JPS61147978U - - Google Patents
Info
- Publication number
- JPS61147978U JPS61147978U JP3274685U JP3274685U JPS61147978U JP S61147978 U JPS61147978 U JP S61147978U JP 3274685 U JP3274685 U JP 3274685U JP 3274685 U JP3274685 U JP 3274685U JP S61147978 U JPS61147978 U JP S61147978U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead wire
- spring
- under test
- vertically movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の一実施例を示す上面図、第２
図は第１図のＸ―Ｘ′線の断面図、第３図は従来
例を示す上面図、第４図は第３図のＸ―Ｘ′線の
断面図である。
１……被測定用半導体素子、２……被測定用半
導体素子の測定用リード線、３……測定部電極、
４……蓋、５……接触板、６……蓋固定治具、７
……スプリング、８……上下可動治具。
Fig. 1 is a top view showing one embodiment of the present invention;
The figures are a sectional view taken along line XX' in FIG. 1, FIG. 3 is a top view showing a conventional example, and FIG. 4 is a sectional view taken along line XX' in FIG. DESCRIPTION OF SYMBOLS 1...Semiconductor element to be measured, 2...Measurement lead wire of the semiconductor element to be measured, 3...Measurement part electrode,
4... Lid, 5... Contact plate, 6... Lid fixing jig, 7
...Spring, 8...Vertical movable jig.
Claims (1)
触させるための電極部を貫通式とすると同時に前
記被測定用半導体素子の前記リード線の長さより
も短かくし、さらに、装入された前記被測定用半
導体素子の前記リード線の端部が、前記電極部の
下部に設けられたスプリング式上下可動治具を押
し下げ、上部からの圧力を外す事により前記スプ
リング式上下可動治具が前記被測定用半導体素子
の前記リード線を上に押し上げる事を特徴とする
半導体素子測定用ソケツト。 The electrode section for bringing the lead wire of the semiconductor device under test into contact with the measurement section is of a penetrating type, and at the same time is made shorter than the length of the lead wire of the semiconductor device under test, and The end of the lead wire of the semiconductor device for measurement pushes down the spring-type vertically movable jig provided at the lower part of the electrode part, and by removing the pressure from the upper part, the spring-type vertically movable jig moves to the measured object. A socket for measuring a semiconductor device, characterized in that the lead wire of the semiconductor device is pushed up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274685U JPS61147978U (en) | 1985-03-07 | 1985-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3274685U JPS61147978U (en) | 1985-03-07 | 1985-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61147978U true JPS61147978U (en) | 1986-09-12 |
Family
ID=30534547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3274685U Pending JPS61147978U (en) | 1985-03-07 | 1985-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61147978U (en) |
-
1985
- 1985-03-07 JP JP3274685U patent/JPS61147978U/ja active Pending