JPS61153499U - - Google Patents

Description

[Brief explanation of the drawing]

Figures 1A to 1C show the state of the semiconductor conversion device according to the embodiment of the present invention when it is installed alone.
1B is a front view, FIG. 1B is a side view, and FIG. 1C is a plan view. Figure 2 is an exploded perspective view of the sealed casing in Figure 1;
FIG. 3 is a side view showing how the semiconductor converter according to the embodiment of the present invention is installed in the panel, and FIG. 4 is a perspective view of the top ventilation cover of the semiconductor converter shown in FIG. 3. 1: Cooling body, 2: Cooling fan, 3: Semiconductor element, 4: Sealed case, 5: Support member, 6a, 6b: Mounting feet, 7: Control panel, 8: Ventilation cover, 41: Top plate, 42: Bottom Face plate, 43: Front plate, 44a, 44b
: Bottom plate, 45a, 45b: Side plate.

Claims (1)

[Scope of utility model registration request] Semiconductor elements or heat-generating electric components are attached to a common cooling body, and the cooling fins of this cooling body and the cooling fan for cooling the cooling fins are made to protrude from the bottom and covered with an airtight housing, and the side walls of this airtight housing are placed along the cooling fins. A removable mounting foot is provided for fixing the protruding end of the side wall to the support member when installed alone, and the cooling fins and cooling fan are made to protrude outside the panel when installed inside the panel to secure the airtight casing. A semiconductor conversion device characterized in that a mounting hole for fixing to a panel wall is provided on the bottom of the casing.