JP6756342B2 - Temperature sensor device - Google Patents

Description

The present invention relates to a temperature sensor device that can be easily attached to an object whose temperature is desired to be detected and has high reliability in temperature detection.

As a temperature sensor device that can be attached to an object whose temperature is desired to be detected, for example, the temperature sensor device shown in Patent Document 1 below is known. In this temperature sensor device, a sensor protector (sensor body) that protects the element is attached by a spring force in the housing of the metal terminal.

However, in this type of conventional temperature sensor device, the sensor protector is attached by the spring force of the metal terminal, and an air gap is formed between the sensor protector and the metal terminal. Therefore, there is a problem that the temperature of the measurement object transmitted to the metal terminal is not satisfactorily transmitted to the sensor protector, and the temperature of the measurement object and the measurement temperature have a large divergence.

JP-A-2017-143249

The present invention has been made in view of such an actual situation, and an object of the present invention is to provide a temperature sensor device that is easy to install, has excellent reliability, and has excellent temperature detection characteristics.

In order to achieve the above object, the temperature sensor device according to the present invention
With a thermal element
A sensor protector containing the heat sensitive element inside,
A temperature sensor device having an element arrangement portion that covers the periphery of the tip end portion of the sensor protector, and a mounting bracket having an external mounting portion that can be detachably attached to an external mounting object.
The element arrangement portion of the mounting bracket has a base plate that comes into contact with a temperature measurement target, and a wall plate that is formed so as to surround the sensor protection body from the base plate.
A slit with a predetermined gap is formed in one place in the circumferential direction of the wall plate.
An adhesive is filled between the wall plate and the sensor protector, and the adhesive can be exposed to the outside through the slit.

In the temperature sensor device according to the present invention, by inserting the tip of the sensor protector into the element placement portion of the mounting bracket, the adhesive pre-filled inside the element placement portion is applied to the tip of the sensor protector. It flows uniformly in the gap between the part and the element arrangement part of the mounting bracket. Then, the excess adhesive spreads in the gaps between the slits, and the excess adhesive is exposed to the outside through the slits. That is, the presence of the slit allows the adhesive to be evenly distributed in the gap between the tip of the sensor protector and the element arrangement portion of the mounting bracket.

Therefore, in the temperature sensor device according to the present invention, the tip end portion of the sensor protector and the element arrangement portion of the mounting bracket are in contact with each other with almost no gap via an adhesive, and the sensor protector including the heat-sensitive element has an element arrangement. It is well fixed to the mounting bracket that has the part. That is, the thermal element is hard to be peeled off from the mounting bracket, and the reliability of the temperature detection characteristic by the thermal element is improved.

Further, a wall plate provided in the element arrangement portion of the mounting bracket covers the periphery of the tip portion of the sensor protective body including the heat sensitive element inside. Therefore, heat dissipation from the periphery of the thermal element is prevented, and the temperature of the measurement target is uniformly transmitted around the thermal element through the peripheral wall of the element arrangement portion, the adhesive and the sensor protector. Therefore, the temperature detection characteristic by the thermal element is improved.

Further, in the temperature sensor device according to the present invention, since the mounting bracket is provided with an external mounting portion in which, for example, a screw hole is formed, the external mounting portion may be directly mounted on the temperature measurement object. , Can be easily mounted near temperature objects. That is, in the present invention, the temperature sensor device can be easily attached to or near the temperature measurement object with fasteners such as screws, bolts, or clips.

Preferably, the wall plate is formed with an inwardly convex portion that presses the sensor protector against the base plate. By pressing the sensor protector against the base plate, the sensor protector and the base plate are in close contact with each other, and the temperature of the object to be measured transmitted to the mounting bracket can be easily transmitted from the base plate to the sensor protector, and the temperature can be detected. The accuracy of is improved.

Preferably, the inwardly convex portion is formed along the direction in which the tip end portion of the sensor protective body is inserted into the inside of the element arrangement portion. With this configuration, the tip of the sensor protector can be easily inserted into the element arrangement portion while the inwardly convex portion contacts the outer peripheral surface of the sensor protector.

