JPS61137330A - 半導体の微細加工方法 - Google Patents

半導体の微細加工方法

Info

Publication number
JPS61137330A
JPS61137330A JP59260296A JP26029684A JPS61137330A JP S61137330 A JPS61137330 A JP S61137330A JP 59260296 A JP59260296 A JP 59260296A JP 26029684 A JP26029684 A JP 26029684A JP S61137330 A JPS61137330 A JP S61137330A
Authority
JP
Japan
Prior art keywords
substrate
aqueous solution
layer
voltage
siox
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59260296A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0479131B2 (https=
Inventor
Kyoichi Ikeda
恭一 池田
Katsumi Isozaki
克巳 磯崎
Tetsuya Watanabe
哲也 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP59260296A priority Critical patent/JPS61137330A/ja
Publication of JPS61137330A publication Critical patent/JPS61137330A/ja
Publication of JPH0479131B2 publication Critical patent/JPH0479131B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Weting (AREA)
JP59260296A 1984-12-10 1984-12-10 半導体の微細加工方法 Granted JPS61137330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59260296A JPS61137330A (ja) 1984-12-10 1984-12-10 半導体の微細加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59260296A JPS61137330A (ja) 1984-12-10 1984-12-10 半導体の微細加工方法

Publications (2)

Publication Number Publication Date
JPS61137330A true JPS61137330A (ja) 1986-06-25
JPH0479131B2 JPH0479131B2 (https=) 1992-12-15

Family

ID=17346070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59260296A Granted JPS61137330A (ja) 1984-12-10 1984-12-10 半導体の微細加工方法

Country Status (1)

Country Link
JP (1) JPS61137330A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228049A (ja) * 1989-02-28 1990-09-11 Nec Corp 半導体装置の製造方法
JP2013206888A (ja) * 2012-03-27 2013-10-07 Sanyo Electric Co Ltd 太陽電池の製造方法及び半導体材料からなる基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130038A (ja) * 1984-07-23 1986-02-12 Nec Corp エツチングの方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130038A (ja) * 1984-07-23 1986-02-12 Nec Corp エツチングの方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228049A (ja) * 1989-02-28 1990-09-11 Nec Corp 半導体装置の製造方法
JP2013206888A (ja) * 2012-03-27 2013-10-07 Sanyo Electric Co Ltd 太陽電池の製造方法及び半導体材料からなる基板の製造方法

Also Published As

Publication number Publication date
JPH0479131B2 (https=) 1992-12-15

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