JPS6114179A - Method of bonding inorganic material - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for bonding the same or different types of inorganic materials, such as glass to glass, ceramic to ceramic, or a combination of glass and ceramic. It is.

[Prior Art] Inorganic materials, especially metal oxide materials such as glass and ceramics, are used in a wide range of applications due to their corrosion resistance, heat resistance, and their inherent optical, elastic, and thermal expansion properties. However, when used as a device member, there are difficulties in joining and assembling it. For example, conventionally, when glass glasses are to be bonded together, fusion bonding is used in which the glass is heated to an elevated temperature to bring the bonded surfaces into a molten state and then press-bonded. However, according to this method, so-called wobbling occurs in the vicinity of the joint, resulting in poor moldability, and it is not possible to accurately assemble the objects to be joined together while maintaining the predetermined shape. Furthermore, if the purpose is simply to join objects together, various organic adhesives can be used for bonding, but in this case, of course, they cannot withstand high-temperature use, and the original heat-resistant properties etc. will not be able to be used. This difficult situation is the same or even more difficult when trying to join ceramics together.

[Problems to be Solved by the Invention] The present invention has been made in view of the above circumstances, and provides a method for joining and integrating metal oxide-based inorganic materials such as glass and ceramics. As a new method, it does not suffer from the problem of deformation under high temperatures as in conventional fusion bonding, and the heterogeneity of the adhesive does not harm the material properties of the materials to be joined, as in the case of conventional bonding methods. It also provides a useful bonding method.

[Means for Solving the Problems] In order to achieve the technical problem created by the inventor as described above, the present invention provides a method for bonding materials of the same or different types together, The method is characterized in that a solution made by dissolving a metal alkoxide in an organic solvent is applied to the adhesive surface, and the inorganic materials are baked and bonded together while pressurizing them.

Suitable combinations of A-grade materials to be bonded by the method of the present invention include glass of the same or different types, ceramics of the same type, or metal oxide materials such as glass and ceramics. . As mentioned above, appropriate adhesion techniques have not been established for these at present.

As for the bonding mode according to the method of the present invention, first, as shown in FIG. 2, the bonded materials a2. a2 butt-joined or as shown in Fig. 3, the material to be joined &1. &1 may be joined in a T-shape (the adhesive surface is indicated by A in the figure). That is, as long as the bonding surface can be stably pressed, it will not be affected by the bonding mode, and various other bonding modes may be adopted depending on the purpose of the joint assembly.

The solution applied to the adhesive surface in the method of the present invention is M(OR),
It is made by dissolving a metal alkoxide represented by the following in an organic solvent. The solute metal alkoxide, which is the most important component here, is selected depending on the material of the material to be joined, that is, its component composition. In other words, as a general rule, a metal alkoxide corresponding to the constituent oxide of the material to be joined is added (for example, using Sl (OR) 4 hooked to Sin), and a metal alkoxide corresponding to the component ratio of the constituent oxide of the material to be joined is added. Then, the blending ratio of one or more metal alkoxides is adjusted by 1. I did. When the compositions of the materials to be joined are different, such as between different types of glasses, ceramics, or glass and ceramics,
Finally, the type and blending ratio of the metal alkoxide are adjusted so as to produce a metal oxide that has physical properties, particularly thermal expansion coefficients, that are equal to or similar to those of both materials to be joined. The metal alkoxides used are 5l(OR)-), Ha(OR)
-Ca(OR%), Al(OR)g, etc. can be used.On the other hand, organic solvents for dissolving this metal alkoxide include alcohol, benzene, etc. depending on the type of solute. An appropriate one is selected.

The solution to be applied to the bonding surface is prepared by adding the metal alkoxide determined by the bonding conditions, water added as necessary, and a catalyst acid or base to this organic solvent, and preferably refluxing the mixture to form a uniform solution. and apply it to at least one of the materials to be joined that corresponds to the bonding surface. At this time,
Said solution can be applied to the surface as a very thin film.