Preferably, at least one of the inwardly convex portions is formed near the slit and along the longitudinal direction of the slit. With this configuration, the elasticity of the wall plate makes it possible for the inward convex portion to come into contact with the outer peripheral surface of the sensor protective body, and the sensor protective body can be easily pressed against the inner surface of the base plate.

Preferably, the wall plate has a pair of side wall pieces formed on both sides of the base plate and a ceiling piece formed on at least one of the pair of side wall pieces.
The inwardly convex portion is formed on the ceiling piece.
The distance from the apex of the convex portion of the inward convex portion to the base plate is equal to or less than the thickness of the sensor protective body.

With this configuration, the elasticity of the side wall piece and the ceiling piece makes it possible for the inward convex portion to come into contact with the outer peripheral surface of the sensor protective body, and the sensor protective body can be easily pressed against the inner surface of the base plate.

Preferably, the wall plate has a pair of side wall pieces formed on both sides of the base plate, a ceiling piece formed on at least one of the pair of side wall pieces, and a tip surface of the sensor protector. Has a tip piece that covers the
The predetermined gap of the slit is larger than the gap of the butt portion between the tip piece and the base plate.

With such a configuration, the adhesive does not squeeze out from the gap of the abutting portion between the tip piece and the base plate, and the adhesive can be selectively squeezed out from the slit. Since the slit is formed in a portion where no inconvenience occurs even if the adhesive squeezes out, it does not have an adverse effect on the temperature detection characteristic of the temperature sensor device and the mounting characteristic of the mounting bracket.

Preferably, the wall plate covers 95% or more of the entire circumference of the tip of the sensor protector. The predetermined gap of the slit is preferably 5% or less with respect to the entire circumference of the tip of the sensor protector.

FIG. 1A is a perspective view of a temperature sensor device according to an embodiment of the present invention. FIG. 1B is a perspective view of a temperature sensor device according to another embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of the temperature sensor device shown in FIG. 1A. FIG. 3A is a cross-sectional view taken along the line III-III of the temperature sensor device shown in FIG. 1A.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

1st Embodiment As shown in FIG. 1A, the temperature sensor device 2 according to the embodiment of the present invention has a sensor protection body 40 incorporating the heat sensitive element 4 shown in FIG. As shown in FIG. 2, the heat-sensitive element 4 has an element body 6 and a coating layer 7 that covers the outer periphery of the element body 6.

The element body 6 is not particularly limited as long as it can detect the temperature, and for example, an NTC (Negative Temperature Coefficient) thermistor element, a PTC (Positive Temperature Coefficient) thermistor element, or the like is used. The coating layer 7 is made of an insulating resin, glass, or the like. The resin constituting the coating layer 7 is not particularly limited, and for example, epoxy resin, urethane resin, silicon resin, ABS resin, PPS resin, PBT resin and the like are used. Further, the glass constituting the coating layer 7 is not particularly limited.

The tip portions of the pair of lead wires 8 and 8 are connected to the element body 6, respectively. The tip ends of the core wires of the lead cables 18 and 18 are connected to the base ends of the lead wires 8 and 8 by caulking or the like at the connection portions, respectively. The connection portion between the lead wires 8 and 8 and the core wire may be a connection portion such as solder or welding other than caulking. Through the core wires of the lead cables 18 and 18, the temperature signal detected by the element body 6 of the heat sensitive element 4 can be transmitted to other devices such as a measuring device and a control device.

The lead cables 18 and 18 are not particularly limited, and for example, vinyl chloride electric wires, polyethylene electric wires, silicon electric wires, fluorine electric wires and the like are used. The core wires of the pair of lead cables 18 and 18 are each covered and insulated by an insulating film. The core wires of the lead cables 18 and 18 are made of a conductive material such as copper, iron, or aluminum. The lead wires 8 and 8 are made of a conductive material such as copper, iron, nickel, and jumet wire.

The pair of lead wires 8 drawn from the heat sensitive element 4 and the connecting portion are held by a lead holding member (lead holding portion) 20 or the like. The lead holding member 20 is fixed inside the sensor protection body 40. The sensor protective body 40 has a bottomed tubular outer resin 40a and an inner resin 40b filled inside the outer resin 40a. A heat sensitive element 4 and a lead holding member 20 are embedded together with the inner resin 40b inside the outer resin 40a.

