JP2016106180A - Method for manufacturing vapor deposition mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor deposition mask that can satisfy both of high-definition and weight saving even when the size thereof is increased, furthermore that can be accurately positioned to a frame.SOLUTION: The vapor deposition mask is obtained by laminating: a first resin mask provided with a predetermined opening; a metal mask provided with a slit; and a second resin mask where multiple openings corresponding to a pattern manufactured by vapor deposition are arranged lengthwise and breadthwise, in this order.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a vapor deposition mask.

  2. Description of the Related Art Conventionally, in the manufacture of an organic EL element, the organic layer or cathode electrode of the organic EL element is formed by, for example, a metal mask (evaporation mask) in which a large number of minute slits are arranged in parallel at minute intervals in a region to be evaporated. ) Was used. When this metal mask is used, the metal mask is simply placed on the surface of the substrate to be vapor-deposited and held using a magnet from the back side, but the rigidity of the slit is extremely small, so the metal mask is held on the substrate surface. In this case, the slits are apt to be distorted, which has been an obstacle to the increase in the size of products with high definition or a long slit length.

  Various studies have been made on the vapor deposition mask for preventing the distortion of the slit. For example, Patent Document 1 covers a base plate that also serves as a first metal mask having a plurality of openings, and covers the openings. There has been proposed a vapor deposition mask having a second metal mask having a large number of fine slits in the region and a mask tension holding means for positioning the second metal mask on the base plate in a state where the second metal mask is pulled in the longitudinal direction of the slit. According to this vapor deposition mask, it is said that the slit accuracy can be ensured without causing distortion in the slit.

  Recently, with the increase in the size of products using organic EL elements or the increase in the substrate size, there is an increasing demand for increasing the size of a vapor deposition mask. However, with the current metal processing technology, it is difficult to accurately form a fine pattern on a large metal plate. Even if the distortion of the slit portion can be prevented by the method proposed in Patent Document 1 above. , Can not cope with high definition. In addition, when a metal mask having an opening pattern is used alone or as a vapor deposition mask in which a metal mask having an opening pattern and a metal mask having a slit are combined, the mass increases as the size increases, and the frame is included. Since the total mass also increases, handling will be hindered.

  Furthermore, when the vapor deposition mask is normally used in a state of being fixed to the frame, when the vapor deposition mask is enlarged, there is a problem that the frame and the vapor deposition mask cannot be accurately aligned. .

JP 2003-332057 A

  The present invention has been made in view of such circumstances, and provides a vapor deposition mask that can satisfy both high definition and light weight even when the size is increased, and can be accurately aligned with a frame. The main task is to do.

  This invention for solving the said subject is a manufacturing method of the vapor deposition mask used by being attached to a flame | frame, Comprising: The process of preparing the metal plate with the resin plate by which the resin plate is provided in one surface of the metal plate And by applying a resist material to the surface of the metal plate with the resin plate on which the resin plate is not provided, masking the resist material using a mask in which a slit pattern is formed, exposing and developing the metal, Forming a resist pattern on the surface of the plate, using the resist pattern as a first resin mask, and forming a metal mask by etching only the metal plate using the first resin mask as an anti-etching mask And a pattern for depositing the resin plate by irradiating a laser through a slit formed in the first resin mask and the metal mask. Forming an opening corresponding to the surface.

  Moreover, this invention for solving the said subject is a manufacturing method of the vapor deposition mask used by being attached to a flame | frame, Comprising: The metal plate with the resin plate with which the resin plate is provided in one surface of a metal plate is prepared Applying a resist material to the surface of the metal plate with a resin plate that is not provided with a resin plate, masking the resist material with a mask having a slit pattern, exposing and developing Forming a resist pattern on the surface of the metal plate, forming the metal mask by etching only the metal plate using the resist pattern as an anti-etching mask, and washing and removing the resist pattern. A step of providing a resin layer on the surface of the metal mask on which the metal layer has been formed, and laser irradiation from the resin layer side, Forming an opening corresponding to the pattern to produce deposited fine said resin plate, characterized in that it comprises a.

