JPH03100364U - - Google Patents

Info

Publication number
JPH03100364U
JPH03100364U JP804390U JP804390U JPH03100364U JP H03100364 U JPH03100364 U JP H03100364U JP 804390 U JP804390 U JP 804390U JP 804390 U JP804390 U JP 804390U JP H03100364 U JPH03100364 U JP H03100364U
Authority
JP
Japan
Prior art keywords
pad
brazing
head
protrusion
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP804390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP804390U priority Critical patent/JPH03100364U/ja
Publication of JPH03100364U publication Critical patent/JPH03100364U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す断面図、第２
図及び第３図は本考案の他の実施例を示す断面図
である。 １……Ｉ／Ｏピン、２……ろう付用ヘツド、３
……突起、４……ろう材、５……パツド、６……
基板。 Fig. 1 is a sectional view showing one embodiment of the present invention;
3 and 3 are cross-sectional views showing other embodiments of the present invention. 1...I/O pin, 2...Brazing head, 3
... protrusion, 4 ... brazing metal, 5 ... padded, 6 ...
substrate.

Claims (1)

【実用新案登録請求の範囲】 基板上に形成されたパツドと、 前記パツドにろう付けされるろう付け用ヘツド
を備えたＩ／Ｏピンとを有し、 前記ろう付け用ヘツドのろう付面中央部に、パ
ツドに接触して該パツドとろう付け用ヘツドとの
間隔を一定に保持する突起を設け、前記突起がパ
ツドに接触してパツドとろう付け用ヘツド間に形
成される空隙内にろう材を充填したことを特徴と
するＩ／Ｏピン取付構造。[Claims for Utility Model Registration] A pad formed on a substrate, and an I/O pin equipped with a brazing head that is brazed to the pad, and a central part of the brazing surface of the brazing head. The pad is provided with a protrusion that contacts the pad and maintains a constant distance between the pad and the brazing head, and the protrusion contacts the pad and fills the gap formed between the pad and the brazing head with brazing material. I/O pin mounting structure characterized by being filled with.
JP804390U 1990-01-30 1990-01-30 Pending JPH03100364U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP804390U JPH03100364U (en) 1990-01-30 1990-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP804390U JPH03100364U (en) 1990-01-30 1990-01-30

Publications (1)

Publication Number Publication Date
JPH03100364U true JPH03100364U (en) 1991-10-21

Family

ID=31511692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP804390U Pending JPH03100364U (en) 1990-01-30 1990-01-30

Country Status (1)

Country Link
JP (1) JPH03100364U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141298A (en) * 2009-10-26 2010-06-24 Shinko Electric Ind Co Ltd Wiring board having lead pin, and lead pin
JP2010140986A (en) * 2008-12-10 2010-06-24 Shinko Electric Ind Co Ltd Wiring board having lead pin, and lead pin
CN101944523A (en) * 2009-07-03 2011-01-12 新光电气工业株式会社 Board having connection terminal
KR200453148Y1 (en) * 2008-09-22 2011-04-13 이상은 Implement for gathering of crops
KR200472350Y1 (en) * 2013-09-10 2014-04-21 서한호 implement for gathering of crops

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200453148Y1 (en) * 2008-09-22 2011-04-13 이상은 Implement for gathering of crops
JP2010140986A (en) * 2008-12-10 2010-06-24 Shinko Electric Ind Co Ltd Wiring board having lead pin, and lead pin
JP4613237B2 (en) * 2008-12-10 2011-01-12 新光電気工業株式会社 Wiring board with lead pins and lead pins
US8379402B2 (en) 2008-12-10 2013-02-19 Shinko Electric Industries Co., Ltd. Wiring board having lead pin, and lead pin
CN101944523A (en) * 2009-07-03 2011-01-12 新光电气工业株式会社 Board having connection terminal
JP2011014451A (en) * 2009-07-03 2011-01-20 Shinko Electric Ind Co Ltd Board having connection terminal
JP2010141298A (en) * 2009-10-26 2010-06-24 Shinko Electric Ind Co Ltd Wiring board having lead pin, and lead pin
JP4606504B2 (en) * 2009-10-26 2011-01-05 新光電気工業株式会社 Wiring board with lead pins and lead pins
KR200472350Y1 (en) * 2013-09-10 2014-04-21 서한호 implement for gathering of crops

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