JPS61140524U - - Google Patents
Info
- Publication number
- JPS61140524U JPS61140524U JP2363585U JP2363585U JPS61140524U JP S61140524 U JPS61140524 U JP S61140524U JP 2363585 U JP2363585 U JP 2363585U JP 2363585 U JP2363585 U JP 2363585U JP S61140524 U JPS61140524 U JP S61140524U
- Authority
- JP
- Japan
- Prior art keywords
- core
- chip
- electronic component
- predetermined film
- metal core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Details Of Resistors (AREA)
Description
第1図は、この考案の一実施例に係るチツプ形
コンデンサを示す断面図である。第2図は、第1
図のチツプ形コンデンサの製造方法の一例を説明
するための図である。第3図は、この考案の他の
実施例に係るチツプ形コンデンサを示す断面図で
ある。第4図は、従来のチツプ形コンデンサを示
す断面図である。
11……金属芯、12……誘電体膜、13……
電極膜。
FIG. 1 is a sectional view showing a chip-type capacitor according to an embodiment of this invention. Figure 2 shows the first
FIG. 3 is a diagram for explaining an example of a method for manufacturing the chip-type capacitor shown in the figure. FIG. 3 is a sectional view showing a chip type capacitor according to another embodiment of the invention. FIG. 4 is a sectional view showing a conventional chip capacitor. 11...Metal core, 12...Dielectric film, 13...
electrode membrane.
Claims (1)
子部品において、芯として金属芯を用い、当該金
属芯を一つの電極としていることを特徴とするチ
ツプ形電子部品。 (2) 前記所定の膜が乾式メツキによつて形成さ
れている実用新案登録請求の範囲第1項記載のチ
ツプ形電子部品。[Claims for Utility Model Registration] (1) A chip-shaped electronic component in which a predetermined film is formed on the surface of the core, characterized in that a metal core is used as the core and the metal core is used as one electrode. electronic components. (2) The chip-shaped electronic component according to claim 1, wherein the predetermined film is formed by dry plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2363585U JPS61140524U (en) | 1985-02-20 | 1985-02-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2363585U JPS61140524U (en) | 1985-02-20 | 1985-02-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61140524U true JPS61140524U (en) | 1986-08-30 |
Family
ID=30517046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2363585U Pending JPS61140524U (en) | 1985-02-20 | 1985-02-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61140524U (en) |
-
1985
- 1985-02-20 JP JP2363585U patent/JPS61140524U/ja active Pending
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