  Moreover, the vapor deposition mask concerning one Embodiment is a vapor deposition mask used by attaching to a flame | frame, Comprising: The 1st resin mask provided with the predetermined opening part, the metal mask provided with the slit, and vapor deposition preparation And a second resin mask in which a plurality of openings corresponding to the pattern to be arranged are arranged in this order, and one slit in the metal mask is a plurality of openings in the second resin mask. It is characterized by overlapping.

  Moreover, in the said vapor deposition mask, the shape of the opening part provided in the said 1st resin mask may be the same shape as the slit provided in the said metal mask.

  The metal mask may be a magnetic material. Moreover, the cross-sectional shape of the opening may be widened toward the vapor deposition source direction. Moreover, the barrier layer may be provided in the end surface which forms the said opening part of the said resin mask. The resin mask may have a thickness of 5 μm to 25 μm.

  The vapor deposition mask with a frame according to an embodiment is a vapor deposition mask with a frame in which a vapor deposition mask is attached to the frame, and the vapor deposition mask includes a first resin mask provided with a predetermined opening, and a slit. And a second resin mask in which a plurality of openings corresponding to the pattern to be deposited are arranged in this order, and one slit in the metal mask is It is characterized by overlapping with a plurality of openings in the second resin mask.

  According to the vapor deposition mask of the present invention, both high definition and light weight can be satisfied even when the size is increased, and the position can be accurately aligned with the frame.

It is a schematic perspective view which decomposes | disassembles and shows the 1st resin mask, metal mask, and 2nd resin mask which comprise the vapor deposition mask which is an example of this invention, (a) is the 1st resin mask, (b) Is a metal mask, and (c) is a second resin mask. (A) is the front view seen from the metal mask side of the vapor deposition mask of this invention shown in FIG. 1, (b) It is a schematic sectional drawing of the vapor deposition mask shown in FIG. It is an expanded sectional view of the vapor deposition mask shown in FIG. It is a schematic perspective view which decomposes | disassembles and shows the 1st resin mask, metal mask, and 2nd resin mask which comprise the vapor deposition mask which is an example of this invention, (a) is the 1st resin mask, (b) Is a metal mask, and (c) is a second resin mask. It is process drawing for demonstrating the 1st manufacturing method of the vapor deposition mask of this invention. It is process drawing for demonstrating the 2nd manufacturing method of the vapor deposition mask of this invention.

  Below, the vapor deposition mask 100 of this invention is demonstrated concretely using drawing.

(First embodiment)
FIG. 1 is an exploded perspective view schematically showing a first resin mask, a metal mask, and a second resin mask that constitute a vapor deposition mask that is an example of the present invention. FIG. 1A is a first resin mask. , (B) is a metal mask, and (c) is a second resin mask. 2A is a front view of the vapor deposition mask of the present invention shown in FIG. 1 as viewed from the metal mask side, and FIG. 2B is a schematic cross-sectional view of the vapor deposition mask shown in FIG. FIG. 3 is an enlarged cross-sectional view of the vapor deposition mask shown in FIG. In FIGS. 1 to 3, the ratio to the whole is greatly described in order to emphasize the slit provided with the metal mask and the opening provided in the vapor deposition mask.

  As shown in FIGS. 1 and 2, a vapor deposition mask 100 of the present invention includes a first resin mask 30 provided with a slit 35 as a predetermined opening, a metal mask 10 provided with a slit 15, and vapor deposition. The second resin mask 20 in which the openings 25 corresponding to the pattern to be arranged are arranged in a plurality of rows vertically and horizontally is stacked in this order. Each will be described in detail below.

(Second resin mask)
The second resin mask 20 is made of resin, and as shown in FIGS. 1 and 2, openings 25 corresponding to the pattern to be deposited are arranged in a plurality of rows vertically and horizontally. In the specification of the present application, the pattern formed by vapor deposition means a pattern to be produced using the vapor deposition mask. For example, when the vapor deposition mask is used for forming an organic layer of an organic EL element, the organic The shape of the layer.

