JPS61136547U - - Google Patents
Info
- Publication number
- JPS61136547U JPS61136547U JP1985018027U JP1802785U JPS61136547U JP S61136547 U JPS61136547 U JP S61136547U JP 1985018027 U JP1985018027 U JP 1985018027U JP 1802785 U JP1802785 U JP 1802785U JP S61136547 U JPS61136547 U JP S61136547U
- Authority
- JP
- Japan
- Prior art keywords
- metal piece
- insulating
- metal
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018027U JPH0333071Y2 (https=) | 1985-02-12 | 1985-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985018027U JPH0333071Y2 (https=) | 1985-02-12 | 1985-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61136547U true JPS61136547U (https=) | 1986-08-25 |
| JPH0333071Y2 JPH0333071Y2 (https=) | 1991-07-12 |
Family
ID=30506279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985018027U Expired JPH0333071Y2 (https=) | 1985-02-12 | 1985-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333071Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132644A1 (ja) * | 2012-03-09 | 2013-09-12 | 三菱電機株式会社 | 半導体モジュール |
-
1985
- 1985-02-12 JP JP1985018027U patent/JPH0333071Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013132644A1 (ja) * | 2012-03-09 | 2013-09-12 | 三菱電機株式会社 | 半導体モジュール |
| US9443784B2 (en) | 2012-03-09 | 2016-09-13 | Mitsubishi Electric Corporation | Semiconductor module including plate-shaped insulating members having different thickness |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0333071Y2 (https=) | 1991-07-12 |