JPS6341807A - Method for connecting optical fiber and optical waveguide - Google Patents
Method for connecting optical fiber and optical waveguideInfo
- Publication number
- JPS6341807A JPS6341807A JP18575886A JP18575886A JPS6341807A JP S6341807 A JPS6341807 A JP S6341807A JP 18575886 A JP18575886 A JP 18575886A JP 18575886 A JP18575886 A JP 18575886A JP S6341807 A JPS6341807 A JP S6341807A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- circuit board
- optical
- optical waveguide
- metal alkoxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 56
- 230000003287 optical effect Effects 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 12
- 150000004706 metal oxides Chemical class 0.000 abstract description 12
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005253 cladding Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006060 molten glass Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
Abstract
Description
【発明の詳細な説明】
〔概要〕
回路基板に形成した光導波路に、光ファイバを接続する
にあたり、接続部にゾル状態の金属アルコキシドを■布
し、加熱し、ガラス化した金属酸化物で、光ファイバを
固着することにより固着の信頼度を向上させる。[Detailed Description of the Invention] [Summary] When connecting an optical fiber to an optical waveguide formed on a circuit board, a metal alkoxide in a sol state is applied to the connection part, and the metal oxide is heated and vitrified. By fixing the optical fiber, the reliability of fixing is improved.
本発明は、回路基板に形成した光導波路に、光ファイバ
を接続する方法の改良に関する。The present invention relates to an improvement in a method for connecting an optical fiber to an optical waveguide formed on a circuit board.
光集積回路、或いはその他の光装置には、回路基板に光
導波路を設け、さらに光・電変換素子をはじめ多数の光
部品を搭載したり、或いは光導波路に分岐、結合、或い
はスイッチング機能を持たせたものが多い。そして、こ
のような光装置と外部とを接続するため、光伝送路とし
て光ファイバを用い、光ファイバを回路基板の光導波路
に接続するのが一般的である。Optical integrated circuits or other optical devices include an optical waveguide on a circuit board, which is equipped with a large number of optical components including photoelectric conversion elements, or which has branching, coupling, or switching functions in the optical waveguide. There are a lot of things that have been added. In order to connect such an optical device to the outside, it is common to use an optical fiber as an optical transmission line and connect the optical fiber to an optical waveguide of a circuit board.
ガラス基板、或いはシリコン基板等の回路基板に形成し
た光導波路には、回路基板の表面の全面に、クラッド層
を形成し、さらにクラッド層の全表面にコア層を形成後
、エソチン・すシて、帯状の光導波路を設け、さらにこ
の光導波路の裸出した表面にクラッド層を形成し、回路
基板の上面に凹面が矩形状に突出した光導波路を設けた
ものがある。For an optical waveguide formed on a circuit board such as a glass substrate or a silicon substrate, a cladding layer is formed on the entire surface of the circuit board, and a core layer is further formed on the entire surface of the cladding layer, and then an Esothin-silicon layer is formed on the entire surface of the cladding layer. There is one in which a strip-shaped optical waveguide is provided, a cladding layer is formed on the exposed surface of the optical waveguide, and an optical waveguide with a rectangular concave surface is provided on the upper surface of the circuit board.
また回路基板に帯状にイオンを打込み、帯状の部分の屈
折率を回路基板の屈折率よりも大きくして、回路基板内
に光導波路を設けたものもある。There is also a device in which ions are implanted into a circuit board in a band shape, and the refractive index of the band portion is made larger than the refractive index of the circuit board, thereby providing an optical waveguide within the circuit board.
上述のような光導波路に、光ファイバを接続する従来の
方法は、回路基板上に形成された光導波路の場合は、回
路基板上に光ファイバを載せて光導波路の端面に光ファ
イバを当接し、この状態で、光導波路と光ファイバの接
続部に接着剤を塗布し、加熱し硬化させ、光ファイバを
回路基板に固着していた。In the case of an optical waveguide formed on a circuit board, the conventional method for connecting an optical fiber to the optical waveguide as described above is to place the optical fiber on the circuit board and abut the optical fiber against the end face of the optical waveguide. In this state, an adhesive was applied to the connection between the optical waveguide and the optical fiber, and heated and cured to fix the optical fiber to the circuit board.
他の固着手段としては、この接続部に溶融ガラスを塗布
しガラスを硬化させて、光ファイバを回路基板に固着し
ていた。Another method of fixing is to apply molten glass to the connecting portion and harden the glass to fix the optical fiber to the circuit board.
また、回路基板内に光導波路を設けたものは、光導波路
の延長線上に？１１蓼を設け、この溝に光ファ・イバを
挿入し、光ファイバの端面を光導波路の端面に当接させ
、この状態で接着剤、或いは溶融ガラスを用いて、光フ
ァイバを回路基板に固着していた。Also, if the optical waveguide is installed inside the circuit board, is it an extension of the optical waveguide? 11, insert the optical fiber into this groove, bring the end face of the optical fiber into contact with the end face of the optical waveguide, and in this state fix the optical fiber to the circuit board using adhesive or molten glass. Was.
