JPS61131553A - 浸漬液冷装置 - Google Patents

浸漬液冷装置

Info

Publication number
JPS61131553A
JPS61131553A JP59252962A JP25296284A JPS61131553A JP S61131553 A JPS61131553 A JP S61131553A JP 59252962 A JP59252962 A JP 59252962A JP 25296284 A JP25296284 A JP 25296284A JP S61131553 A JPS61131553 A JP S61131553A
Authority
JP
Japan
Prior art keywords
foam
cooling
refrigerant
heat
pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59252962A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320070B2 (enExample
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59252962A priority Critical patent/JPS61131553A/ja
Publication of JPS61131553A publication Critical patent/JPS61131553A/ja
Publication of JPH0320070B2 publication Critical patent/JPH0320070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59252962A 1984-11-30 1984-11-30 浸漬液冷装置 Granted JPS61131553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59252962A JPS61131553A (ja) 1984-11-30 1984-11-30 浸漬液冷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59252962A JPS61131553A (ja) 1984-11-30 1984-11-30 浸漬液冷装置

Publications (2)

Publication Number Publication Date
JPS61131553A true JPS61131553A (ja) 1986-06-19
JPH0320070B2 JPH0320070B2 (enExample) 1991-03-18

Family

ID=17244577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59252962A Granted JPS61131553A (ja) 1984-11-30 1984-11-30 浸漬液冷装置

Country Status (1)

Country Link
JP (1) JPS61131553A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285448A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
JPH0332437U (enExample) * 1989-08-04 1991-03-29
US5688398A (en) * 1995-08-30 1997-11-18 Gec Alsthom Transport Sa Device for filtering an electrically insulative and thermally conductive liquid medium and a power electronics unit incorporating a device of this kind
WO2006003903A1 (ja) * 2004-06-30 2006-01-12 Hitachi, Ltd. 液晶プロジェクタとその液晶パネルの液冷装置
JP2021047590A (ja) * 2019-09-18 2021-03-25 日本電気株式会社 液浸冷却槽

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285448A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造
JPH0332437U (enExample) * 1989-08-04 1991-03-29
US5688398A (en) * 1995-08-30 1997-11-18 Gec Alsthom Transport Sa Device for filtering an electrically insulative and thermally conductive liquid medium and a power electronics unit incorporating a device of this kind
CN1083140C (zh) * 1995-08-30 2002-04-17 Gec阿尔斯托姆运输公司 液体介质的过滤装置及装有这类装置的电力电子设备
WO2006003903A1 (ja) * 2004-06-30 2006-01-12 Hitachi, Ltd. 液晶プロジェクタとその液晶パネルの液冷装置
JP2021047590A (ja) * 2019-09-18 2021-03-25 日本電気株式会社 液浸冷却槽

Also Published As

Publication number Publication date
JPH0320070B2 (enExample) 1991-03-18

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