JPS61137667A - Soldering method - Google Patents

Abstract

PURPOSE:To make the insertion hole of the circuit board of no component being inserted not to be clogged with a solder even when a dip soldering is performed by performing a soldering by inserting the jig having the same terminal pitch with the no-inserting component and having similar diameter and shape into the insert hole of no soldering component. CONSTITUTION:A circuit board is dipped in hot solder 1 to solder after inserting said jig into the component inserting hole of not inserting yet of the board 1. As an example of said jig 2, 3, the jig for seven pins single in-line packaged IC having seven pieces of legs 9 with its main body 8 having similar shape to an envelope of the IC may be given. According to this invention, the inserting hole of the circuit board where no component is inserted is not clogged even when a dip soldering is performed by using the jig of simple structure. The attachment and detachment of the jig is simple as well and the repeated use is also available.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering method of dip soldering using molten solder, which is commonly used for assembling circuit boards of electronic devices and the like.

Conventional technology The assembly and soldering of circuit boards for electronic devices, etc. involves inserting the specified components into a circuit board that has component insertion holes and conductor patterns, and then soldering the circuit board into a solder tank in which molten solder is flowing. Soldering of circuit boards is generally done by dipping the surface, and soldering is carried out between the conductor pattern formed on the surface and the leads of the inserted components. At this time, due to issues such as when to obtain parts, it is common practice to perform dip soldering before all parts have been inserted, and then insert additional parts later. However, since the solder flows into the component insertion holes in which no components are inserted, the holes are clogged with solder, which causes the inconvenience that the solder in those parts must be removed when additional components are inserted later. Conventionally, this has been done by masking the conductor pattern in the part where the component has not been inserted with paper tape, etc., or by inserting a rod made of a material that repels solder, such as a toothpick, into the insertion hole where the component has not been inserted and then plugging the hole. This method prevented the hole from becoming clogged with solder.

Problems to be Solved by the Invention With such conventional methods, attachment and detachment are time-consuming. In addition, the method of using paper tape does not require recycling, so there is also an economical problem.

The present invention has been made in view of this problem, and an object of the present invention is to provide a soldering method using a jig that has a simple structure and can be easily attached and detached.

Means for Solving the Problems In order to solve the above problems, the present invention uses a jig that has the same terminal pitch as the parts that are not inserted, has a similar diameter and shape, and is made of a material that repels solder. be.

According to the present invention, by inserting this jig into the component insertion hole that is not to be soldered, it is possible to prevent solder from entering at once, and it is also possible to easily remove the component.

Embodiment FIG. 1 is an external perspective view of a circuit board with components and jigs inserted, showing an embodiment of the present invention. In the figure, 1 is a circuit board, 2 and 3
is a jig, and 4, 5, 6, and 7 are parts. After inserting the jigs 2 and 3 into the component insertion holes of the circuit board 1 in which no components have been inserted, the circuit board 1 is immersed in molten solder to perform soldering.

FIG. 2 is an example of a jig used in an embodiment of the present invention. In the figure, 8 is a main body, and 9 is a leg. This is a jig for a 7-pin single in-line package rQ, the main body 8 has a shape similar to an RC envelope, the legs 9 have 7 legs in this case, and the pitch shown at P in the figure is It has a diameter of 2°54ff, and its tip is pointed, making it easy to insert it into the component insertion hole of the circuit board 1. The material used is one that repels solder, such as wood. The main body 8 may be made of any material, but if it is made of aluminum or the like and has an appropriate weight, the jig can be prevented from being lifted up by the solder jet. If the legs 9 are fitted into holes provided in the main body 8 and mechanically connected, even if a part of the legs 9 is damaged during repeated use, the legs can be easily replaced.

FIG. 3 shows another example of a jig used in an embodiment of the present invention, in which 10 is a main body and 11 is a leg.

This is a jig for a 16-bin dual inline package IC. The pitch of the legs 11 is P in the figure.

is 2゜54JIIl, P2 is 7,62MM, and 1
It can be inserted into the component insertion hole of the θ pin IC.

Effects of the Invention According to the present invention, by using a jig with a simple structure, the insertion hole of the circuit board in which no component is inserted will not be clogged with solder even when dip soldering is performed. In addition, it is easy to install and remove, and it can also be used reversibly.
It is excellent in shortening work time and being economical.

[Brief explanation of drawings]

Fig. 1 shows parts and fittings 1 for explaining one embodiment of the present invention.
・Circuit board, 2, 3...Jig, 4, 5, 6゜7
・・・・・・Parts, 8.10-・・・Main body, 9.11・
····leg. Name of agent: Patent attorney Toshio Nakao and 1 other person 45
I, 7... Autopsy'' $2 figure

Claims (1)

[Claims] In a circuit board having a plurality of component insertion hole groups for inserting and soldering a plurality of components, when a specified component is simultaneously inserted into at least two or more holes of the insertion hole group that have not yet been inserted, and the component is exposed to molten solder. A jig made of non-wet material,
A soldering method characterized in that the circuit board is inserted into the group of insertion holes in which the component has not been inserted, and the circuit board is immersed in molten solder to perform soldering.