JP3420480B2 - Non-radiative dielectric line - Google Patents
Non-radiative dielectric lineInfo
- Publication number
- JP3420480B2 JP3420480B2 JP26005997A JP26005997A JP3420480B2 JP 3420480 B2 JP3420480 B2 JP 3420480B2 JP 26005997 A JP26005997 A JP 26005997A JP 26005997 A JP26005997 A JP 26005997A JP 3420480 B2 JP3420480 B2 JP 3420480B2
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- Prior art keywords
- dielectric line
- parallel plate
- insulating film
- conductor
- radiative
- Prior art date
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Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は非放射性誘電体線路
に関し、例えばミリ波集積回路等に組み込まれて、高周
波信号のガイドとして用いられる非放射性誘電体線路に
関する。
【０００２】
【従来の技術】従来の非放射性（Non Radiative Dielec
tricで、以下、ＮＲＤという）誘電体線路は、図４に示
すように、誘電体線路１の上下に平行平板導体２、３を
配置して構成され、このようなＮＲＤ誘電体線路は、平
行平板導体２、３の間隔がλ／２以下のとき、波長がλ
より大きい高周波信号は遮断されて平行平板導体２、３
間の空間には侵入できない。そして、平行平板導体２、
３の間に誘電体線路１を挿入すると、その誘電体線路１
に沿って高周波信号が伝搬でき、その高周波信号からの
放射波は平行平板導体２、３の遮断効果によって抑制さ
れる。前記波長λは近似的に真空中を伝搬する高周波信
号（電磁波）の波長に等しい。尚、図４において、誘電
体線路１の理解を容易にするために、上側の平行平板導
体３の一部を切り欠いて記載した。
【０００３】従来用いられてきた非放射性誘電体線路で
は、強度を保つため、平行平板導体の厚みを通常０．５
ｍｍ以上にし、また、誘電体線路の厚みを、通常２ｍｍ
程度とし、その合計厚みは約３ｍｍ以上であった。
【０００４】そして、非放射性誘電体線路には、付属電
子回路、例えばバイアス供給、フィルター、コンピュー
ターとのインターフェースなど、一般に非放射性誘電体
線路を伝搬する電磁波よりも低い周波数の電子回路を設
ける必要があった。
【０００５】図５に、非放射性誘電体線路の上部に電子
回路等が取り付けられた絶縁基板を配置したモジュール
の一例を示すもので、図において平行平板導体２、３の
間には誘電体線路１が介装されて非放射性誘電体線路が
形成されており、この非放射性誘電体線路の上部には、
絶縁基板４が配置されている。
【０００６】誘電体線路１の手前側先端には、高周波信
号の入力用の発振装置５が配置され、誘電体線路１の中
途にはダイオード等の半導体素子が収容された高周波信
号の変調装置６が設けられている。
【０００７】一方、絶縁基板４の上面には、変調信号の
発振器や集積回路等の付属電子部品７が配置され、これ
らは導体パターン８により相互に接続されている。
【０００８】そして、非放射性誘電体線路の発振装置
５、変調装置６と、絶縁基板４表面の導体パターン８と
は、平行平板導体３とは導通しないようにして挿通し、
かつ絶縁基板４を挿通した導体９により接続されてい
る。
【０００９】つまり、従来は、付属電子部品７は、平行
平板導体２、３の外部に装着され、平行平板導体２、３
内部の発振装置５等と、平行平板導体３に開けられた穴
を介して接続されていた。これはバイアス供給線などが
どうしても誘電体線路を横切る形になり、平行平板導体