In this way, the solution applied to the surface of the materials to be joined is bonded to the materials at a predetermined timing and baked while applying pressure to the bonded surfaces.

are bonded together via an adhesive layer (metal oxide layer) having the same or similar physical properties.

[Effect] The adhesion mechanism according to the great invention will be explained.

As mentioned above, when a metal alkoxide is applied as a dispersion solution of an organic solvent to an adhesive surface, the alkoxide reacts with moisture in the solution or moisture absorbed from the atmosphere, and is hydrolyzed as described below. This hydrolysis rate can be adjusted, if necessary, with the catalysts mentioned above.

M (OR), 9M (OH added + nROH1) Next, after this hydrolysis, if necessary, drying and firing the materials to be joined under appropriate pressure on the bonding surface will result in the reaction generated by the above hydrolysis reaction. The hydroxide is further thermally decomposed to produce a metal oxide as described below.The firing temperature at this time is sufficient to remove the generated volatile components such as moisture, and high temperatures such as those used in fusion bonding are not required. do not.

Heat M (OH), -+ M Oy, + TH20 ↑ The solution applied to the bonding surface in this manner ultimately becomes a layer of metal oxide and bonds the materials to be bonded. Moreover, as mentioned above, if the metal alkoxide composition in the original solution is adjusted in advance, when bonding materials of the same quality, it is possible to create an adhesive layer with a composition that completely matches that of the materials to be joined. This is easily possible, and even when the components to be bonded are different, it is possible to create an adhesive layer with the most suitable composition for adhering them.

The metal oxide adhesive layer produced by this reaction only needs to be extremely thin (less than gm order), and is characterized by being "integrated" with the materials to be joined in a molecular bond state.

[Example] The present invention will be specifically explained below with reference to Examples.

Soda lime glass (Na Om Ca O@5SiO)
The plates were bonded together in a primary manner using the bonding method shown in FIG.

As a metal alkoxide, 5i (OC, H8; 0.0
24mo1. OH,ONa; 0.0053+so
l, Ca(0(,Hr), ; 0.004jI
ol was dissolved in methanol 401, and this was heated to 80°C for 1
The solution was refluxed for a period of time to obtain a uniform solution. This solution was coated on the adhesive surface of glass by a dip method, and then left in the air for 10 minutes to be hydrolyzed.

After that, pressurize the adhesive surface with a press plate for 20 minutes.
The bonding was completed by baking at a temperature of 50°C.

The bonded glass thus obtained could be bonded without deformation while maintaining the dimensional accuracy of the original glass plate. The composition of the metal oxide in the adhesive layer was the same as that of the base plate glass, and after adhesion, a completely homogeneous integrated state could be achieved in which the interface could not be discerned. Also,
In fact, even when heated to 600°C, no change was observed in the bonded part, and it was confirmed that the product had heat resistance properties equivalent to those of an integrally molded product. Also, it is strong enough in terms of strength.
In a destructive test, the base material broke first.

[Effects of the Invention] As explained above, in the bonding method of the present invention, materials to be bonded are bonded by applying a solution prepared by dissolving a metal alkoxide to the bonding surface, thereby achieving the following effects: 1. It is possible to bond the adhesive layer as a metal oxide having the same or similar physical properties to the materials to be bonded at a much lower temperature than conventional melt bonding. Therefore, according to this method, the materials to be joined are not deformed, and it is also possible to effectively avoid the problem of deterioration of usage characteristics such as heat resistance due to the adhesive.

Therefore, if the bonding method of the present invention is used, glass,
It is now possible to assemble and join difficult-to-bond inorganic materials such as ceramics by adhesion without difficulty, and this will greatly contribute to doubling the utility value of this type of material, whose demand is expected to increase in the future. .゛

[Brief explanation of the drawing]

1, 2, and 3 are side views showing adhesion and aspects of the adhesion method according to the present invention.

Claims (1)

[Claims] When bonding inorganic materials of the same or different types,
A method for adhering inorganic materials, characterized in that a solution prepared by dissolving a metal alkoxide in an organic solvent is applied to the adhesion surfaces thereof, and the inorganic materials are baked and bonded together while pressurizing them.