JPS61130480A - Mask for vapor deposition - Google Patents

Abstract

PURPOSE:To decrease the out of focus of a vapor deposition pattern in a mask for vapor deposition provided with plural apertures to a metallic flat plate by providing notches from >=1 apertures to the end of the metallic flat plate to said mask. CONSTITUTION:Vapor deposition is executed by using the mask for vapor deposition provided with the plural apertures having a desired size to the metallic flat plate 1 consisting of a stainless steel having a prescribed size and thickness. The notches 3 extending from the apertures 2 of the mask to the end of the plate 1 and along the straight line passing approximately the center of the plate 1 are provided to the mask. The respective parts cut by the notches 3 of a peripheral part 1a move outward with respect to the central part of the plate 1 even if partition parts 1b are heated to the temp. higher than the temp. of the peripheral part 1a and the rate of thermal expansion of the former is larger than the rate of thermal expansion of the latter when the mask is heated. The difference in the rate of thermal expansion between the partition parts 1b and the peripheral part 1a is therefore absorbed by the deformation of the peripheral part 1a by the notches 3, by which the mask is surely and tightly adhered to a substrate for vapor deposition.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vapor deposition mask having a plurality of openings provided in a flat metal plate.

[Conventional technology]

FIG. 3 is a diagram showing a conventional vapor deposition mask (document unknown). In the figure, 1 is a metal flat plate, and 2 is a plurality of openings provided in the metal flat plate 1. In order to hold the vapor deposition mask during vapor deposition, the openings 2 are inside the metal flat plate 1, leaving the peripheral area 1a. It is set in.

When performing vapor deposition using such a vapor deposition mask, the vapor deposition mask is usually brought into close contact with the substrate to be vaporized and heated with infrared rays. In this case, the mask holder is in contact with the peripheral portion 1a.

The partition part 1b that partitions the openings 2 is thin and the amount of heat dissipated by thermal conduction is small, so the temperature of the partition part 1b becomes higher than the temperature of the peripheral part 1a, so the amount of thermal expansion of the partition part 1b is higher than that of the peripheral part 1a The amount of thermal expansion is larger than that of the partition portion 1b, and the rigidity of the partition portion 1b is smaller than the rigidity of the peripheral portion 1a.
There is a drawback that the evaporation pattern is separated from the substrate to be evaporated, resulting in a large blurring at a part of the edge of the evaporation pattern.

[Problem that the invention seeks to solve]

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a vapor deposition mask that can reduce blurring of vapor deposition figures.

[Means for solving problems]

To achieve this objective, in this invention.

By providing a cut extending from at least one of the openings to the end of the flat metal plate, the difference in thermal expansion between the partition and the peripheral portion is absorbed by deformation of the peripheral portion due to the cut.

〔Example〕

Example 1 As shown in Fig. 1, size 90 wm x 125
In a vapor deposition mask in which 12 openings 2 of size 35 x 16 m are provided in a flat metal plate 1 made of stainless steel with a waxy thickness of 0.3 m, from the entrance part 2 to the end of the flat metal plate 1, In addition, a cut 3 is provided along a straight line passing approximately through the center of the metal flat plate 1.

In this vapor deposition mask, when heated, the temperature of the partition part 1b becomes higher than the temperature of the peripheral part 1a, and the amount of thermal expansion of the partition part 1b becomes larger than the amount of thermal expansion of the peripheral part 1a. Since each part cut by the notches 3 in the peripheral part 1a moves outward with respect to the central part of the flat metal plate 1, the difference in thermal expansion between the partition part 1b and the peripheral part 1a is the difference between the parts cut by the notches 3 in the peripheral part 1a. It is absorbed by the deformation of portion 1a. Further, the temperature at the central portion of the metal flat plate 1 is substantially uniform, and there is no difference in the amount of thermal expansion within the partition portion lb. Therefore, the evaporation mask can be reliably brought into close contact with the substrate to be evaporated, so that the blurring of the evaporation pattern becomes extremely small. 'For example, when In2O3 is evaporated to a thickness of 2100 mm on a glass substrate at a substrate temperature of 350°C using an evaporation mask without the notch 3 and otherwise similar to that shown in FIG. Inz03 thickness is 90% of 2100
In contrast, when vapor deposition was performed under the above conditions using the vapor deposition mask shown in Figure 1, the maximum value of blur reached 0.5. .1+
It was mm.

Example 2 As shown in Fig. 2, the size &Oma
, in a vapor deposition mask in which 16 openings 2 of various sizes and shapes are provided in a metal flat plate 1 made of stainless steel with a thickness of 0.1+m, from the openings 2 to the end of the metal flat plate 1, and A cut 3 is made along a straight line passing approximately through the center of the metal flat plate 1.

Also in this vapor deposition mask, the blur of the vapor deposition pattern is extremely small. For example, there is no cut 3.

When vapor deposition was performed under the same conditions as described in Example 1 using a vapor deposition mask otherwise similar to that shown in FIG. 2, the maximum value of blur was 0.6 m. , When vapor deposition was performed using the vapor deposition mask shown in FIG. 2 under the same conditions as described in Example 1, the maximum value of blur was 0.2.
It was mgm.

〔Effect of the invention〕

As explained above, in the vapor deposition mask according to the present invention, blurring of the vapor deposition pattern can be reduced, so that vapor deposition can be performed with high precision. As described above, the effects of this invention are remarkable.

[Brief explanation of drawings]

1 and 2 are views showing a vapor deposition mask according to the present invention, and FIG. 3 is a view showing a conventional vapor deposition mask. 1... Metal flat plate 2... Opening 3... Notch

Claims (2)

[Claims] (1) A vapor deposition mask having a plurality of openings in a flat metal plate, characterized in that a notch is provided extending from at least one of the openings to an end of the flat metal plate. (2) The vapor deposition mask according to claim 1, wherein the cut is provided along a straight line passing approximately through the center of the flat metal plate.