  For the second resin mask 20, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. However, a high-definition opening 25 can be formed by laser processing or the like, and heat or It is preferable to use a lightweight material having a small dimensional change rate and moisture absorption rate over time. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. .

  The thickness of the second resin mask 20 is not particularly limited, but when vapor deposition is performed using the vapor deposition mask 100 of the present invention, a vapor deposition portion that is insufficient for a pattern to be vapor-deposited, that is, a target vapor deposition film thickness. The second resin mask 20 is preferably as thin as possible in order to prevent the occurrence of a deposited portion having a thinner film thickness, that is, a so-called shadow. However, when the thickness of the second resin mask 20 is less than 5 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. On the other hand, if it exceeds 25 μm, shadows may occur. Considering this point, the thickness of the second resin mask 20 is preferably 5 μm or more and 25 μm or less. By setting the thickness of the second resin mask 20 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the occurrence of shadows. In the vapor deposition mask of the present invention, the metal mask 10 and the second resin mask 20 may be directly bonded or may be bonded via an adhesive layer. When the metal mask 10 and the second resin mask 20 are joined together, the total thickness of the second resin mask 20 and the adhesive layer is 5 μm to 25 μm in consideration of the shadow point. It is preferable to set to be within the range.

  There is no particular limitation on the shape and size of the opening 25, and any shape and size corresponding to the pattern to be deposited may be used. Moreover, as shown to Fig.2 (a), the pitch P1 of the horizontal direction of the adjacent opening part 25 and the pitch P2 of the vertical direction can also be set suitably according to the pattern produced by vapor deposition.

  The cross-sectional shape of the opening 25 is not particularly limited, and the end faces facing each other of the resin mask forming the opening 25 may be substantially parallel to each other. However, as shown in FIG. 2B and FIG. 25 is preferably a shape whose cross-sectional shape has an extension toward the vapor deposition source. In other words, it is preferable to have a tapered surface that expands toward the metal mask 10 side. By setting the cross-sectional shape of the opening 25 to the configuration, it is possible to prevent a shadow from being generated in the pattern to be deposited when vapor deposition is performed using the vapor deposition mask of the present invention. The taper angle θ can be appropriately set in consideration of the thickness of the second resin mask 20 and the like. However, the tip of the lower base in the opening of the resin mask is connected to the tip of the upper base in the opening of the resin mask. The angle (θ) is preferably in the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. Further, in FIG. 3, the end face 25 a forming the opening 25 has a linear shape, but is not limited to this, and has an outwardly convex curved shape, that is, the opening 25. The overall shape may be a bowl shape.

  Since the second resin mask 20 is made of a resin material, the opening 25 can be formed regardless of a processing method used in conventional metal processing, for example, a processing method such as etching or cutting. That is, the forming method of the opening 25 is not particularly limited, and the opening is made using various processing methods, for example, a laser processing method capable of forming the high-definition opening 25, precision press processing, photolithography processing, or the like. The portion 25 can be formed. A method for forming the opening 25 by laser processing will be described later.

  In the present invention, since the second resin mask 20 is used as the configuration of the vapor deposition mask 100, when vapor deposition is performed using the vapor deposition mask 100, the opening 25 of the second resin mask 20 is formed in the opening 25. Extremely high heat is applied, and gas may be generated from the end face 25a (see FIG. 3) that forms the opening 25 of the second resin mask 20 to reduce the degree of vacuum in the vapor deposition apparatus. Therefore, in consideration of this point, it is preferable that a barrier layer 26 is provided on the end face 25a forming the opening 25 of the second resin mask 20, as shown in FIG. By forming the barrier layer 26, it is possible to prevent gas from being generated from the end face 25 a that forms the opening 25 of the second resin mask 20.

