JPS61156839A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain the titled device which can give effective keys to the wafer process by a method wherein indications corresponding to coordinates of the group of chips formed on a wafer are put on the outer container. CONSTITUTION:This semiconductor device is produced by assembling in a package 3 a chip located at an arbitrary X-Y coordinate 7 whose respective axes are horizontal and vertical split lines 11, 12 along which a process-finished wafer 1 is to be split into individual chips 2, and then by providing an indication mark 8 of ab on the package 3 as the indication corresponding to the X-Y values of the coordinate 7. Application of this method facilitates the redevelopment of marks 8 into chip coordinates on the wafer 1 and enables data storage while advancing mass production and without particularly extra man-hours. Besides, addition of the device which reads the marks 8 enables the final characteristics of the semiconductor device and the characteristics of a necessary stage to be fed back to chip coordinates on a wafer in the state of almost complete automation.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device in which chips obtained by dividing a wafer into individual chips are assembled in an outer package. This invention relates to a semiconductor device in which a display mark is provided on an outer container.

[Conventional technology]

Semiconductor devices are manufactured using the Ueno process, in which a chip that performs the core functions of the semiconductor device is formed on the semiconductor Ueno S, the assembly process in which the chip is assembled into an outer container as a component, and the testing and classification of the device after the assembly is completed. It is manufactured through a testing process to ensure quality. FIG. 2 shows the wafer 1 at the completed stage of the wafer process and the chips 2 formed on it in an orderly manner. Further, FIG. 3 shows a semiconductor device 4 assembled in a package 3 as an outer container using one chip 2 from the chip group shown in FIG. In FIG. 2, 5 is a lead conductor, and 6 is a wiring wire connecting each lead conductor 6 and each electrode of the chip 2.

[Problem that the invention seeks to solve]

By the way, normally, during the busy manufacturing process of semiconductor devices, the electrical characteristics of each chip are tested after the wafer process is completed, and only chips that pass set standards are assembled. However, even if semiconductor devices are assembled using chips that passed the test at the completion stage of the wafer process, characteristics change during the assembly stage. Due to this problem, the test is being conducted again in the final process.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor device that can provide an effective basis for the semiconductor device manufacturing process, particularly the wafer process.

[Means for solving problems]

A semiconductor device according to the present invention is characterized in that a display corresponding to the coordinates of a group of chips formed on a wafer is provided on an outer container.

[Effect]

In the present invention, the final characteristics of the semiconductor device can be fed back to the chip coordinates on the wafer, and by using it as a characteristic distribution map on the eight surfaces, it is possible to check the precision of wafer process control and identify problems. It becomes possible to provide effective clues for purposes such as extraction and characteristic improvement.

〔Example〕

The present invention will be explained below based on embodiments shown in the drawings.

FIG. 1 is a plan view of a semiconductor device according to an embodiment of the present invention. In this example, the second
The horizontal and vertical dividing lines 11 and 12 for dividing the wafer 1 into individual chips 2 shown in the figure are used as coordinate axes, and the chips 2 located at the arbitrary XY coordinates T are assembled in the package 3, and On the package 3, place a mark 8 (ab) at the above coordinates T as shown in FIG.

This is provided as a display for XY values.

Here, as a means for specifically performing such display, the wafer 1 is divided into individual chips 2, and the chips 2 on the wafer 1 are
It is conceivable that the Y coordinate value and the order of assembly are stored in the control device ii, and at the final stage of semiconductor device formation, the above-mentioned contents stored in the control device are retrieved and displayed as ab.

In the assembly process and test process, semiconductor devices are usually processed in lots each consisting of a large number of semiconductor devices. Therefore, the chip coordinates on the wafer are disturbed. Attempting to respond requires careful and extensive experimental methods, and it is extremely difficult to do so in large quantities.

If the present invention described above is applied, it is possible to easily re-deploy the chip coordinates on the wafer 1 using the display mark 8 illustrated as ab in FIG. 1, without requiring any extra effort while proceeding with mass production. It becomes possible to accumulate data. Also, the display ab in Fig. 1 is automatically indicated by the corresponding display mark 8.
By adding a device that reads , it becomes possible to feed back the final characteristics of semiconductor devices and the characteristics at necessary stages to the chip coordinates on the wafer in a completely automatic manner.

In the above embodiment, the chip coordinates on one wafer have been described, but when a plurality of wafers exist, it is also possible to add a display to distinguish between the wafers.

Furthermore, it is also possible to add new processing elements after the assembly process and display them as ab-c, etc.

Information functions can be expanded to any extent.

〔Effect of the invention〕

As described above, according to two aspects of the present invention, characteristics can be fed back to chip coordinates on a wafer while mass-producing semiconductor devices from displays made on the semiconductor devices, and a large amount of valid data is fed back. Analyze, Analyze, J
I-burying has the effect of making it possible to improve the yield, quality, and characteristics of semiconductor devices.

[Brief explanation of drawings]

FIG. 1 is a plan view of a semiconductor device according to an embodiment of the present invention;
Figure 2 is a plan view of a normal wafer on which chip formation has been completed;
FIG. 3 is a partially cutaway perspective view of a conventional semiconductor device. 1... ψ wafer, 2-... chip, 3... package, 4... semiconductor device, 5... lead conductor, 6... wiring wire, 7... Chip coordinates on the wafer, 8...display mark. Agent Masu Oiwa 1st
Figure 8: Tsuta Show-7 Figure 2 Procedural amendment to Figure 3 (voluntary) 2. Name of the invention Semiconductor device 3. Relationship with the person making the amendment Patent applicant address 2-chome Marunouchi, Chiyoda-ku, Tokyo No. 2 No. 3 Name Title (601) Mitsubishi Electric Corporation Representative Hitoshi Katayama 4, Agent 5, Subject of amendment (2) Amended "Lead conductor 6" in line 8 of the same page of the same book to "Lead conductor 5" do. that's all

Claims (1)

[Claims] 1. A semiconductor device in which chips obtained by dividing a wafer into individual chips are assembled in an outer container, characterized in that a display mark corresponding to the chip position coordinates on the wafer is provided on the outer container.