JPS61132356A - Thermal recording head - Google Patents

Abstract

PURPOSE:To enable miniaturization and lightening of subject head by providing an interlinking portion between a protective cover and a heat sink for positioning and fixing the protective cover on the heat sink. CONSTITUTION:After a ceramic substrate 1 is mounted on a heat sink 6 and a driver IC3 is installed thereon, two protrusions 7a and 7e of a head cover 7 are respectively inserted between two protruding portions 6b and 6c, and a concave 6a, and at the same time, the lower portions of the two interlinking members 7g are moved downwards while being extended outwards along both ends of the heat sink 6. When the lower portions reached to the bottom surface of the heat sink 6, they return to the original positions by themselves and the protruding portion 7f is interlinked with the bottom surface of the heat sink 6. Then, the head cover 7 is fixed to the support 6d with two nylon push rivets 9. Therefore, by the above, the positioning of the head cover 7 in the directions of either forwards or backwards, right or left, upwards or downwards is easily determined. Also, contact between the head cover 7 and the driver IC3 is prevented, and the head cover 7 may be miniaturerized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thermal recording head, particularly to a thermal recording head having a heat sink and a head force bar suitable for small size and low cost.

[Background of the invention]

Regarding conventional thermal recording heads, for example,
As introduced in No. 93572, a head support supporting a thermal head is provided with a guide groove for guiding and engaging a pressure roller, and a biasing means for urging the head support toward the pressure roller is provided with a heat-sensitive element. At least one head is provided on each side of the pressure roller at a predetermined distance from the area where the heat-sensitive head comes into contact with the pressure roller, thereby preventing the thermal head from rotating and vibrating around the pressure roller as a fulcrum. Although it is possible to easily align the pressure roller and the heat-sensitive head and to prevent poor pressure contact from occurring due to the vibration of the heat-sensitive head, no consideration has been given to reducing the size and weight of the heat-sensitive head.

[Purpose of the invention]

As stated above, the conventional thermal recording head does not take into account the reduction in size and weight, and an object of the present invention is to improve this and provide a thermal recording head that can be made smaller and lighter.

[Summary of the invention]

In order to achieve the above object, the present invention provides a ceramic substrate on which a heating resistor and a wiring pattern are formed.

A thermal recording head comprising a heat sink for heat dissipation and a protective cover is characterized in that an engaging portion is provided between the protective cover and the heat sink in order to position and fix the protective cover to the heat sink.

[Embodiments of the invention]

1 and 2 showing one embodiment of the present invention will be explained below. FIG. 1 is a plan view of a thermal recording head showing an embodiment of the present invention, and FIG. 2 is a cross-sectional side view taken along the line A--A in FIG. 1.

A ceramic substrate 1 is formed from a heating resistor 2 and a wiring pattern (not shown), a driver IC 3 is mounted thereon, and a connector 5 is connected via an FPC 4 . 6
The heat sink is formed by die-casting from two materials, such as ADCl, into a shape similar to a rod. That is, the heat sink 6 has a concave portion 6a formed in a portion A of its upper surface, and two protrusions 6b and 6c that protrude upward in parallel at both ends of the portion B in the front and back direction with respect to FIG.
Fixed.

A supporting portion 6d projecting upward in parallel is fixed between these projections 6b and 6c, and the ceramic substrate 1 is mounted between the recess 6a and the two projections 6b and 6c. . , 7 is a head cover, which is formed by molding, for example, a polycarbonate material into the shape of a hole. That is, the head cover 7 has a convex portion 7a fixed to be inserted between the two protrusions 6b and 6c of the B portion at a position facing each other.

