JPS61134043U - - Google Patents
Info
- Publication number
- JPS61134043U JPS61134043U JP1536585U JP1536585U JPS61134043U JP S61134043 U JPS61134043 U JP S61134043U JP 1536585 U JP1536585 U JP 1536585U JP 1536585 U JP1536585 U JP 1536585U JP S61134043 U JPS61134043 U JP S61134043U
- Authority
- JP
- Japan
- Prior art keywords
- flange
- integrated circuit
- frequency power
- power amplification
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003321 amplification Effects 0.000 claims description 7
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＰＡＩＣ（高周波電力増幅用集積回
路）を示す斜視図、第３図は本考案の他の実施例
の放熱器を示す斜視図、第４図は従来のＰＡＩＣ
（高周波電力増幅用集積回路）の取付構造の斜視
図、第５図は従来のＰＡＩＣの取付構造の側面図
、第６図は第４図の回路基板のアースパターンと
ねじ８との接続部を拡大して示す斜視図である。
１……ＰＡＩＣ（高周波電力増幅用集積回路）
、２，２ａ……フランジ、３，３ａ……放熱器、
４……ねじ、５……端子、６……回路基板、７…
…回路基板固定用のねじ止め部、８……ねじ、９
，１０……溝、１１，１２……溝。
Figure 1 is a plan view showing one embodiment of the present invention;
The figures are a perspective view showing the PAIC (high-frequency power amplification integrated circuit) shown in Fig. 1, Fig. 3 a perspective view showing a heatsink of another embodiment of the present invention, and Fig. 4 a conventional PAIC.
(High-frequency power amplification integrated circuit) Figure 5 is a side view of the conventional PAIC mounting structure, Figure 6 shows the connection between the earth pattern of the circuit board and screw 8 in Figure 4. It is an enlarged perspective view. 1...PAIC (high frequency power amplification integrated circuit)
, 2, 2a... flange, 3, 3a... radiator,
4...Screw, 5...Terminal, 6...Circuit board, 7...
...Screw stop for fixing the circuit board, 8...Screw, 9
, 10... groove, 11, 12... groove.
Claims (1)
、前記フランジを介して前記高周波増幅用集積回
路から発生する熱を放熱する放熱器とを備え、か
つ前記フランジと、前記放熱器との間にサーマル
コンバウンドを塗布してなる高周波電力増幅用集
積回路の取付構造において、前記フランジと、前
記放熱器とが接する側の両壁面のうちの少くとも
一方に設けられた少くとも１本の溝を具備するこ
とを特徴とする高周波電力増幅用集積回路の取付
構造。 A high-frequency power amplification integrated circuit having a flange, and a heat radiator that radiates heat generated from the high-frequency power amplification integrated circuit through the flange, and a thermal condenser is provided between the flange and the heat radiator. A mounting structure for a high-frequency power amplification integrated circuit formed by coating the flange with at least one groove provided in at least one of both wall surfaces on the side where the flange and the heat sink are in contact. A mounting structure for an integrated circuit for high frequency power amplification, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1536585U JPS61134043U (en) | 1985-02-07 | 1985-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1536585U JPS61134043U (en) | 1985-02-07 | 1985-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134043U true JPS61134043U (en) | 1986-08-21 |
Family
ID=30501143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1536585U Pending JPS61134043U (en) | 1985-02-07 | 1985-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134043U (en) |
-
1985
- 1985-02-07 JP JP1536585U patent/JPS61134043U/ja active Pending