As shown in FIG. 1A, the mounting bracket 30 has a flat plate-shaped external mounting portion 31 and an element arranging portion 32 integrally molded with the external mounting portion 31. A mounting hole 31a is formed in the external mounting portion 31, and the external mounting portion 31 can be easily mounted on or near the temperature measuring object by passing a bolt or a screw through the mounting hole 31a.

As shown in FIG. 2, the element arrangement portion 32 of the mounting bracket 30 has a base plate (base portion) 33 that is continuously integrated in the X-axis direction from the flat plate-shaped external mounting portion 31. The outer surface of the flat plate-shaped base plate 33 is substantially flush with the outer surface of the external mounting portion 31. The width of the base plate 33 in the Y-axis direction is preferably smaller than the width of the external mounting portion 31 in the Y-axis direction. As shown in FIG. 3, wall plates 34 are raised in the Z-axis direction from both ends of the base plate 33 in the Y-axis direction. In the drawings, the X-axis, the Y-axis, and the Z-axis are perpendicular to each other, and the X-axis coincides with the longitudinal direction of the temperature sensor device 2.

As shown in FIG. 3, the pair of wall plates 34 and 34 each have a substantially L-shape in a cross section substantially perpendicular to the X axis, and the protruding tip portions 34a and 34a are brought into contact with each other in the present embodiment. Instead, a slit 37 having a predetermined gap t0 is formed. The wall plates 34, 34 have a shape that covers the entire periphery of the heat sensitive element 4 with a predetermined gap as a whole. In the present embodiment, the base plate 33 and the wall plate 34 form a peripheral wall that covers the periphery of the tip end portion of the sensor protective body 40 including the heat sensitive element 4 in the X-axis direction with a predetermined gap.

As shown in FIG. 3, the wall plate 34 is a pair of side wall pieces 35 formed on both sides of the base plate 33 in the Y-axis direction, and a ceiling piece 36 formed on each of the pair of side wall pieces 35, 35. , 36 and. Further, as shown in FIG. 2, the wall plate 34 has a tip piece 38 that covers the tip surface 44 of the sensor protection body 40. The tip piece 38 is integrally formed by bending from the ceiling piece 36.

As shown in FIG. 1A, the tip piece 38 formed by bending from the tip of each ceiling piece 36 in the X-axis direction has a butt portion 39a formed with the base plate 33 in the X-axis direction of the side wall piece 35. A butt portion 39b is formed with the end portion. The gap between the butt portions 39a and 39b is smaller than the gap t0 (see FIG. 3) of the slit 37 between the ceiling pieces 36 and 36, and may be almost 0. Further, the gap between the slits 37a between the tip pieces 38 may be the same as the gap t0 between the slits 37 between the ceiling pieces 36 and 36, or may be smaller.

As shown in FIG. 2, the tip of the sensor protector 40 enters the inside of the peripheral wall composed of the base plate 33 and the pair of wall plates 34, and the tip surface 42 of the sensor protector 40 is the tip piece 38. It faces the inner surface of the surface, and the gap in the X-axis direction is 0 to 1 mm. The adhesive 50 is also filled in the gap between the tip surface 42 of the sensor protector 40 and the inner surface of the tip piece 38.

In the present embodiment, the sensor protective body 40 has a substantially rectangular parallelepiped shape as a whole, and its length X1 in the X-axis direction is long enough to cover the heat sensitive element 4, the lead holding member 20, and the tip of the lead cable 18. This is longer than the internal accommodation length X2 of the element arrangement portion 32 of the mounting bracket 30 in the X-axis direction. X2 / X1 is preferably about 1/4 to 3/4. The tip portion of the sensor protector 40 in which the thermal element 4 is embedded is located within the range of the internal accommodation length X2 in the X-axis direction of the element arrangement portion 32.

Further, as shown in FIG. 3, the width Y1 of the sensor protector 40 in the Y-axis direction is preferably smaller than the width Y2 in the Y-axis direction between the side wall pieces 35 of the element holding portion 32. It is preferable that a predetermined gap ((Y2-Y1) / 2) is formed between the outer surface of the sensor protective body 40 in the Y-axis direction and the inner surface of the side wall piece 35. The predetermined gap ((Y2-Y1) / 2) is preferably 0 to 0.2 mm, and the gap is also filled with the adhesive 50.