  As the barrier layer 26, an inorganic oxide, an inorganic nitride, a metal thin film layer, or a vapor deposition layer can be used. As the inorganic oxide, an oxide of aluminum, silicon, indium, tin, or magnesium can be used, and as the metal, aluminum or the like can be used. The thickness of the barrier layer 26 is preferably about 0.05 μm to 1 μm.

  Further, the barrier layer preferably covers the surface of the second resin mask 20 on the vapor deposition source side. The barrier property is further improved by covering the deposition source side surface of the second resin mask 20 with the barrier layer 26. In the case of inorganic oxides and inorganic nitrides, the barrier layer is preferably formed by various PVD methods and CVD methods. In the case of a metal, it is preferably formed by a vacuum deposition method. In addition, the vapor deposition source side surface of the 2nd resin mask 20 here may be the whole surface of the vapor deposition source side of the 2nd resin mask 20, and the vapor deposition source of the 2nd resin mask 20 may be sufficient as it. Only the portion exposed from the metal mask on the side surface may be used.

(Metal mask)
The metal mask 10 is made of metal, and when viewed from the front of the metal mask 10, the slit 15 extending in the vertical direction or the horizontal direction at a position where all the openings 25 arranged in the second resin mask 20 can be seen. Are arranged in multiple rows. 1 to 3, slits 15 extending in the vertical direction of the metal mask 10 are continuously arranged in the horizontal direction.

  The width W of the slit 15 is not particularly limited, but is preferably designed to be at least shorter than the pitch between the adjacent openings 25. Specifically, as shown in FIG. 2A, when the slit 15 extends in the vertical direction, the horizontal width W of the slit 15 is shorter than the pitch P1 of the openings 25 adjacent in the horizontal direction. It is preferable to do. Similarly, although not illustrated, when the slit 15 extends in the horizontal direction, the width in the vertical direction of the slit 15 is preferably shorter than the pitch P2 of the openings 25 adjacent in the vertical direction. On the other hand, the vertical length L when the slit 15 extends in the vertical direction is not particularly limited, and the vertical length of the metal mask 10 and the opening provided in the second resin mask 20 are not limited. What is necessary is just to design suitably according to the position of the part 25. FIG.

  The cross-sectional shape of the slit 15 formed in the metal mask 10 is not particularly limited, but as shown in FIG. 3, the slit 15 spreads toward the vapor deposition source as in the case of the opening 25 in the second resin mask 20. It is preferable to have a shape having

The material of the metal mask 10 is not particularly limited, and any conventionally known material can be appropriately selected and used in the field of the evaporation mask, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

  Further, when vapor deposition is performed on the substrate using the vapor deposition mask 100 of the present invention, a metal mask 10 is used when it is necessary to place a magnet or the like behind the substrate and attract the vapor deposition mask 100 in front of the substrate by magnetic force. Is preferably made of a magnetic material. Examples of the magnetic metal mask 10 include pure iron, carbon steel, W steel, Cr steel, Co steel, KS steel, MK steel, NKS steel, Cunico steel, and Al-Fe alloy. When the material forming the metal mask 10 is not a magnetic material, the metal mask 10 may be magnetized by dispersing the magnetic powder in the material.

  The thickness of the metal mask 10 is not particularly limited, but is preferably about 5 μm to 100 μm. Considering prevention of shadow during vapor deposition, the thickness of the metal mask 10 is preferably thin. However, when the thickness is smaller than 5 μm, the risk of breakage and deformation increases and handling may be difficult. However, in the present invention, since the metal mask 10 is integrated with the second resin mask 20, even when the thickness of the metal mask 10 is as thin as 5 μm, the risk of breakage and deformation is reduced. If it is 5 μm or more, it can be used. When the thickness is greater than 100 μm, shadows may be generated, which is not preferable.

(First resin mask)
The 1st resin mask 30 is comprised from resin, and as shown in FIGS. 1-3, the slit 35 similar to the slit 25 provided in the metal mask 10 mentioned above is formed as a predetermined opening part. Yes.

