JPS61150257A - Manufacture of lead frame material - Google Patents
Manufacture of lead frame materialInfo
- Publication number
- JPS61150257A JPS61150257A JP27848884A JP27848884A JPS61150257A JP S61150257 A JPS61150257 A JP S61150257A JP 27848884 A JP27848884 A JP 27848884A JP 27848884 A JP27848884 A JP 27848884A JP S61150257 A JPS61150257 A JP S61150257A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- rolled
- alloy
- frame material
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 19
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000005097 cold rolling Methods 0.000 claims description 4
- 238000005098 hot rolling Methods 0.000 claims description 3
- 229910003271 Ni-Fe Inorganic materials 0.000 abstract description 5
- 229910020598 Co Fe Inorganic materials 0.000 abstract 1
- 229910002519 Co-Fe Inorganic materials 0.000 abstract 1
- 238000000137 annealing Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 6
- 229910000640 Fe alloy Inorganic materials 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
゛ 産業上の利用分野
この発明は、製造工程の簡素化と品質の向上を図ったＩ
Ｃ用リードフレーム素材の製造方法に関する。[Detailed Description of the Invention] ゛ Industrial Application Field This invention is an I
The present invention relates to a method for manufacturing a lead frame material for C.
従来の技術
一般に半導体集積回路装置のリードフレームやリード線
等に使用されるＩＣ用リードフレーム材としては、３０
〜５５％Ｎｉ Ｆｅ合金、２５〜３５％Ｎ１−１０〜
２０％ｃｏ −Ｆ、合金、あるいはＣＯ系合金が知られ
ている。そして、ＩＣ用リードフレーム素材は、打抜き
加工後の形状、例えばそり等についての要求規格が厳し
いため、素材の形状きよう正及びスリットひずみの除去
を図っておく必要がある。BACKGROUND OF THE INVENTION Generally, lead frame materials for ICs used for lead frames and lead wires of semiconductor integrated circuit devices include 30.
~55% Ni Fe alloy, 25-35% N1-10 ~
20% co-F, alloy, or CO-based alloy is known. Since IC lead frame materials have strict requirements regarding the shape after punching, such as warpage, it is necessary to maintain the shape of the material and eliminate slit distortion.
そのため、従来リードフレーム材は、普通造塊又は連続
鋳造法により得られた鋳塊を熱間圧延及び冷間圧延して
、例えば板厚０．２７〜０．４０ｔｌＨの中間圧延板に
したのち、軟化焼なましを施して所要の機械的特性を付
与し、さらに冷間仕上げ圧延して板厚０．２５〜０．２
５４１ｇに仕、、１：、 ケ、テンシ・１ンレベラー又
はスキンバス等により形状のきよう正を行なったのち、
前記きよう止板をリードフレーム素材の板幅と同一寸法
にスリット切断後、この切断によシ発生したスリットひ
ずみを除去するため、材料が軟化しない再結晶温度以下
、例えば４２％Ｎｉ Ｆｅ合金のバッチ処理の場合４
００〜６００℃、連続処理の場合５００〜８００℃でひ
ずみ取り焼なましを行ない、このようにして得られたリ
ードフレ−ム素材は、需要家において打抜き加工又はエ
ツチング加工等によりリードフレーム形状に加工され製
品化されていた。Therefore, conventional lead frame materials are made by hot rolling and cold rolling an ingot obtained by ordinary ingot making or continuous casting to form an intermediate rolled plate with a plate thickness of 0.27 to 0.40 tlH, for example. Soft annealing is applied to impart the required mechanical properties, and further cold finish rolling is performed to obtain a plate thickness of 0.25 to 0.2.
After adjusting the shape using a tensile leveler or skin bath, etc.,
After cutting the stopper plate into slits with the same dimensions as the plate width of the lead frame material, in order to remove the slit strain generated by this cutting, the plate is cut at a temperature below the recrystallization temperature at which the material does not soften, such as a 42% Ni-Fe alloy. For batch processing 4
Strain relief annealing is performed at 00 to 600°C, or 500 to 800°C in the case of continuous processing, and the lead frame material thus obtained is processed into a lead frame shape by punching or etching at the customer. It was commercialized.