In the present embodiment, the height Z1 of the sensor protector 40 in the Z-axis direction is preferably smaller than the height Z2 in the Z-axis direction between the base plate 33 of the element holding portion 32 and the ceiling piece 36. It is preferable that a predetermined gap (Z2-Z1) is formed between the outer upper surface of the sensor protective body 40 in the Z-axis direction and the inner surface of the ceiling piece 36. The predetermined gap (Z2-Z1) is preferably 0 to 0.5 mm, and the gap is also filled with the adhesive 50. Further, inward convex portions 34b and 34b are formed on the inner surface of each ceiling piece 36 at a protruding height corresponding to the gap (Z2-Z1).

The adhesive 50 is not particularly limited, and examples thereof include epoxy-based, acrylic-based, phenol-based, and silicone rubber-based adhesives. The adhesive 50 may contain fillers such as silica, alumina, and magnesium hydroxide.

In FIG. 3, the distance from the apex of the convex portion of the inward convex portion 34b to the base plate 33 is the same as the thickness Z1 of the sensor protective body 40 in the Z-axis direction. However, in the state before the sensor protective body 40 is inserted into the internal space 32a of the element arranging portion 32, the distance from the convex portion apex of the inward convex portion 34b to the base plate 33 is the Z axis of the sensor protective body 40. It is preferably equal to or less than the directional thickness Z1. This is to ensure that the inwardly convex portion 34b is in contact with the upper surface of the sensor protective body 40 in the Z-axis direction. However, the inwardly convex portion 34b does not necessarily have to come into contact with the upper surface of the sensor protective body 40 in the Z-axis direction.

As shown in FIG. 1A, the inwardly convex portions 34b and 34b are formed continuously along the direction (X-axis) in which the tip end portion of the sensor protective body 40 is inserted into the element arrangement portion 32. , May be formed intermittently. Further, the inwardly convex portions 34b and 34b are formed continuously along the longitudinal direction (X-axis direction) of the slit 37 near the slit 37, but may be formed intermittently.

In the present embodiment, the outer resin 40a and the inner resin 40b constituting the sensor protective body 40 are composed of insulating members, and may be the same or different from each other, and are not particularly limited, but are injection-moldable resins. For example, epoxy resin, urethane resin, silicon resin, ABS resin, PPS resin, PTB resin and the like are exemplified. Fillers and the like may be mixed in the resin.

Further, the mounting bracket 30 is formed by pressing and bending a plate material made of, for example, a copper alloy such as copper or brass, a metal such as stainless steel such as iron, aluminum or SUS, or another conductive material. Can be done. That is, the external mounting portion 31 and the element arranging portion 32 of the mounting bracket 30 can be formed from a single metal plate.

In order to manufacture the temperature sensor device 2 shown in FIG. 1A, first, as shown in FIG. 2, an adhesive is previously provided in the internal space 32a surrounded by the base plate 33 and the wall plate 34 of the element arrangement portion 32 of the mounting bracket 30. 50 is filled, and the tip end portion of the sensor protection body 40 is inserted into the internal space 32a of the element arrangement portion 32 of the mounting bracket 30.

The internal space 32a of the element arranging portion 32 is opened at the rear end portion of the element arranging portion 32 in the X-axis direction, and the tip portion 38 is closed by the tip piece 38. As shown in FIG. 1A, slits 37a are formed between the tip pieces 38 and 38, and slits 37 are also formed between the ceiling pieces 36 and 36, and these slits 37a and 37. Through this, the internal space 32a communicates with the outside of the element arrangement portion 32.

When the tip of the sensor protection body 40 is inserted into the internal space 32a of the element placement portion 32 of the mounting bracket 30, the adhesive 50 previously filled inside the element placement portion 32 is attached to the tip of the sensor protection body 40. It flows uniformly in the gap between the metal fitting 30 and the element arrangement portion 32. Then, the excess adhesive 50 spreads in the gaps between the slits 37 and 37a, and the excess adhesive is exposed to the outside through the slits 37 and 37a. That is, the presence of the slits 37 and 37a allows the adhesive to be uniformly distributed in the gap between the tip of the sensor protective body 40 and the element arranging portion 32 of the mounting bracket 30.

