JPS61144094A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPS61144094A JPS61144094A JP26689384A JP26689384A JPS61144094A JP S61144094 A JPS61144094 A JP S61144094A JP 26689384 A JP26689384 A JP 26689384A JP 26689384 A JP26689384 A JP 26689384A JP S61144094 A JPS61144094 A JP S61144094A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder resist
- printed circuit
- moisture
- sided printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
Ｃ発明の技術分野Ｊ
本発明は片面プリント基板により回路基板を製造する回
路基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention J The present invention relates to a method for manufacturing a circuit board using a single-sided printed circuit board.
［発明の技術的背景］
例えば洗濯機等の水を扱う電気機器の回路基板では、そ
の表面に防湿被膜を形成して湿気による回路基板の劣化
を防止するようにしている。また、一般に回路基板を片
面プリント基板により製造する場合、電子部品の実装面
とは反対側の配線面には不要な部分に半田が付着するこ
とを防止するためのソルダーレジスト層を形成するが、
電子部品の実装面にはソルダーレジスト層を形成するこ
となく部品配置図のみを印刷する。[Technical Background of the Invention] For example, a moisture-proof coating is formed on the surface of a circuit board for an electric device that handles water, such as a washing machine, to prevent deterioration of the circuit board due to moisture. Additionally, when a circuit board is generally manufactured using a single-sided printed circuit board, a solder resist layer is formed on the wiring surface opposite to the mounting surface of electronic components to prevent solder from adhering to unnecessary parts.
Only a component layout diagram is printed on the mounting surface of electronic components without forming a solder resist layer.
［背景技術の問題点］
ところが、上述のような片面プリント基板により形成さ
れた回路基板に防湿被膜を形成する場合、プリント基板
の配線面側にはソルダーレジスト層が形成されているた
め汚れが付着しにくく従って防湿被膜の付着性は良好に
なるが、プリント基板の実装面側はソルダーレジスト層
がなく汚れが付着し易いため防湿被膜の付着性が著しく
劣る。このため、従来は防湿被膜、の塗布前に、例えば
水溶性アクリルポリマーの溶液により回路基板を洗浄す
るブライマー処理を実行してプリント基板の実装面に付
着した汚れを除去するようにしており、このブライマー
処理が六層面倒で生産性を低下させる要因となっていた
。[Problems with the Background Art] However, when forming a moisture-proof coating on a circuit board formed of a single-sided printed circuit board as described above, dirt may adhere to the solder resist layer formed on the wiring side of the printed circuit board. However, since there is no solder resist layer on the mounting surface of the printed circuit board and dirt easily adheres thereto, the adhesion of the moisture-proof film is significantly poor. For this reason, conventionally, before applying a moisture-proof coating, a brimer treatment is performed to clean the circuit board with a water-soluble acrylic polymer solution to remove dirt adhering to the mounting surface of the printed circuit board. The 6-layer brimer treatment was troublesome and was a factor in reducing productivity.
［発明の目的］
従って、本発明の目的は、防湿被膜形成のためのブライ
マー処理を不要ならしめ得て生産性を向上させることが
できる回路基板の製造方法を提供するにある。[Object of the Invention] Therefore, an object of the present invention is to provide a method for manufacturing a circuit board that can eliminate the need for a brimer treatment for forming a moisture-proof film and improve productivity.
し発明の概要］
本発明は、片面プリント基板の両面にソルダーレジスト
層を形成し、その後ソルダーレジスト層上に防湿被膜を
形成することにより、片面プリント基板の両面に汚れが
付着することを防止するところに特徴を有するものであ
る。Summary of the Invention] The present invention prevents dirt from adhering to both sides of a single-sided printed circuit board by forming a solder resist layer on both sides of the single-sided printed circuit board, and then forming a moisture-proof coating on the solder resist layer. However, it has certain characteristics.
［発明の実施例］
一実施例を図面を参照して説明する。本実施例の回路基
板は脱水兼用洗濯機の操作箱（図示せず）内に配設され
るもので、図に示す通り片面プリント基板１の実装面（
第１図中上面）にトランジスタ、抵抗或は表示素子等の
多数の電子部品２を実装し、配線面（第１図中下面）に
図示しない配線パターンを形成してなる。片面プリント
基板１の配線面には電子部品２の半田付は部分以外の箇
所にソルダーレジストＩ！３が形成され、実装面にもや
はりソルダーレジスト［！４が形成されている。[Embodiment of the Invention] An embodiment will be described with reference to the drawings. The circuit board of this embodiment is installed in the operation box (not shown) of a washing machine with dehydrating function, and as shown in the figure, the mounting surface of the single-sided printed circuit board 1 (
A large number of electronic components 2 such as transistors, resistors, or display elements are mounted on the upper surface in FIG. 1), and a wiring pattern (not shown) is formed on the wiring surface (lower surface in FIG. 1). On the wiring surface of the single-sided printed circuit board 1, solder resist I is applied to the parts other than the soldering parts of the electronic components 2! 3 is formed, and a solder resist [!] is also formed on the mounting surface. 4 is formed.