発明が解決しようとする問題点
前記のごとく、従来の製造方法では、きよう正工程とひ
ずみ取如焼なまし工程が必要で、製造工程が多く、製品
のコスト高を招き、又ひすみ取り焼なまし後の素材には
さびが発生しやすい欠点がある。又、ひずみ取り焼なま
し作業は温度と保持時間の制御が困難で、ひずみ取シ焼
なましを施した素材でも、スリットひずみが少しでも残
存すると、需要家での打抜き加工後のリードフレーム製
品に、そり変形が発生する原因となる。Problems to be Solved by the Invention As mentioned above, the conventional manufacturing method requires a straightening process and a strain-removing annealing process, resulting in a large number of manufacturing steps, which increases the cost of the product. After annealing, the material has the disadvantage of being susceptible to rust. In addition, it is difficult to control the temperature and holding time during strain relief annealing, and even if the material has been subjected to strain relief annealing, if even a small amount of slit strain remains, the lead frame product after punching at the customer will be damaged. This causes warping and deformation.
又、従来の製造方法においては、仕上げ圧延後のリード
フレーム素材（１）の断面形状寸法は、通常シートクラ
ウンを有する帯板と呼ばれ、第４図に示すように、板幅
方向の中央部厚さくＨ）は、両端部厚さくｈ） ！り厚
く、例えば板幅（Ｗ） ３ ｏ ｏ ｔｔｔｔｘ、板厚
０．２５鱈の仕上げ圧延材では、中央部厚さくＨ）と両
端部厚さくｈ）との差（ｄ）は５μｍにも達する。In addition, in the conventional manufacturing method, the cross-sectional shape and size of the lead frame material (1) after finish rolling is usually called a band plate having a sheet crown, and as shown in Fig. 4, the cross-sectional shape and size of the lead frame material (1) are The thickness H) is the thickness H) at both ends! For example, in the case of finished rolled cod material with a width (W) of 3 o o ttttx and a thickness of 0.25, the difference (d) between the thickness at the center (H) and the thickness at both ends (h) reaches 5 μm. .
このようなシートクラウンを有する帯板をリードフレー
ム素材の板幅にスリット切断すると、素材の断面形状は
第５図に示すとおり、シートクラウンの影響で左右非対
称となり、さらにスリット切断によりリードフレーム素
材の両端部にばり（２）（２）を有する形状となシ、リ
ードフレーム素材として多くの問題があった。When a strip plate having such a seat crown is cut into slits to the width of the lead frame material, the cross-sectional shape of the material becomes asymmetrical due to the effect of the seat crown, as shown in Figure 5. Due to its shape with burrs (2) (2) on both ends, there were many problems as a lead frame material.
この発明は、前記従来法における問題点を解消すること
を目的とし、製造工程の簡略化と素材内部の残留ひずみ
を極力低減し、かつ均一な断面形状寸法を有するリード
フレーム素材の製造方法を提案するものである。The purpose of this invention is to solve the problems in the conventional methods, and propose a method for manufacturing a lead frame material that simplifies the manufacturing process, reduces residual strain inside the material as much as possible, and has a uniform cross-sectional shape. It is something to do.
発明の構成
この発明は、リードフレーム素材用の合金鋳塊を熱間圧
延及び冷間圧延したのち、仕上げ圧延前の冷間圧延材を
リードフレーム素材の板幅寸法とほぼ同一寸法にスリッ
ト切断し、さらに軟化焼なましを施したのち、前記スリ
ット材をリードフレーム素材厚まで冷間で仕上げ圧延す
ることを要旨とするリードフレーム素材の製造方法であ
る。Composition of the Invention This invention hot-rolls and cold-rolls an alloy ingot for lead frame material, and then cuts the cold-rolled material before finish rolling into slits that are approximately the same width as the plate width of the lead frame material. This is a method for manufacturing a lead frame material, the gist of which is to further perform softening annealing and then cold finish rolling the slit material to the thickness of the lead frame material.
この発明におけるリードフレーム素材用合金としては、
Ｎ１−Ｆ＠合金、Ｎｉ Ｃｏ Ｆｅ合金及びＣ，系
合金が使用されるが、Ｎ１−Ｆ、合金及びＮｉ Ｃｏ
−Ｆｅ合金はガラスやセラ、ミックス等との付着整合性
に問題があシ、その弾性係数及び温度係数を低く保ち、
特に熱膨張係数が被接合材とほぼ同一であることから使
用されている。The alloy for lead frame material in this invention includes:
N1-F@alloy, Ni Co Fe alloy and C, series alloy are used, but N1-F, alloy and Ni Co
-Fe alloys have problems with adhesion consistency with glass, ceramics, mixes, etc., and their elastic modulus and temperature coefficient are kept low.
In particular, it is used because its coefficient of thermal expansion is almost the same as that of the material to be joined.
Ｎ１−Ｆ１５合金はＮ１３６％のとき熱膨張係数が最小
であり、この前後成分では熱膨張係数は大きくなるが、
ガラス又はセラミックスとの付着整合性を考慮してＮｉ
含有量は３０〜５５％が使用される。The N1-F15 alloy has the lowest thermal expansion coefficient when N136%, and the thermal expansion coefficient increases with the components before and after this, but
Considering adhesion consistency with glass or ceramics, Ni
A content of 30 to 55% is used.