  Here, when the deposition mask is formed only from the second resin mask and the metal mask, depending on the external environment, deformation such as expansion occurs in the second resin mask, and the entire deposition mask may be warped. According to the vapor deposition mask of the present application, the first resin mask 30 is formed on the opposite side of the metal mask 10 from the surface on which the second resin mask 10 is formed. Warping can be prevented. Therefore, the position accuracy can be remarkably improved even when attached to the frame.

  From such a viewpoint, the predetermined opening 35 provided in the first resin mask is not for regulating the pattern shape to be formed by vapor deposition. Therefore, the opening 35 is provided in the second resin mask. The opening 25 may be provided so as not to be blocked, and the shape thereof is not limited to the slit as shown in FIGS.

  Further, in the resin constituting the first resin mask, the present invention is not particularly limited, but from the above viewpoint, a resin having a thermal expansion coefficient approximate to that of the resin constituting the second resin mask. It is preferable to use it. Although the present invention is not particularly limited with respect to the thickness of the first resin mask, it is preferable that the thickness is equal to the thickness of the second resin mask from the above viewpoint.

(Second Embodiment)
FIG. 4 is an exploded perspective view schematically showing a first resin mask, a metal mask, and a second resin mask that constitute a vapor deposition mask that is an example of the present invention, and FIG. 4A is a first resin mask. , (B) is a metal mask, and (c) is a second resin mask.

As shown in FIG. 4, the first resin mask 30 in the vapor deposition mask 100 according to the second embodiment has an opening similar to the opening 25 provided in the second resin mask 20 as a predetermined opening. A portion 35 is provided. As described above, the opening provided in the first resin mask 30 may be an opening that does not block the opening 25 provided in the second resin mask 20, and therefore, as shown in FIG. 4. It can also be made into various forms.

(Production method)
In the present invention, any conventionally known manufacturing method capable of manufacturing the vapor deposition mask having the above-described configuration can be adopted. For example, it is manufactured by the following first manufacturing method or second manufacturing method. Is preferred.

(First manufacturing method)
FIG. 5 is a process diagram for explaining the first manufacturing method of the vapor deposition mask of the present invention. Note that (a) to (e) are all cross-sectional views. According to this method, the vapor deposition mask according to the first embodiment can be manufactured.

  As shown in FIG. 5A, a metal plate 60 with a resin plate in which a resin plate 67 is provided on one surface of the metal plate 61 is prepared. Here, it does not specifically limit about the preparation method of the metal plate 60 with a resin plate, The commercially available metal plate 60 with a resin plate may be purchased, and a resin plate is provided by providing the resin layer on the surface of a metal plate. The attached metal plate 60 may be used. It is known that since the resin changes with time for a certain period after molding, it is necessary to provide a so-called aging period until the shape settles. Since it is thought that the commercially available metal plate 60 with a resin plate has passed a so-called aging period, it is preferable to use a commercially available metal plate with a resin plate from the viewpoint of yield.

  Next, a metal mask is formed on the metal plate 61 in the metal plate with resin plate 60 by forming a slit that penetrates only the metal plate. This step in the present method is not particularly limited and may be any step as long as a desired slit can be formed only in the metal mask. The resin plate 67 finally becomes the second resin mask.

  FIGS. 5B to 5D show an example of a process for forming the first resin mask and the metal mask. As shown in FIG. 5B, a resist material 62 is applied to the surface of the metal plate 60 with the resin plate where the resin plate 67 is not provided, and the resist material is used using a mask 63 in which a slit pattern is formed. Is masked, exposed and developed. Thus, a resist pattern 64 is formed on the surface of the metal plate 67 as shown in FIG. Then, only the metal plate 60 is etched using the resist pattern 64 as an etching resistant mask. As a result, the resist pattern 64 becomes the first resin mask 64 as it is and the metal plate 67 becomes the metal mask 66 as shown in FIG. As the resist material, it is preferable to use a resist material having good processability and desired resolution. Further, the etching material used in the etching process is not particularly limited, and a known etching material may be appropriately selected.