Ｃ発明が解決しようとする問題点〕
しかしながら上記従来の接着剤を用いる手段は、接着剤
の熱膨張係数と光ファイバ、及び回路基板の熱膨張係数
とが異なることに起因して、温度変化により接着剤の光
ファイバ、或いは回路基板との密着度が低下し、光ファ
イバが位置ずれして、光導波路との光結合度が低下する
という問題点がある。C Problems to be Solved by the Invention] However, the above-mentioned conventional means using an adhesive has a difference in thermal expansion coefficient from that of the adhesive and that of the optical fiber and the circuit board. There is a problem in that the degree of adhesion of the adhesive to the optical fiber or the circuit board is reduced, the optical fiber is displaced, and the degree of optical coupling with the optical waveguide is reduced.
また接着剤が経時変化して劣化し、光ファイバと光導波
路との光結合度が低下するという問題点がある。Another problem is that the adhesive deteriorates over time, reducing the degree of optical coupling between the optical fiber and the optical waveguide.
一方、光ファイバの固着手段として溶融ガラスを用いた
ものは、ガラスの溶融温度が高い（１０００℃以上）こ
とに起因して、光ファイバが高温となり、光ファイバ、
光導波路等が損傷する恐れがある。On the other hand, in the case of using molten glass as a means for fixing optical fibers, the temperature of the optical fiber becomes high due to the high melting temperature of the glass (1000°C or more).
There is a risk of damage to the optical waveguide, etc.
上記従来の問題点を解決するため本発明方法は、第１図
、或いは第２図のように、回路基板１に形成した光導波
路２の端面に、光ファイバ３の端面を当接する。In order to solve the above-mentioned conventional problems, the method of the present invention brings the end face of an optical fiber 3 into contact with the end face of an optical waveguide 2 formed on a circuit board 1, as shown in FIG. 1 or FIG.
次に、ガラス化された状態で、光ファイバ３の組成、ま
たは回路基板ｌの組成に、近いか等しい組成を有する、
ゾル状態の金属アルコキシドＩＱａを、光導波路２と光
ファイバ３との接続部を覆う如くに塗布する。Next, in the vitrified state, it has a composition close to or equal to the composition of the optical fiber 3 or the composition of the circuit board l.
Metal alkoxide IQa in a sol state is applied so as to cover the connecting portion between the optical waveguide 2 and the optical fiber 3.
その後加熱し、ゾル状態の金属アルコキシド１０ａをガ
ラス化した金属酸化物１０として、この金属酸化物１０
で、光ファイバ３を回路基板ｌに固着するようにしたも
のである。Thereafter, the metal alkoxide 10a in a sol state is vitrified by heating to form a metal oxide 10.
The optical fiber 3 is fixed to the circuit board l.
上記本発明方法によれば、金属酸化物１０は、回路基板
１及び光ファイバ３に密着する性質を有し、且つその固
着強度が強い。したがって、光ファイバ３が位置ずれす
る恐れがなく、光結合の信頼度が向上する。According to the method of the present invention, the metal oxide 10 has the property of adhering closely to the circuit board 1 and the optical fiber 3, and has strong adhesion strength. Therefore, there is no fear that the optical fiber 3 will be misaligned, and the reliability of optical coupling is improved.
また、金属酸化物１０の組成が、光フアイバ３或いは回
路基板１の組成に等しいか、近いので、熱膨張係数が殆
ど等しい。よって周囲温度が変化しても、光ファイバ３
が位置ずれすることがない。Further, since the composition of the metal oxide 10 is equal to or close to the composition of the optical fiber 3 or the circuit board 1, the coefficients of thermal expansion are almost the same. Therefore, even if the ambient temperature changes, the optical fiber 3
will not shift position.
さらに、金属酸化物１０が光導波路と光ファイバの当接
する間隙に浸透した場合に、その屈折率が光ファイバの
屈折率に近いので、空気が間隙にある場合に比較して、
光結合損失が少なくなる。Furthermore, when the metal oxide 10 penetrates into the gap between the optical waveguide and the optical fiber, its refractive index is close to the refractive index of the optical fiber, so compared to when air is present in the gap,
Optical coupling loss is reduced.
なお、ゾル状態の金属アルコキシド１０ａをガラス化す
る加熱温度（５００℃乃至７００°Ｃ）が低いので、光
フアイバ３或いは光導波路２が損傷する恐れがない。Note that since the heating temperature (500° C. to 700° C.) for vitrifying the metal alkoxide 10a in a sol state is low, there is no risk of damage to the optical fiber 3 or the optical waveguide 2.
