JPS61134081U - - Google Patents

Info

Publication number
JPS61134081U
JPS61134081U JP1708185U JP1708185U JPS61134081U JP S61134081 U JPS61134081 U JP S61134081U JP 1708185 U JP1708185 U JP 1708185U JP 1708185 U JP1708185 U JP 1708185U JP S61134081 U JPS61134081 U JP S61134081U
Authority
JP
Japan
Prior art keywords
layer
layers
circuit board
multilayer circuit
ceramic multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1708185U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1708185U priority Critical patent/JPS61134081U/ja
Publication of JPS61134081U publication Critical patent/JPS61134081U/ja
Pending legal-status Critical Current

Links

JP1708185U 1985-02-12 1985-02-12 Pending JPS61134081U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1708185U JPS61134081U (enExample) 1985-02-12 1985-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1708185U JPS61134081U (enExample) 1985-02-12 1985-02-12

Publications (1)

Publication Number Publication Date
JPS61134081U true JPS61134081U (enExample) 1986-08-21

Family

ID=30504457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1708185U Pending JPS61134081U (enExample) 1985-02-12 1985-02-12

Country Status (1)

Country Link
JP (1) JPS61134081U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008305944A (ja) * 2007-06-07 2008-12-18 Denso Corp セラミック積層配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008305944A (ja) * 2007-06-07 2008-12-18 Denso Corp セラミック積層配線基板

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