JPH0468597U - - Google Patents
Info
- Publication number
- JPH0468597U JPH0468597U JP11168090U JP11168090U JPH0468597U JP H0468597 U JPH0468597 U JP H0468597U JP 11168090 U JP11168090 U JP 11168090U JP 11168090 U JP11168090 U JP 11168090U JP H0468597 U JPH0468597 U JP H0468597U
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- partition plate
- insulating structure
- heat insulating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図はこの考案に係る断熱構造の
実施例を示し第１図Ａは側面図、Ｂは斜視図、Ｃ
は説明図、Ｄは樹脂の仕切板と天板の取付斜視図
、第２図ＡとＢは他の実施例を示す図である。第
３図は従来例を示す図でＡは側面図、Ｂは斜視図
、Ｃは説明図である。
主な符号の説明、１……天板、２……底板、３
……放熱器、４……前面操作パネル、５……放熱
孔、６……樹脂の仕切板、７……側板、８……背
面。
Figures 1 and 2 show examples of the heat insulating structure according to this invention, and Figure 1A is a side view, B is a perspective view, and C is a side view.
2 is an explanatory view, D is a perspective view of the installation of a resin partition plate and a top plate, and FIGS. 2A and 2B are views showing other embodiments. FIG. 3 shows a conventional example, in which A is a side view, B is a perspective view, and C is an explanatory view. Explanation of main symbols, 1...Top plate, 2...Bottom plate, 3
... Heat sink, 4 ... Front operation panel, 5 ... Heat radiation hole, 6 ... Resin partition plate, 7 ... Side plate, 8 ... Back.
Claims (1)
遮断する断熱構造であつて、放熱器近傍の筺体に
低熱伝導部材の仕切板を設け、放熱器からの熱を
上記仕切板で遮断するよう構成したことを特徴と
する断熱構造。 A heat insulating structure that blocks heat radiation from a radiator attached to an electronic device housing, wherein a partition plate made of a low thermal conductive material is provided on the casing near the radiator, and the partition plate is configured to block heat from the radiator. A heat insulating structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11168090U JPH0468597U (en) | 1990-10-26 | 1990-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11168090U JPH0468597U (en) | 1990-10-26 | 1990-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468597U true JPH0468597U (en) | 1992-06-17 |
Family
ID=31859150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11168090U Pending JPH0468597U (en) | 1990-10-26 | 1990-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468597U (en) |
-
1990
- 1990-10-26 JP JP11168090U patent/JPH0468597U/ja active Pending
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