内部に全電子回路を搭載できないためである。
【００１０】
【発明が解決しようとする課題】このような従来の非放
射性誘電体線路では、非放射性誘電体線路をモジュール
として考えたとき、絶縁基板４の厚みを考慮すると、そ
の総厚みは５ｍｍ以上となり、例えば、非放射性誘電体
線路をコンピューターに内蔵するためカード型にする際
に、この厚みがネックとなっていた。
【００１１】このような問題を解決したものとして、平
行平板導体内部に付属電子部品を搭載した非放射性誘電
体線路が開示されている（例えば、電子情報通信学会１
９９６年ソサエティ大会予稿集Ｃ−２８、Ｃ−４０）。
【００１２】この非放射性誘電体線路は、平行平板導体
の間に、この平行平板導体と平行な絶縁基板を配置し、
これを一対の誘電体線路により挟持し固定してなるもの
であり、付属電子部品は絶縁基板に搭載されていた。
【００１３】しかしながら、このような非放射性誘電体
線路では、一対の平行平板導体の間隔が２ｍｍ程度であ
り、その間に絶縁基体を平行平板導体と平行に固定する
必要があり、さらに、このような絶縁基体を誘電体線路
に固定する必要があり、製造が困難で、量産には不適で
あった。
【００１４】本発明は、非放射性誘電体線路の付属電子
部品を平行平板導体内部に収容し、非放射性誘電体線路
の厚みを薄くできるとともに、容易に製造することがで
きる非放射性誘電体線路を提供することを目的とする。
【００１５】
【課題を解決するための手段】本発明の非放射性誘電体
線路は、波長λの高周波信号を伝搬する誘電体線路と、
この誘電体線路を挟持する一対の平行平板導体とから構
成され、前記一対の平行平板導体の間隔が、前記高周波
信号の波長λの１／２以下である非放射性誘電体線路に
おいて、前記平行平板導体の誘電体線路側の面に比誘電
率５以下、厚さ０．３ｍｍ以下の絶縁性フィルムを設け
てなるとともに、該絶縁性フィルム上に導体パターンを
形成し、該導体パターンに前記絶縁性フィルム上に設け
られた電子部品を接続してなるものである。
【００１６】
【作用】通常、誘電体線路と平行平板導体の間に空隙を
設けたり、絶縁性フィルムを挟んだりすると、誘電体線
路を伝搬する電磁波に摂動が起こり、反射や放射の原因
となることが知られている。
【００１７】本発明者等は、この絶縁性フィルムをごく
薄くすることにより、誘電体線路を伝搬する電磁波に影
響を与えることなく、平行平板導体と誘電体線路との間
に絶縁性フィルムを挟み込むことができ、さらにその絶
縁性フィルム上に誘電体線路を横切る形で導体パターン
を作製できることを見出し、本発明に至った。
【００１８】本発明によれば、平行平板導体表面の絶縁
性フィルム上に、比較的自由に導体パターンを作製し、
それに付属電子部品を装着して付属電子回路とすること
ができる。このため付属電子部品を平行平板内部に収容
することができ、従来のように、非放射性誘電体線路の
上部に付属電子部品を搭載した絶縁基板を配置する必要
がなく、付属電子部品を備えた非放射性誘電体線路の厚
みが、例えば従来５ｍｍ以上であったものを３ｍｍ程度
に薄くすることができる。
【００１９】さらに、従来のように、絶縁基板を、平行
平板導体の間に、平行に固定する必要がなく、単に平行
平板導体の誘電体線路側の面に絶縁性フィルムを設け、
この絶縁性フィルム上に導電パターンを形成し、付属電
子部品を搭載できるため、製造が容易となり、量産に最
適となる。
【００２０】また、絶縁性フィルムにおいて、誘電体線
路などの部品の装着位置にあらかじめ公知の手段、例え
ば印刷により印をつけておくことにより、これらの部品
を所望の位置に確実に取り付けることができる。
【００２１】さらに、本発明の非放射性誘電体線路で
は、付属電子部品が外表面に露出しておらず、付属電子
部品が強度のある平行平板導体の間に配置されているた
め、破損等がなく、信頼性の面でも有利である。
【００２２】
【発明の実施の形態】本発明の非放射性誘電体線路の基
本構成を図１に示す。尚、図１において、誘電体線路、
絶縁性フィルムの理解を容易にするために、上側の平行
平板導体の記載は省略した。
【００２３】図１において、符号１１は誘電体線路であ
り、符号１２は下側の平行平板導体を示している。この