しかし、Ｎｉ含有量が３０％未満あるい、は５５％を超
えるとグラス又はセラミックスとの熱膨張係数が不一致
のため実用に耐えなくなる。However, if the Ni content is less than 30% or more than 55%, the thermal expansion coefficient will not match that of glass or ceramics, making it impractical.
又、Ｎｉ Ｃｑ Ｆｅ合金はＮｉ２５〜３５％、Ｃ
ｏ４０〜２０％、の範囲で任意に組合せた組成のものが
使用されるが、この範囲を外れた組合せでは、その熱膨
張係数がガラス又はセラミックスと一致せず実用に耐え
ない。In addition, the Ni Cq Fe alloy contains 25 to 35% Ni, C
Any combination of compositions within the range of 040 to 20% is used, but combinations outside this range will not be of practical use because the coefficient of thermal expansion will not match that of glass or ceramics.
又、Ｃｕ系合金については、その熱放散性が優れている
点からリードフレームとして使用される。Further, Cu-based alloys are used as lead frames because of their excellent heat dissipation properties.
この発明の実施において、リードフレーム素材用の合金
鋳塊を熱間圧延、冷間圧延したあとの仕上げ圧延前の板
厚は、需要家における素材の打抜き性から決まる圧下率
を加味した板厚であり、例えば仕上げ圧延品の板厚の１
．１〜２．０倍の板厚とする。In carrying out this invention, the thickness of the alloy ingot for lead frame material after hot rolling and cold rolling and before finishing rolling is the thickness that takes into account the rolling reduction determined by the punchability of the material at the customer. Yes, for example, 1 of the plate thickness of finish rolled products
．． The plate thickness shall be 1 to 2.0 times.
又、スリット切断された中間圧延板の軟化焼なましは、
通常の条件で行なうものであυ、例えば４２％Ｎｉ −
Ｆｅ合金のバッチ処理では６００〜９００℃、連続処理
では８００〜１０００°Ｃで処理する。In addition, softening annealing of a slit-cut intermediate rolled plate is as follows:
This is carried out under normal conditions, e.g. 42%Ni −
Fe alloys are treated at 600 to 900°C in batch processing, and at 800 to 1000°C in continuous processing.
なお、仕上げ圧延前の中間圧延板は、軟化焼なましを施
したのち、リードフレーム素材の板幅寸法とほぼ同一寸
法にスリット切断することもできる。Note that the intermediate rolled plate before finish rolling may be subjected to softening annealing and then cut into slits to have substantially the same width as the plate width of the lead frame material.
実 施 例
４２％Ｎｉ−Ｆｅ合金の鋳塊を熱間鍛造したのち、熱間
圧延及び冷間圧延を施し板幅３００ Ｍｇ 、板厚０．
３ｆｌの中間圧延帯板とし、この帯板をリードフレーム
素材の板幅寸法２５ＷＩＭにほぼ等しい２４．９５闘の
板幅にスリット切断した。そして、このスリット板を９
５０°Ｃにて連続焼なましを施したのち、板厚０．２５
Ｎｊｌまで冷間仕上げ圧延し板幅２５朋のリードフレー
ム素材を得た。Example 4 After hot forging a 2% Ni-Fe alloy ingot, it was hot rolled and cold rolled to a plate width of 300 Mg and plate thickness of 0.
A 3fl intermediate-rolled strip was obtained, and this strip was cut into slits with a width of 24.95mm, which is approximately equal to the width of the lead frame material, 25WIM. And this slit plate 9
After continuous annealing at 50°C, the plate thickness is 0.25
A lead frame material with a plate width of 25 mm was obtained by cold finish rolling to Njl.
この素材から、ひずみ測定試験のため、エツチングによ
る抜き加工を行ない、第１図に示す試験片を作った。そ
の試験片の断面形状を第２図に示す。第２図に示される
ように試験片は板幅方向に均一な板厚で０．２５１１１
であシ、四すみはすべて丸味を形成している。又、比較
のため従来法により得られたリードフレーム素材で上記
と同一寸法の試験片を作った。その試験片の断面形状は
第３図に示すように、板厚は片方が０．２５０１１１．
他方は０．２４８ｆｌで不均一で、かつ両端に高さ
０．００５ ｗｔｍのばシが形成していた。This material was punched out by etching to produce the test piece shown in FIG. 1 for the strain measurement test. The cross-sectional shape of the test piece is shown in FIG. As shown in Figure 2, the test piece had a uniform thickness of 0.25111 mm in the width direction.
