JPS61142450U

JPS61142450U -

Info

Publication number: JPS61142450U
Application number: JP2479285U
Authority: JP
Priority date: 1985-02-25
Filing date: 1985-02-25
Publication date: 1986-09-03

Description

[Brief explanation of drawings]

第１図は本考案の１実施例のチヤツク装置の１
部を破断して描いた平面図、第２図は同じく垂直
断面図である。第３図は従来のウエハチヤツク装
置の１例の斜視図、第４図は上記ウエハチヤツク
の底面を示した斜視図である。１…チヤツク装置、２…ウエハ、２′…ウエハ
、３…アーム、４…真空吸着パツド、５…真空ホ
ース、６…ケース、６ａ…ケースのアーム部、６
ｂ…ケースのチヤツクヘツド部、７…センタギヤ
、７ａ…センタギヤ軸、８…コネクチングロツド
、８ａ…コネクチングロツドピン、９…セクタギ
ヤ、９ａ…セクタギヤ軸、１０…閉じ姿勢に回動
した状態のウエハ把持爪、１０′…開き姿勢に回
動した状態のウエハ把持爪。 Figure 1 shows a chuck device according to an embodiment of the present invention.
FIG. 2 is a plan view showing a section cut away, and FIG. 2 is a vertical cross-sectional view. FIG. 3 is a perspective view of an example of a conventional wafer chuck device, and FIG. 4 is a perspective view showing the bottom of the wafer chuck. DESCRIPTION OF SYMBOLS 1...Chuck device, 2...Wafer, 2'...Wafer, 3...Arm, 4...Vacuum suction pad, 5...Vacuum hose, 6...Case, 6a...Arm part of case, 6
b...Chuck head portion of the case, 7...Center gear, 7a...Center gear shaft, 8...Connecting rod, 8a...Connecting rod pin, 9...Sector gear, 9a...Sector gear shaft, 10...Wafer grip in the state of being rotated to the closed position Claw, 10'...Wafer gripping claw rotated to open position.

Claims

[Scope of utility model registration request]

A toy device for gripping a semiconductor wafer, comprising: a center gear that is reciprocally rotated via a connecting rod; at least three sector gears meshing with the center gear; and a wafer gripping claw attached to a sector gear shaft fixed to the sector gear. and is configured such that at least three sector gears rotate simultaneously as the center gear rotates, and wafer gripping claws attached to the sector gears via sector gear shafts rotate open and close simultaneously. Wafer chuck device.