以下図を参照しながら、本発明方法を具体的に説明する
。The method of the present invention will be specifically explained below with reference to the drawings.
第１図の（ａｌ、 （ｂｌは本発明方法の工程を示す断
面図、第２図は本発明方法の他の実施例の斜視図である
。(al and (bl) in FIG. 1 are cross-sectional views showing the steps of the method of the present invention, and FIG. 2 is a perspective view of another embodiment of the method of the present invention.
第１図において、ガラスよりなる回路基板１の上面には
、コアｉ２Ａの上面、下面及び側面にクラッド層２Ｂを
有する光導波路２が形成され、光導波路２の端末は、回
路基板ｌの側縁近傍にある。In FIG. 1, an optical waveguide 2 having a cladding layer 2B on the upper, lower and side surfaces of a core i2A is formed on the upper surface of a circuit board 1 made of glass. It's nearby.
光ファイバ３を光導波路２に接続するにあたり、まず光
ファイバ３の端末部の被覆を剥離して、クラッド３Ｂを
裸出させる。そして第１図（ａｌのように、光ファイバ
３の端面を光導波路２の端面に当接し、コア層２Ａの軸
心と光ファイバ３のコア３Ａの軸心とを〜致させる。In connecting the optical fiber 3 to the optical waveguide 2, first, the coating on the end portion of the optical fiber 3 is peeled off to expose the cladding 3B. Then, as shown in FIG. 1 (al), the end surface of the optical fiber 3 is brought into contact with the end surface of the optical waveguide 2, and the axis of the core layer 2A and the axis of the core 3A of the optical fiber 3 are aligned.
この状態で光導波路２と光ファイバ３の接続部をＩうよ
うに、ゾル状態の金属アルコキシド１０ａを塗布する。In this state, the metal alkoxide 10a in a sol state is applied so as to cover the connection portion between the optical waveguide 2 and the optical fiber 3.
このゾル状態の金属アルコキシド１０ａは、ガラス化さ
れた状態で、その組成が光ファイバ３の組成にぼぼ等し
いものであって、選択した金属アルコキシドに、Ｒ−Ｏ
Ｈ（Ｒはアルキル基、ＯＨはアルコール）を溶剤として
加え、ゾル状態にしたものである。The metal alkoxide 10a in a sol state has a composition approximately equal to that of the optical fiber 3 in a vitrified state, and the selected metal alkoxide is R-O.
H (R is an alkyl group, OH is an alcohol) is added as a solvent to form a sol.
いま、光ファイバ３が石英系のガラスの場合は、金属ア
ルコキシド１０として、
例えば Ｓ、（０・Ｒ）４ を用いる。Now, when the optical fiber 3 is made of quartz-based glass, the metal alkoxide 10 is, for example, S, (0·R) 4 .
Ｓ、は金属シリコン、
０ は酸素、
Ｒはアルキル基、
なお、金属アルコキシド１０ａの組成に適した金属は、
上述の金属シリコンの他に、ゲルマニュウム、アルミニ
ュウム、チタン等がある。S is metal silicon, 0 is oxygen, R is an alkyl group, and metals suitable for the composition of metal alkoxide 10a are:
In addition to the metal silicon mentioned above, there are germanium, aluminum, titanium, etc.
次に、約１００℃に加熱して乾燥し、溶剤を蒸発させ、
さらに６００°Ｃ前後に加熱する。Next, dry by heating to about 100°C to evaporate the solvent,
Further heat to around 600°C.
このことにより、第１図（ｂ）のようにゾル状態の金属
アルコキシド１０ａ中の金属が、金属酸化物（例えば
Ｓ、０□）となり、ガラス化されて、金属酸化物１０と
なり、光ファイバ３．光導波路２゜回路基板１に層状に
固着する。As a result, the metal in the metal alkoxide 10a in the sol state as shown in FIG.
S, 0□), which is vitrified to become a metal oxide 10, and an optical fiber 3. The optical waveguide 2° is fixed to the circuit board 1 in a layered manner.
第２図の光導波路２は、回路基板ｌにイオンを注入され
てなるものであって、光導波路２の端末の延長線上に、
溝５を設け、この溝５に光ファイバ３を挿入し、光導波
路２の端面に光ファイバ３の端面を当接させ、その後、
前述の手段を適用して、金属酸化物ＩＯで光ファイバ３
を、回路基板１に固着したものである。The optical waveguide 2 in FIG. 2 is formed by implanting ions into a circuit board l, and on the extension of the terminal of the optical waveguide 2,
A groove 5 is provided, the optical fiber 3 is inserted into the groove 5, the end surface of the optical fiber 3 is brought into contact with the end surface of the optical waveguide 2, and then,
Applying the aforementioned measures, the optical fiber 3 is made of metal oxide IO.
is fixed to the circuit board 1.