In the temperature sensor device 2 according to the present embodiment, the tip end portion of the sensor protection body 40 and the element arrangement portion 32 of the mounting bracket 30 are in contact with each other with almost no gap via an adhesive, and the heat sensitive element 4 shown in FIG. The sensor protector 40 including the sensor protector 40 is satisfactorily fixed to the mounting bracket 30 having the element arrangement portion 32. That is, the thermal element 4 is hard to be peeled off from the mounting bracket 30, and the reliability of the temperature detection characteristic by the thermal element 4 is improved.

Further, a wall plate 34 provided in the element arrangement portion 32 of the mounting bracket 30 covers the periphery of the tip portion of the sensor protective body 40 including the heat sensitive element 4 inside. Therefore, heat dissipation from the surroundings of the heat sensitive element 4 is prevented, and the temperature of the measurement target is uniformly transmitted around the heat sensitive element 4 through the peripheral wall of the element arrangement portion 32, the adhesive 50, and the sensor protector 40. Therefore, the temperature detection characteristic by the thermal element 4 is improved.

Further, in the temperature sensor device 2 according to the present embodiment, since the mounting bracket 30 is provided with an external mounting portion 31 in which, for example, a screw hole is formed, the external mounting portion 31 is a temperature measurement object. It can be mounted directly on the surface or easily mounted near a temperature object. That is, in the present embodiment, the temperature sensor device 2 can be easily attached to or near the temperature measurement object with a fastener such as a screw, a bolt, or a clip.

Further, as shown in FIG. 3, the ceiling piece 36 of the wall plate 34 is formed with an inward convex portion 34b that presses the sensor protective body 40 against the base plate 33. When the sensor protective body 40 is pressed against the base plate 33, the sensor protective body 40 and the base plate 33 are brought into close contact with each other, and the temperature of the object to be measured transmitted to the base plate 33 of the mounting bracket 30 is measured from the base plate 33 to the sensor. It becomes easier to transmit to the tip of the protective body 40, and the accuracy of temperature detection is improved.

Further, the inwardly convex portion 34b is formed along the X-axis direction in which the tip end portion of the sensor protective body 40 is inserted into the internal space 32a of the element arrangement portion 32. With this configuration, the tip portion of the sensor protective body 40 can be easily inserted into the element arranging portion 32 while the inwardly convex portion 34b is in contact with the outer peripheral surface of the sensor protective body 40.

Furthermore, the inward convex portion 34b is formed near the slit 37 along the X-axis which is the longitudinal direction of the slit 37. With this configuration, the elastic inward convex portion 34b of the side wall piece 35 and the ceiling piece 36 extending in a cantilever shape from both sides of the base plate 33 in the Y-axis direction is the outer peripheral surface of the sensor protective body 40. It becomes possible to abut the sensor protector 40 against the inner surface of the base plate 33.

Further, the wall plate 34 has a pair of side wall pieces 35 formed on both sides of the base plate 33 and a ceiling piece 36 formed on both of the pair of side wall pieces 35, and the inward convex portion 34b It is formed on the ceiling pieces 36 and 36. Then, in the state before the sensor protective body 40 is inserted, the distance from the apex of the convex portion of the inward convex portion 34b to the base plate 33 is equal to or less than the thickness of the sensor protective body 40. With this configuration, the elasticity of the side wall piece 35 and the ceiling piece 36 makes it possible for the inward convex portion 34b to come into contact with the outer peripheral surface of the sensor protective body 40, and the sensor protective body 40 is attached to the base plate 33. It becomes easier to press against the inner surface.

Further, in the present embodiment, as shown in FIG. 1A, the predetermined gaps of the slits 37 and 37a are larger than the gaps of the butt portions 39a between the tip piece 38 and the base plate 33. Further, the predetermined gaps of the slits 37 and 37a are larger than the gap of the butt portion 39b between the tip piece 38 and the side wall piece 35.

