JPS61127661U - - Google Patents
Info
- Publication number
- JPS61127661U JPS61127661U JP1985010598U JP1059885U JPS61127661U JP S61127661 U JPS61127661 U JP S61127661U JP 1985010598 U JP1985010598 U JP 1985010598U JP 1059885 U JP1059885 U JP 1059885U JP S61127661 U JPS61127661 U JP S61127661U
- Authority
- JP
- Japan
- Prior art keywords
- laser diode
- semiconductor laser
- diode chip
- solder
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985010598U JPS61127661U (OSRAM) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985010598U JPS61127661U (OSRAM) | 1985-01-30 | 1985-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127661U true JPS61127661U (OSRAM) | 1986-08-11 |
Family
ID=30491927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985010598U Pending JPS61127661U (OSRAM) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127661U (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136685A (ja) * | 1986-11-28 | 1988-06-08 | Sony Corp | 半導体レ−ザ装置 |
| JP2017069267A (ja) * | 2015-09-28 | 2017-04-06 | 京セラ株式会社 | 光素子搭載用パッケージおよび電子装置 |
| JP6928199B1 (ja) * | 2020-10-01 | 2021-09-01 | 三菱電機株式会社 | 半導体レーザ装置 |
-
1985
- 1985-01-30 JP JP1985010598U patent/JPS61127661U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136685A (ja) * | 1986-11-28 | 1988-06-08 | Sony Corp | 半導体レ−ザ装置 |
| JP2017069267A (ja) * | 2015-09-28 | 2017-04-06 | 京セラ株式会社 | 光素子搭載用パッケージおよび電子装置 |
| JP6928199B1 (ja) * | 2020-10-01 | 2021-09-01 | 三菱電機株式会社 | 半導体レーザ装置 |
| WO2022070388A1 (ja) * | 2020-10-01 | 2022-04-07 | 三菱電機株式会社 | 半導体レーザ装置 |