JPH01173970U - - Google Patents
Info
- Publication number
- JPH01173970U JPH01173970U JP7119988U JP7119988U JPH01173970U JP H01173970 U JPH01173970 U JP H01173970U JP 7119988 U JP7119988 U JP 7119988U JP 7119988 U JP7119988 U JP 7119988U JP H01173970 U JPH01173970 U JP H01173970U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- conductive circuit
- wiring board
- multilayer wiring
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7119988U JPH01173970U (enExample) | 1988-05-30 | 1988-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7119988U JPH01173970U (enExample) | 1988-05-30 | 1988-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173970U true JPH01173970U (enExample) | 1989-12-11 |
Family
ID=31296409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7119988U Pending JPH01173970U (enExample) | 1988-05-30 | 1988-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173970U (enExample) |
-
1988
- 1988-05-30 JP JP7119988U patent/JPH01173970U/ja active Pending