JPS61128214A - 光半導体装置の光ファイバへの接続機構 - Google Patents
光半導体装置の光ファイバへの接続機構Info
- Publication number
- JPS61128214A JPS61128214A JP59250731A JP25073184A JPS61128214A JP S61128214 A JPS61128214 A JP S61128214A JP 59250731 A JP59250731 A JP 59250731A JP 25073184 A JP25073184 A JP 25073184A JP S61128214 A JPS61128214 A JP S61128214A
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor device
- optical
- optical fiber
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 239000013307 optical fiber Substances 0.000 claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 210000003462 vein Anatomy 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59250731A JPS61128214A (ja) | 1984-11-27 | 1984-11-27 | 光半導体装置の光ファイバへの接続機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59250731A JPS61128214A (ja) | 1984-11-27 | 1984-11-27 | 光半導体装置の光ファイバへの接続機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61128214A true JPS61128214A (ja) | 1986-06-16 |
| JPH0528804B2 JPH0528804B2 (en, 2012) | 1993-04-27 |
Family
ID=17212200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59250731A Granted JPS61128214A (ja) | 1984-11-27 | 1984-11-27 | 光半導体装置の光ファイバへの接続機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61128214A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4961616A (en) * | 1989-07-13 | 1990-10-09 | Mitsubishi Denki Kabushiki Kaisha | Optical semiconductor device |
| WO2005078807A1 (ja) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法 |
| JP2006310612A (ja) * | 2005-04-28 | 2006-11-09 | Stanley Electric Co Ltd | Ｌｅｄランプ |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138891A (en) * | 1979-04-18 | 1980-10-30 | Fujitsu Ltd | Light semiconductor device |
| JPS56145014U (en, 2012) * | 1980-03-31 | 1981-11-02 | ||
| JPS5748707A (en) * | 1980-07-07 | 1982-03-20 | Yokogawa Hewlett Packard Ltd | Cable connector |
| JPS57168208A (en) * | 1981-01-07 | 1982-10-16 | Gte Laboratories Inc | Centering device for optical fiber |
| JPS6188106U (en, 2012) * | 1984-11-14 | 1986-06-09 |
-
1984
- 1984-11-27 JP JP59250731A patent/JPS61128214A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138891A (en) * | 1979-04-18 | 1980-10-30 | Fujitsu Ltd | Light semiconductor device |
| JPS56145014U (en, 2012) * | 1980-03-31 | 1981-11-02 | ||
| JPS5748707A (en) * | 1980-07-07 | 1982-03-20 | Yokogawa Hewlett Packard Ltd | Cable connector |
| JPS57168208A (en) * | 1981-01-07 | 1982-10-16 | Gte Laboratories Inc | Centering device for optical fiber |
| JPS6188106U (en, 2012) * | 1984-11-14 | 1986-06-09 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4961616A (en) * | 1989-07-13 | 1990-10-09 | Mitsubishi Denki Kabushiki Kaisha | Optical semiconductor device |
| WO2005078807A1 (ja) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法 |
| JP2006310612A (ja) * | 2005-04-28 | 2006-11-09 | Stanley Electric Co Ltd | Ｌｅｄランプ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528804B2 (en, 2012) | 1993-04-27 |
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