JPS61123203A - Mounting method of dielectric resonator - Google Patents

Abstract

PURPOSE:To attain stability against temperature and to improve reliability by bonding a dielectric resonator unit on a base of a low dielectric constant thicker than a microwave integrated circuit (MIC) substrate adjacent to said substrate. CONSTITUTION:A microstrip line 2 is formed near one end of the MIC substrate 1 made of aluminum, the base 6 made of a low dielectric constant and a low thermal expansion coefficient material such as quartz glass, thicker than the MIC substrate 1 is bonded to a case 7 in a form to be contacted closely with the side face of the side end and a dielectric resonator 3 bonded with a supporting base 5 made of quartz glass is placed on the case 7. Through the constitution above, since the dielectric resonator 3 is held with a prescribed interval with an air gap to the microstrip line 2, both the thermal expansion coefficients are not a direct problem and the electromagnetic coupling between the both is adjusted easily.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to microwave integrated circuits (hereinafter referred to as M
It relates to a mounting method of a dielectric resonator coupled to a strip line of an hIC circuit (referred to as an IG circuit), and in particular, a dielectric resonator unit is bonded to a base plate that is provided adjacent to an hIC board and is thicker than the board. The present invention relates to a method for mounting a body resonator.

[Conventional technology]

FIG. 2 is a perspective view for explaining a conventional mounting method of a dielectric resonator used in a microwave band.

Conventionally, the dielectric resonator 4 used in the microwave band has a relatively large diameter, so the support base 3 that supports the dielectric resonator 4 is formed of a material with a low dielectric constant, such as quartz glass, and the dielectric resonator 4 has a relatively large diameter. Since the diameter can be made smaller than the diameter of the resonator 4, the microstrip line 2 made of a conductive material is formed.
Even when bonded adjacent to the MIC substrate 1 made of a dielectric material such as alumina, the microstrip line 2 of the MfC circuit and the dielectric resonator 4 were sufficiently coupled.

FIG. 3 is a perspective view for explaining a conventional mounting method of a dielectric resonator used in millimeter wave and quasi-millimeter wave bands, and parts equivalent to those in FIG. 2 are given the same reference numerals.

Unlike the microwave band, the dimensions of the dielectric resonator 4 (1 to 3 mm) are very small in the millimeter wave and quasi-millimeter wave bands, so the support base cannot be formed as in the microwave band, i.e. , the support base cannot be made smaller than the dielectric resonator 4, so the support base 5 is made into a plate shape, and with the dielectric resonator 4 attached to the support base 5, the support base 5 is directly placed on the microstrip line 2. The mounting method used was to place the parts on the board, move them in the direction of the arrow to adjust the connection, and then fix them with adhesive.

[Problem that the invention seeks to solve]

The mounting method for the dielectric resonator with the above configuration has the problem that the mounting method for the microwave band is difficult to apply to the millimeter wave and sub-millimeter wave bands. In the mounting method, the dielectric material (alumina) that forms the MIC substrate 1 and the low dielectric constant material (quartz glass) of the support base 5 that supports the dielectric resonator 4 have different physical coefficients (expansion coefficients, etc.). If they are different, there is a problem in that frequency stability deteriorates due to subtle changes in the overlapping gap, resulting in lower reliability.

[Means for solving problems]

The present invention provides a method for mounting a dielectric resonator that solves the above-mentioned problems and enables easy coupling even in millimeter wave and quasi-millimeter wave bands. In a microwave integrated circuit using a resonator unit in which the dielectric resonator is bonded to a support made of a low dielectric constant material, a thickness of the resonator unit provided adjacent to the microwave integrated circuit board is This is achieved by adhering to a base plate that is thicker than the integrated circuit board and has a low dielectric constant.

[Effect]

In the method for mounting the dielectric resonator described above, a base plate on which the support base of the dielectric resonator attached to the support base is placed is placed adjacent to the microwave integrated circuit board, and the base plate is thicker than the microwave integrated circuit board. do. This is an effective mounting method for small-sized dielectric resonators, in which the dielectric resonators are mounted and coupled to this base plate.

〔Example〕

Embodiments of the dielectric resonator mounting method according to the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a side view for explaining an embodiment of the dielectric resonator mounting method according to the present invention, and parts equivalent to those in FIGS. 2 and 3 are given the same reference numerals.

A microstrip line 2 made of a conductive material such as gold is formed near the side edge of a MICIC substrate made of a dielectric material such as alumina, and is closely attached to the side on which the microstrip line 2 of the M[C base is arranged. A base plate 6 made of a material with a low dielectric constant and low expansion coefficient, such as quartz glass, which is thicker than the thickness of the MIC substrate 1 is attached to the housing 7 in order to
By placing the dielectric resonator 3 adhered to the support base 5 made of quartz glass on the base plate 7, the dielectric resonator 3 is placed at a predetermined distance from the microstrip line 2 (base plate 6). The coefficient of expansion is not directly related to the thickness of the substrate (1C, the thickness of the substrate l, and the thickness of the support base 5).
The dielectric resonator 3 is moved on the base plate 6 to adjust the coupling, and then the base plate 6 and the support base 5 are bonded together.

〔Effect of the invention〕

As is clear from the above description, according to the dielectric resonator mounting method according to the present invention, the dielectric resonator is arranged on the micro strip/pline, so that sufficient coupling can be obtained and the dielectric resonator can be mounted on the dielectric resonator. Since the body resonator is supported by quartz glass with a low coefficient of expansion, resonance characteristics with little temperature fluctuation can be obtained, which greatly contributes to improved reliability.

[Brief explanation of drawings]

FIG. 1 is a side view for explaining an embodiment of a dielectric resonator mounting method according to the present invention, and FIG. 2 is a side view for explaining a conventional mounting method for a dielectric resonator used in a microwave band. FIG. 3 is a perspective view for explaining a conventional mounting method of a dielectric resonator used in millimeter wave and sub-millimeter wave bands. In the figure, ■ indicates a MIC board, 2 a microstrip line, 3 and 5 a support stand, 4 a dielectric resonator, 6 a base plate, and 7 a housing.

Claims (1)

[Claims] In a microwave integrated circuit using a dielectric resonator, a resonator unit in which the dielectric resonator is bonded to a support made of a low dielectric constant material is provided adjacent to the microwave integrated circuit board. A method for mounting a dielectric resonator, characterized in that the dielectric resonator is bonded to a base plate that is thicker than the microwave integrated circuit board and has a low dielectric constant.