JPS61156246U - - Google Patents
Info
- Publication number
- JPS61156246U JPS61156246U JP1985038189U JP3818985U JPS61156246U JP S61156246 U JPS61156246 U JP S61156246U JP 1985038189 U JP1985038189 U JP 1985038189U JP 3818985 U JP3818985 U JP 3818985U JP S61156246 U JPS61156246 U JP S61156246U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- terminal portion
- outer shell
- conductive patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985038189U JPS61156246U (enExample) | 1985-03-19 | 1985-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985038189U JPS61156246U (enExample) | 1985-03-19 | 1985-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156246U true JPS61156246U (enExample) | 1986-09-27 |
Family
ID=30544959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985038189U Pending JPS61156246U (enExample) | 1985-03-19 | 1985-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156246U (enExample) |
-
1985
- 1985-03-19 JP JP1985038189U patent/JPS61156246U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61156246U (enExample) | ||
| JPS6073269U (ja) | 電子部品実装構造 | |
| JPS60176577U (ja) | プリント基板 | |
| JPS63168931U (enExample) | ||
| JPS6398678U (enExample) | ||
| JPS60106363U (ja) | プリント配線基板 | |
| JPS5952647U (ja) | 混成集積回路 | |
| JPH0336478U (enExample) | ||
| JPS59128797U (ja) | シ−ルド装置 | |
| JPS6169869U (enExample) | ||
| JPS63182572U (enExample) | ||
| JPS6169828U (enExample) | ||
| JPS61157363U (enExample) | ||
| JPS6343495U (enExample) | ||
| JPS60192456U (ja) | 保護キヤツプ付き混合機能回路装置 | |
| JPH0179872U (enExample) | ||
| JPS60194344U (ja) | 厚膜混成集積回路リ−ド端子の接続構造 | |
| JPS61142460U (enExample) | ||
| JPS58196869U (ja) | 印刷配線基板への電気部品実装構造 | |
| JPS6146768U (ja) | 金属ベ−スプリント回路基板の電気的接続構造 | |
| JPH0466780U (enExample) | ||
| JPS61183572U (enExample) | ||
| JPS62114474U (enExample) | ||
| JPH01166565U (enExample) | ||
| JPS60103864U (ja) | 回路基板 |