat receiving part formed in a recess surrounded by at least one slit is attached to a mounting part that is elastically pressed against the temperature measuring object through a connecting part so as to be rotatable with respect to the mounting part. What is claimed is: 1. A heat-sensitive device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13834382U JPS5942932U (en) | 1982-09-14 | 1982-09-14 | thermal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13834382U JPS5942932U (en) | 1982-09-14 | 1982-09-14 | thermal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5942932U true JPS5942932U (en) | 1984-03-21 |
Family
ID=30310436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13834382U Pending JPS5942932U (en) | 1982-09-14 | 1982-09-14 | thermal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942932U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61114339U (en) * | 1984-12-28 | 1986-07-19 | ||
| JPS63205530A (en) * | 1987-02-20 | 1988-08-25 | Ishizuka Denshi Kk | Temperature sensor |
| JPS63181835U (en) * | 1987-05-13 | 1988-11-24 | ||
| US7039335B2 (en) | 2002-06-14 | 2006-05-02 | Brother Kogyo Kabushiki Kaisha | Temperature sensor, heat fixing device, and image forming device |
| JP2018138872A (en) * | 2017-02-24 | 2018-09-06 | 三菱マテリアル株式会社 | Temperature sensor |
-
1982
- 1982-09-14 JP JP13834382U patent/JPS5942932U/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61114339U (en) * | 1984-12-28 | 1986-07-19 | ||
| JPS63205530A (en) * | 1987-02-20 | 1988-08-25 | Ishizuka Denshi Kk | Temperature sensor |
| JPS63181835U (en) * | 1987-05-13 | 1988-11-24 | ||
| US7039335B2 (en) | 2002-06-14 | 2006-05-02 | Brother Kogyo Kabushiki Kaisha | Temperature sensor, heat fixing device, and image forming device |
| JP2018138872A (en) * | 2017-02-24 | 2018-09-06 | 三菱マテリアル株式会社 | Temperature sensor |
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