これらのソルダーレジスト層３．４は電子部品２の取付
は前に、例えば株式会社田村製作所製の紫外線硬化形の
ホトコート（商品名）・、を片面プリント基板１の両面
に印刷して硬化させたものである。For these solder resist layers 3.4, before the electronic components 2 are attached, for example, UV-curable Photocoat (trade name) manufactured by Tamura Seisakusho Co., Ltd. is printed and cured on both sides of the single-sided printed circuit board 1. It is something.
５は防湿被膜で、これは例えばアクリル系オリゴマー（
東亜合成化学工業株式会社製アロニツクスＵＶ−３６０
７Ｋ）であって、片面プリント基板１にソルダーレジス
ト層３．４を形成した後、電子部品２を片面プリント基
板１に実装して半田付けを行ない、その後に各ソルダー
レジスト層３゜４よ及び電子部品２を覆うようにして形
成したものである。 本実施例によれば、片面プリント
基板１の両面にソルダーレジスト層３，４が形成されて
いるから、防湿被膜５の形成前に汚れが付着しにくく、
汚れを除去するためのブライマー処理を省略しても防湿
液ｌｌ１５の付着性を十分に向上させることができる。5 is a moisture-proof coating, which is made of, for example, acrylic oligomer (
Aronix UV-360 manufactured by Toagosei Chemical Industry Co., Ltd.
7K), after forming the solder resist layer 3.4 on the single-sided printed circuit board 1, the electronic component 2 is mounted on the single-sided printed circuit board 1 and soldered, and then each solder resist layer 3.4 and It is formed to cover the electronic component 2. According to this embodiment, since the solder resist layers 3 and 4 are formed on both sides of the single-sided printed circuit board 1, dirt is difficult to adhere to before the moisture-proof coating 5 is formed.
Even if the brimer treatment for removing dirt is omitted, the adhesion of the moisture-proofing liquid 115 can be sufficiently improved.
また、実装面側のソルダーレジストＢ３は配線面側のソ
ルダーレジスト層４の形成と同時或はそれに引き続いて
簡単に形成することができるから、生産工程が複雑化す
ることはなく、総じて生産性を大幅に向上させることが
できる。In addition, since the solder resist B3 on the mounting surface side can be easily formed simultaneously with or subsequent to the formation of the solder resist layer 4 on the wiring surface side, the production process is not complicated and overall productivity is improved. can be significantly improved.
［発明の効果］
本発明は以上述べたように、ソルダーレジスト層を利用
して片面プリント基板の両面に汚れが付着することを防
止できるから、防湿被膜の形成のために従来必須であっ
たプライマー処理を不要にすることができ、もって生産
性を大幅に向上させることができるという優れた効果を
奏するものである。[Effects of the Invention] As described above, the present invention can prevent dirt from adhering to both sides of a single-sided printed circuit board by using a solder resist layer, thereby eliminating the need for a primer, which was previously indispensable for forming a moisture-proof film. This has the excellent effect of eliminating the need for processing and thereby significantly improving productivity.
シスト層を除去して示す同縦断面図である。FIG. 3 is a longitudinal cross-sectional view of the same with a cyst layer removed.
図中、１は片面プリント基板、３．４はソルダーレジス
ト層、５は防湿被膜である。In the figure, 1 is a single-sided printed circuit board, 3.4 is a solder resist layer, and 5 is a moisture-proof coating.
出願人 株式会社 東 芝 ！ａ １ 図Applicant: Toshiba Co., Ltd. ! a1 Figure
Claims (1)
あって、前記片面プリント基板の両面にソルダーレジス
ト層を形成し、その後前記ソルダーレジスト層上に防湿
被膜を形成することを特徴とする回路基板の製造方法。1. A circuit board manufactured using a single-sided printed board, characterized in that a solder resist layer is formed on both sides of the single-sided printed board, and then a moisture-proof coating is formed on the solder resist layer. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26689384A JPS61144094A (en) | 1984-12-18 | 1984-12-18 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26689384A JPS61144094A (en) | 1984-12-18 | 1984-12-18 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144094A true JPS61144094A (en) | 1986-07-01 |
Family
ID=17437114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26689384A Pending JPS61144094A (en) | 1984-12-18 | 1984-12-18 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144094A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015146388A (en) * | 2014-02-03 | 2015-08-13 | 新光電気工業株式会社 | semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381960A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Printed board |
| JPS5694044A (en) * | 1979-12-18 | 1981-07-30 | Stabilus Gmbh | Cylinderrpiston device |
| JPS58132988A (en) * | 1982-02-03 | 1983-08-08 | 株式会社東芝 | Method of producing printed circuit board |
-
1984
- 1984-12-18 JP JP26689384A patent/JPS61144094A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381960A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Printed board |
| JPS5694044A (en) * | 1979-12-18 | 1981-07-30 | Stabilus Gmbh | Cylinderrpiston device |
| JPS58132988A (en) * | 1982-02-03 | 1983-08-08 | 株式会社東芝 | Method of producing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015146388A (en) * | 2014-02-03 | 2015-08-13 | 新光電気工業株式会社 | semiconductor device |
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