Two inclined surfaces 7 are arranged above the end of the ceramic substrate 1 so that the distance between them increases as the distance increases upward.
b, 7c, a dish-shaped through hole 7d into which the head roller 8 is inserted is formed, a convex part 7e to be inserted into the recess 6a is fixed to the part A, and both ends of the heat sink 6 are fixed to the lower part of both ends. Two engaging members 7g having protrusions 7f that engage with the bottom surface of the heat sink 6 are fixed to the inner C portions of the lower ends of the engaging members 7g, and two nylon butt rivets 9 are attached to the upper surface of the support portion 6d. Fixed. The head roller 8 is supported at both ends by roller guides 8a.

The two engaging members 7g are formed such that their lower C portions are at both ends of the heat sink 9, and when they spread out on their own and reach the bottom surface of the heat sink 9, they return as shown in the original figure. Although not shown, when the head roller 8 is rotated by a drive mechanism (not shown), the paper is fed from the B section side onto the top surface of the head cover 7, and the paper is fed onto the top surface of the head cover 7 from the side B, and onto one inclined surface 7b. , and the ceramic substrate 1, and then discharged onto the other inclined surface 7c. Further, D in the drawing indicates the distance from the position where the ceramic substrate 1 and the head roller 8 are in contact with each other to the driver IC 3. With the above configuration, after mounting the ceramic substrate 1 on the heat sink 6 and attaching the driver IC 3, the two protrusions 7 of the head cover 6
a, 7e respectively with two protrusions 6b, 6c and a recess 6
a, and simultaneously move the lower parts of the two engaging members 7g to both ends of the heat sink 6 while spreading outward, and when they reach the bottom of the heat sink 6, return to their original state with their own blades. Return to position and attach the protrusion 7f to the heat sink 6.
engages the bottom surface of the Next, the head cover 7 is fixed to the support portion 6d using two nylon bush rivets 9.

Therefore, the relative position and mutual gap between the two protrusions 7a and 7e, the two protrusions 6b and 6c, and the recess 6a, the height of the support portion 6d, and the position of the protrusion 7f are set in advance. By forming the head cover 7 to have the dimensions shown in FIG. Although the head cover 7 is generally used only to protect the driver IC 3, the head cover 7 of the present invention also has the function of guiding paper feeding in addition to the above functions, so that the number of parts can be reduced. Furthermore, convex portions 7a are provided at portions A and B, which are structurally weak, of the head cover 7.

7e is formed to add strength, the thickness of the head cover can be made thinner. Moreover, the convex portion 7a,
7e is used to position the head cover 7 by inserting it into the two protrusions 6b and 6c formed on the heat sink 6 and the recess 6a, thereby preventing contact between the head cover 7 and the driver IC 3. As a result, the distance from the position where the ceramic substrate 1 and the head roller 8 come into contact with each other to the driver IC 3 can be reduced, and the head cover 7 can be made smaller.

〔Effect of the invention〕

As described above, the present invention can improve head cover positioning accuracy and reliability with a simple configuration, and can also reduce the overall size and weight. This has the effect of reducing cost.

[Brief explanation of drawings]

FIG. 1 is a plan view of a thermal recording head showing an embodiment of the present invention, and FIG. 2 is a cross-sectional side view taken along the line A--A in FIG. 1...Ceramic substrate, 2...Heating resistor, 3...
・Driver IC14a...FPC15...Connector, 6...Heat sink, 7...Head cover, 8
...Head roller, 9...Nylon buttsuribet. Figure 1d 2vA

Claims (1)

[Claims] 1. A thermal recording head comprising a ceramic substrate on which a heating resistor and a wiring pattern are formed, a heat sink head roller for heat dissipation, and a protective cover, in which a convex portion of the protective cover is engaged with a concave portion of the heat sink. A thermal recording head characterized in that a protective cover is positioned and fixed to a heat sink. 2. An opening hole is formed at both sides of the head roller of the protective cover, and the opening hole has an inclined surface such that the distance between the two increases as the distance increases upward, and the head roller and the ceramic are formed on the inclined surface. 2. The thermal recording head according to claim 1, wherein the thermal recording head is configured to guide paper inserted between the thermal recording head and the substrate.