JPS6112376B2 - - Google Patents

Info

Publication number
JPS6112376B2
JPS6112376B2 JP53006215A JP621578A JPS6112376B2 JP S6112376 B2 JPS6112376 B2 JP S6112376B2 JP 53006215 A JP53006215 A JP 53006215A JP 621578 A JP621578 A JP 621578A JP S6112376 B2 JPS6112376 B2 JP S6112376B2
Authority
JP
Japan
Prior art keywords
bonding
lever
bonding arm
force
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53006215A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54100255A (en
Inventor
Osamu Tachibana
Masahiro Horii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP621578A priority Critical patent/JPS54100255A/ja
Publication of JPS54100255A publication Critical patent/JPS54100255A/ja
Publication of JPS6112376B2 publication Critical patent/JPS6112376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP621578A 1978-01-25 1978-01-25 Wire bonding device Granted JPS54100255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP621578A JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP621578A JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS54100255A JPS54100255A (en) 1979-08-07
JPS6112376B2 true JPS6112376B2 (enExample) 1986-04-08

Family

ID=11632293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP621578A Granted JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS54100255A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199573U (enExample) * 1987-06-15 1988-12-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199573U (enExample) * 1987-06-15 1988-12-22

Also Published As

Publication number Publication date
JPS54100255A (en) 1979-08-07

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