JPS5953242U - thermal device - Google Patents
thermal deviceInfo
- Publication number
- JPS5953242U JPS5953242U JP14710182U JP14710182U JPS5953242U JP S5953242 U JPS5953242 U JP S5953242U JP 14710182 U JP14710182 U JP 14710182U JP 14710182 U JP14710182 U JP 14710182U JP S5953242 U JPS5953242 U JP S5953242U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- hole
- thermal device
- receiving plate
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Fixing For Electrophotography (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の感熱装置の一例を示し、ａは平面図、ｂ
は同上のｂ−ｂ線断面図、第２〜５図は本考案に係る感
熱装置の実施例を示し、第２図は第一 １の実施例の斜
視図、第３図は同上の■−■線断面図、第４図は第２の
実施例の要部の平面図、第５図は第３の実施例の断面図
である。
１１・・・取付部、１１Ｃ・・・孔、２・・・感熱素子
、４・・・受熱板、４ｂ・・・突起部。Figure 1 shows an example of a conventional heat-sensitive device, where a is a plan view and b is a plan view.
2 is a cross-sectional view taken along line bb--b of the same as above, FIGS. 2 to 5 show an embodiment of the heat-sensitive device according to the present invention, FIG. 4 is a plan view of the main part of the second embodiment, and FIG. 5 is a sectional view of the third embodiment. DESCRIPTION OF SYMBOLS 11... Attachment part, 11C... Hole, 2... Heat sensitive element, 4... Heat receiving plate, 4b... Projection part.
Claims (1)
、この孔に感熱素子を取付けた受熱板を−臨ませると共
に該受熱板に形成された突記起部を上記取付部に固定し
て成る感熱装置。A hole is formed in the mounting part that is elastically pressed against the temperature-measuring object, and the heat receiving plate with the heat-sensitive element attached thereto faces the hole, and the protrusion formed on the heat receiving plate is inserted into the mounting part. A heat-sensitive device that is fixed to a
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14710182U JPS5953242U (en) | 1982-09-30 | 1982-09-30 | thermal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14710182U JPS5953242U (en) | 1982-09-30 | 1982-09-30 | thermal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5953242U true JPS5953242U (en) | 1984-04-07 |
Family
ID=30327224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14710182U Pending JPS5953242U (en) | 1982-09-30 | 1982-09-30 | thermal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5953242U (en) |
-
1982
- 1982-09-30 JP JP14710182U patent/JPS5953242U/en active Pending
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