The edges and four corners all form a round shape. For comparison, a test piece with the same dimensions as above was made using a lead frame material obtained by a conventional method. The cross-sectional shape of the test piece is shown in Figure 3, and the thickness of one side is 0.250111.
The other one was 0.248 fl, was non-uniform, and had ridges of 0.005 wtm in height formed at both ends.
そして、上記試験片の開放端Ａ５、Ａ２のねじれ角θ１
、θ２を測定した。その結果を第１表に示す。Then, the torsion angle θ1 of the open ends A5 and A2 of the test piece is
, θ2 were measured. The results are shown in Table 1.
（以下余白）
第 １ 表
上記結果よシ、従来法によるものは、いずれもねじれを
生ずるが、この発明によるものはねじれが皆無であるこ
とがわかる。(The following is a blank space) The above results in Table 1 show that the conventional methods all cause twisting, but the method of the present invention causes no twisting at all.
発明の効果
この発明は、リードフレーム素材の製造工程の途中にお
いて、仕上げ圧延前の中間圧延板をリードフレーム素材
の板幅寸法とほぼ同一寸法にスリット切断し、さらに軟
化焼なましを施すことを特徴とし、これによシ製造工程
は従来法に比べ著しく簡略化することができ、内部ひず
みが少なく、均一な断面形状寸法のリードフレーム素材
を製造することができる。Effects of the Invention The present invention involves cutting an intermediate rolled plate before finish rolling into slits that are approximately the same as the width of the lead frame material during the manufacturing process of the lead frame material, and then subjecting it to softening annealing. As a feature, the manufacturing process can be significantly simplified compared to conventional methods, and a lead frame material with little internal strain and uniform cross-sectional shape can be manufactured.
第１図はこの発明の実施により作られリードフレーム素
材から抜き出したねじれ角試験片の平面図、第２図は同
上断面形状を示す側面図、第３図は比較のため従来法に
よシ作られたねじれ角試験片の断面形状を示す側面図、
第４図は従来法により作られたリードフレーム素材のス
リット切断前の断面形状を示す側面図、第５図は同上か
らスリット切断された素材の断面形状を示す側面図であ
る。
１・・・リードフレーム素材、２・・・ばシ。
出願人 住友特殊金属株式会社
第２図
Ｔｈ＝Ｄ
第３図
口二口
第４図
第５図
２Ｒ１１−Fig. 1 is a plan view of a torsion angle test piece produced by implementing the present invention and extracted from a lead frame material, Fig. 2 is a side view showing the cross-sectional shape of the same, and Fig. 3 is a specimen prepared by the conventional method for comparison. A side view showing the cross-sectional shape of the torsion angle test piece,
FIG. 4 is a side view showing the cross-sectional shape of a lead frame material made by a conventional method before cutting into slits, and FIG. 5 is a side view showing the cross-sectional shape of the lead frame material after cutting into slits. 1...Lead frame material, 2...Base. Applicant Sumitomo Special Metals Co., Ltd. Figure 2 Th=D Figure 3 Exit 4 Figure 5 2R11-
Claims (1)
延したのち、仕上げ圧延前の冷間圧延材をリードフレー
ム素材の板幅寸法とほぼ同一寸法にスリット切断し、さ
らに軟化焼なましを施したのち、前記スリット材をリー
ドフレーム素材厚まで冷間で仕上げ圧延することを特徴
とするリードフレーム素材の製造方法。After hot-rolling and cold-rolling an alloy ingot for lead frame material, the cold-rolled material before finish rolling is cut into slits to approximately the same width as the lead frame material, and then softened and annealed. 1. A method for manufacturing a lead frame material, the method comprising: finishing cold rolling the slit material to the thickness of the lead frame material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27848884A JPS61150257A (en) | 1984-12-24 | 1984-12-24 | Manufacture of lead frame material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27848884A JPS61150257A (en) | 1984-12-24 | 1984-12-24 | Manufacture of lead frame material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61150257A true JPS61150257A (en) | 1986-07-08 |
| JPH0343924B2 JPH0343924B2 (en) | 1991-07-04 |
Family
ID=17598023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27848884A Granted JPS61150257A (en) | 1984-12-24 | 1984-12-24 | Manufacture of lead frame material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61150257A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01201421A (en) * | 1987-10-27 | 1989-08-14 | Hitachi Metals Ltd | Lead frame material and its production |
-
1984
- 1984-12-24 JP JP27848884A patent/JPS61150257A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01201421A (en) * | 1987-10-27 | 1989-08-14 | Hitachi Metals Ltd | Lead frame material and its production |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343924B2 (en) | 1991-07-04 |
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