With this configuration, the adhesive does not protrude from the gap of the butt portion 39a between the tip piece 38 and the base plate 33, and the gap between the butt portion 39b between the tip piece 38 and the side wall piece 35. The adhesive can be selectively squeezed out from the slits 37 and 37a without squeezing out from the slits 37 and 37a. The slits 37 and 37a are located far from the lower surface of the base plate 33, which is the temperature detection surface, and are formed in a portion where no inconvenience occurs even if the adhesive squeezes out. Therefore, the temperature detection characteristics of the temperature sensor device 2 and the mounting characteristics of the mounting bracket are less likely to be adversely affected. The adhesive protruding from the slits 37 and 37a may be removed.

As shown in FIG. 3, in the present embodiment, the wall plate 34 covers the entire circumference of the tip of the sensor protection body 40 by 95% or more. The predetermined gap t0 of the slit 37 is preferably 5% or less, more preferably 0.5 to 4% or less, based on the entire circumference of the tip of the sensor protective body 40.

For example, the lower surface of the base plate 33 was attached to the object to be measured, and the temperature was measured by the thermal element 4. Compared with the temperature sensor device (predetermined gap t0 of the slit 37 is 40% or more) according to the reference example in which the ceiling pieces 36 and 36 and the tip piece 38 are not shown in FIG. 1A, the temperature sensor device of the present embodiment ( When the predetermined gap t0 of the slit 37 is 4%), the temperature divergence characteristic is improved by 25% or more.

2nd Embodiment As shown in FIG. 1B, the temperature sensor device 2a according to another embodiment of the present invention is the same as the temperature sensor device 2 according to the above-described first embodiment except for the following, and is common. The description of the part to be used is omitted. Further, the common members in the drawings are designated by the common members.

In the present embodiment, as shown in FIG. 1B, the configuration of the mounting bracket 130 is different from that of the mounting bracket 30 of the first embodiment, and other parts are common. In the present embodiment, the element arranging portion 132 of the mounting bracket 130 includes a base plate 33 and a pair of wall plates 134 and 234 raised from both sides of the base plate 33 in the Y-axis direction. One wall plate 234 is composed of only the side wall piece 235, and the other wall plate 134 is formed by bending from the side wall piece 135, the ceiling piece 136 formed by bending from the side wall piece 135, and the ceiling piece 136. It is composed of a tip piece 138.

In the present embodiment, a slit 37 having a predetermined gap t0 is formed at the abutting portion between the ceiling piece 136 and the side wall piece 234. No gap is formed between the butt portion 39a between the tip piece 138 and the base plate 33 and the butt portion 39b between the tip piece 138 and the side wall pieces 135 and 235, or a gap narrower than the predetermined gap t0 is formed. .. On the single ceiling piece 136, two inwardly convex portions 34b are formed side by side along the X axis. Although the tip piece 136 is formed by bending from the ceiling piece 136, it may be formed by bending from any one of the side wall pieces 135 or 235. The temperature sensor device 2a of the present embodiment also has the same action and effect as the temperature sensor device 2 of the first embodiment described above.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

For example, it is not always necessary to form a mounting hole 31a in the external mounting portion 31. For example, by inserting the external mounting portion 31 into the insertion groove provided in the mounting portion provided on or near the temperature measuring object, the temperature sensor device can be easily and detachably attached to the mounting portion on or near the temperature measuring object. May be good. Alternatively, the temperature sensor device 2 may be attached to the attachment portion of the temperature measurement object or its vicinity by adhering the external attachment portion 31 to the attachment portion of the temperature measurement object or its vicinity.

Further, the cross-sectional shape of the peripheral wall including the base plate 33 and the wall plate 34 in the element arrangement portion 32 is not limited to a quadrangle as a whole, but is a triangle or other polygonal cylinder shape, a circular or elliptical shape, or another irregular shape. But it's okay.

Further, in the above-described embodiment, the flat plate-shaped external mounting portion 31 and the base plate 33 are formed on the same plane, but a stepped portion or a curved surface portion is provided between them so that they are on the same plane. It may be configured so that it is not located at.

Further, in the above-described embodiment, the slit 37 having the predetermined gap t0 is formed in a straight line parallel to the X-axis, but may be inclined or meandering with respect to the X-axis.

