JPS61136557U - - Google Patents

Info

Publication number
JPS61136557U
JPS61136557U JP2005585U JP2005585U JPS61136557U JP S61136557 U JPS61136557 U JP S61136557U JP 2005585 U JP2005585 U JP 2005585U JP 2005585 U JP2005585 U JP 2005585U JP S61136557 U JPS61136557 U JP S61136557U
Authority
JP
Japan
Prior art keywords
insulating container
utility
registration request
scope
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2005585U priority Critical patent/JPS61136557U/ja
Publication of JPS61136557U publication Critical patent/JPS61136557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例によるリードレスダ
イオードの側面図、第2図は混成集積回路用基板
にリードレスダイオードを搭載した時の斜視図で
ある。第3図は従来のリードレスダイオードを混
成集積回路に搭載する際の斜視図である。 1,11……絶縁容器、2,12……円柱状の
電極部、3……四角柱状の電極部、5,15……
混成集積回路用基板、6,16……メタライズ領
域。
FIG. 1 is a side view of a leadless diode according to an embodiment of the present invention, and FIG. 2 is a perspective view of the leadless diode mounted on a hybrid integrated circuit board. FIG. 3 is a perspective view of a conventional leadless diode mounted on a hybrid integrated circuit. 1, 11... Insulating container, 2, 12... Cylindrical electrode part, 3... Square columnar electrode part, 5, 15...
Substrate for hybrid integrated circuit, 6, 16...metalized area.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を収容した絶縁容器の両端の電極部
の少なくとも一方の電極形状が四角柱又はそれ以
上の多角柱であることを特徴とするリードレス型
半導体装置。
1. A leadless semiconductor device characterized in that the shape of at least one of the electrode portions at both ends of an insulating container housing a semiconductor element is a quadrangular prism or a polygonal prism larger than that.
JP2005585U 1985-02-15 1985-02-15 Pending JPS61136557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005585U JPS61136557U (en) 1985-02-15 1985-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005585U JPS61136557U (en) 1985-02-15 1985-02-15

Publications (1)

Publication Number Publication Date
JPS61136557U true JPS61136557U (en) 1986-08-25

Family

ID=30510191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005585U Pending JPS61136557U (en) 1985-02-15 1985-02-15

Country Status (1)

Country Link
JP (1) JPS61136557U (en)

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