JPS61142458U - - Google Patents
Info
- Publication number
- JPS61142458U JPS61142458U JP2694185U JP2694185U JPS61142458U JP S61142458 U JPS61142458 U JP S61142458U JP 2694185 U JP2694185 U JP 2694185U JP 2694185 U JP2694185 U JP 2694185U JP S61142458 U JPS61142458 U JP S61142458U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- bidirectional diode
- silver
- semiconductor chip
- fused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 230000002457 bidirectional effect Effects 0.000 claims 3
- GHZFPSVXDWJLSD-UHFFFAOYSA-N chromium silver Chemical compound [Cr].[Ag] GHZFPSVXDWJLSD-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- MZFIXCCGFYSQSS-UHFFFAOYSA-N silver titanium Chemical compound [Ti].[Ag] MZFIXCCGFYSQSS-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案のＤＨＤの一実施例につき、ガ
ラス封止された部分を拡大した断面図、第２図は
ＤＨＤの２つのタイプを示す図、第３図は従来例
のガラス封止された部分の拡大断面図である。
１…半導体チツプ、２…口出導体、３…ガラス
管、４…盛り上げ電極、１０…半導体チツプ、１
１，１２…電極。
Fig. 1 is an enlarged cross-sectional view of the glass-sealed portion of one embodiment of the DHD of the present invention, Fig. 2 is a diagram showing two types of DHD, and Fig. 3 is a conventional example of the glass-sealed portion. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Exit conductor, 3... Glass tube, 4... Raised electrode, 10... Semiconductor chip, 1
1, 12...electrode.
Claims (1)
の間に、その両面にそれぞれ第１電極・第２電極
の盛り上げ電極を有する半導体チツプが挾着され
てなるダブルヒートシンク形の双方向性ダイオー
ドにおいて、前記第１電極は半球状をなし、前記
第２電極は半導体チツプ面上に周縁部をのぞき全
面に台状形をなしていることを特徴とする双方向
性ダイオード。 (2) 前記第１項の第２電極は、チタン銀または
クロム銀で蒸着後、銀盛り上げをなしたものであ
る実用新案登録請求の範囲第１項記載の双方向性
ダイオード。[Claims for Utility Model Registration] (1) A semiconductor chip having raised electrodes, a first electrode and a second electrode, is clamped between two lead conductors fused to both ends of a glass tube. In the double heat sink type bidirectional diode, the first electrode has a hemispherical shape, and the second electrode has a trapezoidal shape over the entire surface of the semiconductor chip except for the peripheral edge. Bidirectional diode. (2) The bidirectional diode according to claim 1, wherein the second electrode of claim 1 is formed by depositing titanium silver or chromium silver and then applying silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2694185U JPS61142458U (en) | 1985-02-26 | 1985-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2694185U JPS61142458U (en) | 1985-02-26 | 1985-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61142458U true JPS61142458U (en) | 1986-09-03 |
Family
ID=30523428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2694185U Pending JPS61142458U (en) | 1985-02-26 | 1985-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142458U (en) |
-
1985
- 1985-02-26 JP JP2694185U patent/JPS61142458U/ja active Pending
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