JPS61147587A - 発光ダイオ−ド - Google Patents

発光ダイオ−ド

Info

Publication number
JPS61147587A
JPS61147587A JP59270373A JP27037384A JPS61147587A JP S61147587 A JPS61147587 A JP S61147587A JP 59270373 A JP59270373 A JP 59270373A JP 27037384 A JP27037384 A JP 27037384A JP S61147587 A JPS61147587 A JP S61147587A
Authority
JP
Japan
Prior art keywords
light
convex lens
emitting element
light emitting
curved surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59270373A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422356B2 (enExample
Inventor
Hiroo Sakai
酒井　弘生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59270373A priority Critical patent/JPS61147587A/ja
Publication of JPS61147587A publication Critical patent/JPS61147587A/ja
Publication of JPH0422356B2 publication Critical patent/JPH0422356B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP59270373A 1984-12-21 1984-12-21 発光ダイオ−ド Granted JPS61147587A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270373A JPS61147587A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270373A JPS61147587A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS61147587A true JPS61147587A (ja) 1986-07-05
JPH0422356B2 JPH0422356B2 (enExample) 1992-04-16

Family

ID=17485353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270373A Granted JPS61147587A (ja) 1984-12-21 1984-12-21 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS61147587A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003204083A (ja) * 2001-12-28 2003-07-18 Toshiba Corp 集光レンズ、レンズ一体型発光素子及び灯火装置
JP2005142447A (ja) * 2003-11-07 2005-06-02 Sharp Corp 発光装置，受光装置，電子機器およびレンズの製造方法
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
JP2007065425A (ja) * 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 照明装置及びそれを用いた投写型映像表示装置。
JP2018152402A (ja) * 2017-03-10 2018-09-27 シチズン電子株式会社 発光装置
GB2564660A (en) * 2017-07-14 2019-01-23 Wolf Safety Lamp Company Ltd The Providing illumination in potentially explosive atmospheres
WO2020137636A1 (ja) * 2018-12-25 2020-07-02 株式会社小糸製作所 光学ユニット
EP1472712B1 (en) * 2002-02-06 2020-08-26 Gentex Corporation Sensor configuration for substantial spacing from a small aperture

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
JP2003204083A (ja) * 2001-12-28 2003-07-18 Toshiba Corp 集光レンズ、レンズ一体型発光素子及び灯火装置
EP1472712B1 (en) * 2002-02-06 2020-08-26 Gentex Corporation Sensor configuration for substantial spacing from a small aperture
JP2005142447A (ja) * 2003-11-07 2005-06-02 Sharp Corp 発光装置，受光装置，電子機器およびレンズの製造方法
JP2007065425A (ja) * 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 照明装置及びそれを用いた投写型映像表示装置。
JP2018152402A (ja) * 2017-03-10 2018-09-27 シチズン電子株式会社 発光装置
GB2564660A (en) * 2017-07-14 2019-01-23 Wolf Safety Lamp Company Ltd The Providing illumination in potentially explosive atmospheres
GB2564660B (en) * 2017-07-14 2020-09-09 Wolf Safety Lamp Company Ltd (The) Providing illumination in potentially explosive atmospheres
WO2020137636A1 (ja) * 2018-12-25 2020-07-02 株式会社小糸製作所 光学ユニット
US11441753B2 (en) 2018-12-25 2022-09-13 Koito Manufacturing Co., Ltd. Optical unit
US11573000B2 (en) 2018-12-25 2023-02-07 Koito Manufacturing Co., Ltd. Optical unit
JP2024056093A (ja) * 2018-12-25 2024-04-19 株式会社小糸製作所 光学ユニット

Also Published As

Publication number Publication date
JPH0422356B2 (enExample) 1992-04-16

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