以上説明したように本発明方法は、金属酸化物で光ファ
イバを回路基板に固着するものであって、固着強度が強
くて、光導波路と光ファイバとの光結合の信頼度が高く
、且つ光ファイバ、光導波路等が損傷する恐れがない等
、実用上で優れた効果がある。As explained above, the method of the present invention is to fix an optical fiber to a circuit board using a metal oxide, which has strong fixing strength, high reliability of optical coupling between the optical waveguide and the optical fiber, and It has excellent practical effects, such as there is no risk of damage to fibers, optical waveguides, etc.
第１図の（５）、（ｂ）は本発明方法の工程を示す断面
図、
第２図は本発明方法の他の実施例の斜視図である。
図において、
１は回路基板、
２は光導波路、
３は光ファイバ、
５は溝、
１０は金属酸化物、
１０ａはゾル状態の金属アルコキシドを示す。
５、・′σ）２、(5) and (b) of FIG. 1 are sectional views showing the steps of the method of the present invention, and FIG. 2 is a perspective view of another embodiment of the method of the present invention. In the figure, 1 is a circuit board, 2 is an optical waveguide, 3 is an optical fiber, 5 is a groove, 10 is a metal oxide, and 10a is a metal alkoxide in a sol state. 5,・′σ)2,
Claims (1)
ファイバ（３）の端面を当接し、 ガラス化された状態で該光ファイバ（３）の組成、また
は該回路基板（１）の組成に、近いか等しい組成を有す
る、ゾル状態の金属アルコキシド（１０ａ）を、該光導
波路（２）と該光ファイバ（３）との接続部を覆う如く
に塗布した後に、 加熱し、該ゾル状態の金属アルコキシド（１０ａ）をガ
ラス化した金属酸化物（１０）として、該光ファイバ（
３）を該回路基板（１）に固着することを特徴とする光
ファイバと光導波路との接続方法。[Claims] The end face of an optical fiber (3) is brought into contact with the end face of an optical waveguide (2) formed on a circuit board (1), and the composition of the optical fiber (3) is determined in a vitrified state, or A metal alkoxide (10a) in a sol state having a composition close to or equal to that of the circuit board (1) was applied so as to cover the connecting portion between the optical waveguide (2) and the optical fiber (3). Afterwards, the optical fiber (
3) is fixed to the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18575886A JPS6341807A (en) | 1986-08-07 | 1986-08-07 | Method for connecting optical fiber and optical waveguide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18575886A JPS6341807A (en) | 1986-08-07 | 1986-08-07 | Method for connecting optical fiber and optical waveguide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6341807A true JPS6341807A (en) | 1988-02-23 |
Family
ID=16176352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18575886A Pending JPS6341807A (en) | 1986-08-07 | 1986-08-07 | Method for connecting optical fiber and optical waveguide |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6341807A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4953936A (en) * | 1988-09-20 | 1990-09-04 | Standard Elektrik Lorenz Aktiengesellschaft | Optical waveguide module with fiber coupling |
| JPH03158802A (en) * | 1989-11-17 | 1991-07-08 | Hitachi Cable Ltd | Optical waveguide and its manufacture |
| JPH03297720A (en) * | 1990-04-16 | 1991-12-27 | Sumitomo Metal Ind Ltd | Synchronized operation control unit for carrying device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189308A (en) * | 1983-04-13 | 1984-10-26 | Nippon Telegr & Teleph Corp <Ntt> | Connecting method of optical fiber and optical waveguide |
| JPS6114179A (en) * | 1984-06-30 | 1986-01-22 | 株式会社島津製作所 | Method of bonding inorganic material |
| JPS6155616A (en) * | 1984-08-24 | 1986-03-20 | Shimadzu Corp | Manufacture of light shunt |
-
1986
- 1986-08-07 JP JP18575886A patent/JPS6341807A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189308A (en) * | 1983-04-13 | 1984-10-26 | Nippon Telegr & Teleph Corp <Ntt> | Connecting method of optical fiber and optical waveguide |
| JPS6114179A (en) * | 1984-06-30 | 1986-01-22 | 株式会社島津製作所 | Method of bonding inorganic material |
| JPS6155616A (en) * | 1984-08-24 | 1986-03-20 | Shimadzu Corp | Manufacture of light shunt |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4953936A (en) * | 1988-09-20 | 1990-09-04 | Standard Elektrik Lorenz Aktiengesellschaft | Optical waveguide module with fiber coupling |
| JPH03158802A (en) * | 1989-11-17 | 1991-07-08 | Hitachi Cable Ltd | Optical waveguide and its manufacture |
| JPH03297720A (en) * | 1990-04-16 | 1991-12-27 | Sumitomo Metal Ind Ltd | Synchronized operation control unit for carrying device |
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