2,2a ... Temperature sensor device 4 ... Heat-sensitive element 6 ... Element body 7 ... Coating layer 8 ... Lead wire 18, 18 ... Lead cable 20 ... Lead holding member 30, 130 ... Mounting bracket 31 ... External mounting part 31a ... Mounting hole 32 , 132 ... Element placement unit 32a ... Internal space 33 ... Base plate (base)
34,134,234 ... Wall plate 34a ... Protruding tip 34b ... Inward convex part 35,135,235 ... Side wall piece 36,136 ... Ceiling piece 37 ... Slit 38,138 ... Tip piece 39 ... Butting part 40 ... Sensor protector 40a ... Outer resin 40b ... Inner resin 42 ... Tip surface 50 ... Adhesive

Claims (6)

With a thermal element
A sensor protector containing the heat sensitive element inside,
A temperature sensor device having an element arrangement portion that covers the periphery of the tip end portion of the sensor protector, and a mounting bracket having an external mounting portion that can be detachably attached to an external mounting object.
When the element arrangement portion of the mounting bracket comes into contact with the temperature measurement target,
It has a wall plate that is raised from the end of the base plate.
The base plate and the wall plate form a peripheral wall that surrounds the tip of the sensor protector.
In the cross section of the peripheral wall, a slit having a predetermined gap is formed in one place of the wall plate.
An adhesive is filled between the wall plate and the sensor protector, and the adhesive can be exposed to the outside through the slit .
A temperature sensor device in which an inward convex portion that presses the sensor protective body against the base plate is formed on the wall plate . The temperature sensor device according to claim 1 , wherein the inwardly convex portion is formed along a direction in which the tip end portion of the sensor protective body is inserted into the inside of the element arrangement portion. The temperature sensor device according to claim 1 or 2 , wherein at least one inwardly convex portion is formed near the slit along the longitudinal direction of the slit. The wall plate has a pair of side wall pieces formed on both sides of the base plate and a ceiling piece formed on at least one of the pair of side wall pieces.
The inwardly convex portion is formed on the ceiling piece.
The temperature sensor device according to any one of claims 1 to 3 , wherein the distance from the apex of the convex portion of the inward convex portion to the base plate is equal to or less than the thickness of the sensor protective body. With a thermal element
A sensor protector containing the heat sensitive element inside,
A temperature sensor device having an element arrangement portion that covers the periphery of the tip end portion of the sensor protector, and a mounting bracket having an external mounting portion that can be detachably attached to an external mounting object.
When the element arrangement portion of the mounting bracket comes into contact with the temperature measurement target,
It has a wall plate that is raised from the end of the base plate.
The base plate and the wall plate form a peripheral wall that surrounds the tip of the sensor protector.
In the cross section of the peripheral wall, a slit having a predetermined gap is formed in one place of the wall plate.
An adhesive is filled between the wall plate and the sensor protector, and the adhesive can be exposed to the outside through the slit .
A pair of side wall pieces formed on both sides of the base plate, a ceiling piece formed on at least one of the pair of side wall pieces, and a tip covering the tip surface of the sensor protector. Have a piece and
A temperature sensor device in which a predetermined gap of the slit is larger than a gap of a butt portion between the tip piece and the base plate . With a thermal element
A sensor protector containing the heat sensitive element inside,
A temperature sensor device having an element arrangement portion that covers the periphery of the tip end portion of the sensor protector, and a mounting bracket having an external mounting portion that can be detachably attached to an external mounting object.
When the element arrangement portion of the mounting bracket comes into contact with the temperature measurement target,
It has a wall plate that is raised from the end of the base plate.
The base plate and the wall plate form a peripheral wall that surrounds the tip of the sensor protector.
In the cross section of the peripheral wall, a slit having a predetermined gap is formed in one place of the wall plate.
An adhesive is filled between the wall plate and the sensor protector, and the adhesive can be exposed to the outside through the slit .
The wall plate has a tip piece covering the tip surface of the sensor protector.
A temperature sensor device in which a predetermined gap of the slit is larger than a gap of a butt portion between the tip piece and the base plate .

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