  Next, laser is irradiated from the metal mask 66 side through the slit 65, and a plurality of openings 69 corresponding to the pattern to be deposited on the resin plate 67 are formed vertically and horizontally to form the resin mask 70. The laser device used here is not particularly limited, and a conventionally known laser device may be used. Thereby, the vapor deposition mask 80 as shown in FIG.5 (e) is obtained.

(Second manufacturing method)
FIG. 6 is a process diagram for explaining a second manufacturing method of the vapor deposition mask of the present invention. Note that (a) to (e) are all cross-sectional views. According to this method, the vapor deposition mask according to the second embodiment can be manufactured.

  As shown in FIG. 6A, a metal plate 60 with a resin plate in which a resin plate 67 is provided on one surface of the metal plate 61 is prepared. Since this is the same as the first manufacturing method, description thereof is omitted here.

  Next, a metal mask is formed on the metal plate 61 in the metal plate with resin plate 60 by forming a slit that penetrates only the metal plate. Specifically, as shown in FIG. 6B, a resist material 62 is applied to the surface of the metal plate 60 with a resin plate where the resin plate 67 is not provided, and a mask 63 having a slit pattern is formed. The resist material is used for masking, exposing and developing. Thus, a resist pattern 64 is formed on the surface of the metal plate 67 as shown in FIG. Then, using the resist pattern 64 as an etching resistant mask, only the metal plate 60 is etched, and the resist pattern is washed and removed after the etching is completed. Thereby, as shown in FIG. 6D, a metal mask 66 in which the slit 65 is formed only in the metal plate 67 can be obtained.

  Next, as shown in FIG. 6E, a resin layer 50 serving as a first resin mask is provided on the surface of the metal mask 66, that is, on the upper surface side in FIG. The resin layer 50 may be provided by various coating methods, or may be affixed with a resin plate.

  Next, a laser beam is irradiated from the resin layer 50 side through the slit 65 to form a plurality of vertical and horizontal openings 51 and 69 corresponding to the patterns to be deposited on the resin layer 50 and the resin plate 67, and the resin mask 70 and To do. The laser device used here is not particularly limited, and a conventionally known laser device may be used. Thereby, the vapor deposition mask 80 as shown in FIG.5 (e) is obtained.

DESCRIPTION OF SYMBOLS 100 ... Deposition mask 10, 66 ... Metal mask 15 ... Slit 20, 70 ... 2nd resin mask 30 ... 1st resin mask 25 ... Opening 61 ... Metal plate 62 ... Resist material 64 ... Resist pattern 67 ... Resin plate 80 ... Vapor deposition mask

Claims (2)

A method of manufacturing a vapor deposition mask used by being attached to a frame,
Preparing a metal plate with a resin plate provided with a resin plate on one surface of the metal plate;
By applying a resist material to the surface of the metal plate with the resin plate where the resin plate is not provided, masking the resist material using a mask in which a slit pattern is formed, exposing and developing, the metal plate Forming a resist pattern on the surface and using the resist pattern as a first resin mask;
Forming a metal mask by etching only the metal plate using the first resin mask as an anti-etching mask;
Irradiating a laser through a slit formed in the first resin mask and the metal mask to form an opening corresponding to a pattern to be deposited on the resin plate;
The manufacturing method of the vapor deposition mask characterized by including. A method of manufacturing a vapor deposition mask used by being attached to a frame,
Preparing a metal plate with a resin plate provided with a resin plate on one surface of the metal plate;
By applying a resist material to the surface of the metal plate with the resin plate where the resin plate is not provided, masking the resist material using a mask in which a slit pattern is formed, exposing and developing, the metal plate Forming a metal mask by forming a resist pattern on the surface and etching only the metal plate using the resist pattern as an etching resistant mask;
Cleaning and removing the resist pattern, and providing a resin layer on the surface of the metal mask on the side where the resist pattern was formed;
Irradiating a laser from the resin layer side to form an opening corresponding to a pattern to be deposited on the resin layer and the resin plate; and
The manufacturing method of the vapor deposition mask characterized by including.

Images