JPS61156246U - - Google Patents

Info

Publication number
JPS61156246U
JPS61156246U JP1985038189U JP3818985U JPS61156246U JP S61156246 U JPS61156246 U JP S61156246U JP 1985038189 U JP1985038189 U JP 1985038189U JP 3818985 U JP3818985 U JP 3818985U JP S61156246 U JPS61156246 U JP S61156246U
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
terminal portion
outer shell
conductive patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985038189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985038189U priority Critical patent/JPS61156246U/ja
Publication of JPS61156246U publication Critical patent/JPS61156246U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1985038189U 1985-03-19 1985-03-19 Pending JPS61156246U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985038189U JPS61156246U (enExample) 1985-03-19 1985-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985038189U JPS61156246U (enExample) 1985-03-19 1985-03-19

Publications (1)

Publication Number Publication Date
JPS61156246U true JPS61156246U (enExample) 1986-09-27

Family

ID=30544959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985038189U Pending JPS61156246U (enExample) 1985-03-19 1985-03-19

Country Status (1)

Country Link
JP (1) JPS61156246U (enExample)

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