JPS61125057U - - Google Patents

Info

Publication number
JPS61125057U
JPS61125057U JP1985008130U JP813085U JPS61125057U JP S61125057 U JPS61125057 U JP S61125057U JP 1985008130 U JP1985008130 U JP 1985008130U JP 813085 U JP813085 U JP 813085U JP S61125057 U JPS61125057 U JP S61125057U
Authority
JP
Japan
Prior art keywords
substrate
firmly mounted
hybrid
semiconductor pellets
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985008130U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985008130U priority Critical patent/JPS61125057U/ja
Publication of JPS61125057U publication Critical patent/JPS61125057U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/073
    • H10W72/075
    • H10W72/5473
    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1985008130U 1985-01-24 1985-01-24 Pending JPS61125057U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985008130U JPS61125057U (cg-RX-API-DMAC10.html) 1985-01-24 1985-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985008130U JPS61125057U (cg-RX-API-DMAC10.html) 1985-01-24 1985-01-24

Publications (1)

Publication Number Publication Date
JPS61125057U true JPS61125057U (cg-RX-API-DMAC10.html) 1986-08-06

Family

ID=30487131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985008130U Pending JPS61125057U (cg-RX-API-DMAC10.html) 1985-01-24 1985-01-24

Country Status (1)

Country Link
JP (1) JPS61125057U (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283563A (ja) * 2008-05-20 2009-12-03 Asmo Co Ltd 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法
JP2010096191A (ja) * 2008-10-14 2010-04-30 Hitachi Automotive Systems Ltd 変速制御装置および電子回路封入装置
JP2010114346A (ja) * 2008-11-10 2010-05-20 Asmo Co Ltd 樹脂封止型半導体装置及び樹脂封止半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283563A (ja) * 2008-05-20 2009-12-03 Asmo Co Ltd 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法
JP2010096191A (ja) * 2008-10-14 2010-04-30 Hitachi Automotive Systems Ltd 変速制御装置および電子回路封入装置
JP2010114346A (ja) * 2008-11-10 2010-05-20 Asmo Co Ltd 樹脂封止型半導体装置及び樹脂封止半導体装置の製造方法

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