JPS61131869U - - Google Patents
Info
- Publication number
- JPS61131869U JPS61131869U JP1476985U JP1476985U JPS61131869U JP S61131869 U JPS61131869 U JP S61131869U JP 1476985 U JP1476985 U JP 1476985U JP 1476985 U JP1476985 U JP 1476985U JP S61131869 U JPS61131869 U JP S61131869U
- Authority
- JP
- Japan
- Prior art keywords
- chip element
- substrate
- integrated circuit
- hybrid integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1476985U JPS61131869U (no) | 1985-02-05 | 1985-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1476985U JPS61131869U (no) | 1985-02-05 | 1985-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131869U true JPS61131869U (no) | 1986-08-18 |
Family
ID=30499997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1476985U Pending JPS61131869U (no) | 1985-02-05 | 1985-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131869U (no) |
-
1985
- 1985-02-05 JP JP1476985U patent/JPS61131869U/ja active Pending
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