平行平板導体１２の上面、即ち、誘電体線路１１側の面
には、絶縁性フィルム１３が設けられ、この絶縁性フィ
ルム１３の上面には導体パターン１４が印刷されてい
る。導体パターン１４には電子部品が接続される。
【００２４】図２は、このような非放射性誘電体線路の
具体例を示すもので、図において平行平板導体１２の間
には誘電体線路１１が介装されて非放射性誘電体線路が
形成されている。尚、図２においても、上側の平行平板
導体の記載は省略した。
【００２５】下側の平行平板導体１２の上面には絶縁性
フィルム１３が設けられ、この絶縁性フィルム１３の上
面に誘電体線路１１が配置されている。誘電体線路１１
の手前側先端には、高周波信号の発振装置１７が配置さ
れ、誘電体線路１１の中途にはダイオード等の半導体素
子が収容された高周波信号の変調装置１９が設けられて
いる。
【００２６】一方、絶縁性フィルム１３の上面には、導
体パターン１４が形成され、この導体パターン１４には
変調信号の発振器や集積回路等の付属電子部品２１が接
続されている。
【００２７】絶縁性フィルム１３は、非放射性誘電体線
路の伝搬特性を大きく劣化させないものなら何でも良い
が、おおむね比誘電率５以下、厚さ０．３ｍｍ以下が望
ましい。これは、比誘電率５よりも大きい場合や、厚み
が０．３ｍｍよりも大きい場合には、上記したように、
誘電体線路１１を伝搬する電磁波に摂動が起こり、反射
や放射の原因となるからである。絶縁性フィルム１３と
しては、例えば、アセテートフィルム、テフロンフィル
ム、ポリエチレンシート、ＰＥＴフィルムラミネート紙
等の樹脂フィルムがある。ガラスペースト、ガラス−セ
ラミックスペースト、セラミックペーストを塗布し、熱
処理して絶縁性フィルムを形成しても良い。
【００２８】絶縁性フィルム１３を平行平板導体１２に
設ける場合には、絶縁性フィルム１３を、接着剤、粘着
テープなどで平行平板導体１２に張り付けられるが、絶
縁性フィルム１３に電子部品２１、誘電体線路１１など
を取り付けた後、これを平行平板導体１２に張り付けて
も良いし、また、絶縁性フィルム１３を平行平板導体１
２に張り付けた後電子部品２１、誘電体線路１１を絶縁
性フィルム１３に取り付けても良い。
【００２９】導体パターン１４の厚さ、材質、絶縁性フ
ィルム１３上への形成方法は任意であるが、誘電体線路
１１の直下を通る部分の厚みを０．１ｍｍ以下とするこ
とが望ましい。
【００３０】さらに、その絶縁性フィルム１３上の所定
の位置には誘電体線路１１、高周波電子部品２１などの
部品が取り付けられるが、このとき、部品の取り付け位
置を正確に合わせるために、印刷などで絶縁性フィルム
１３に取り付け位置を示しておくことが望ましい。
【００３１】また、電子部品２１の導体パターン１４上
への接続方法は、導電性ペースト、導電性接着剤、はん
だなど、どのような方法でも良い。また、誘電体線路１
１を取り付けるには通常接着剤が使用されるが、これ
も、強度を保ち、特性を劣化させることの無いものであ
れば、どんなものでもかまわない。
【００３２】尚、絶縁性フィルム１３は、平行平板導体
１２の全面を被覆するようなものであっても、また、一
部を被覆するようなものであっても良いことは勿論であ
る。
【００３３】例えば、電子部品、導体パターンを設ける
部分のみに絶縁性フィルムを設けても良い。
【００３４】
【実施例】先ず、Ｃｕから成り、１００×１００×８ｍ
ｍの２枚の平行平板導体を用意し、下側の平行平板導体
の上面に、縦５０ｍｍ、横２０ｍｍ、厚さ０．０８ｍｍ
のアセテートフィルムに３つの導体パターン（幅２ｍ
ｍ、長さ１８ｍｍ）を蒸着したものを、図１に示すよう
に接着材で接着した。
【００３５】この後、コージェライトから成り、高さ
２．２５ｍｍ×巾１ｍｍ×長さ１００ｍｍの誘電体線路
を、前記絶縁性フィルムを横切るように、下側の平行平
板導体上に配置した後、上側の平行平板導体を誘電体線
路上面に接着し、図１に示すような本発明の非放射性誘
電体線路を作製した。尚、図１では、平行平板導体の全
面に絶縁性フィルムを設けた例であるが、この実施例で
は一部に設けることになる。
【００３６】一方、本発明者等は、絶縁性フィルムの貼
付しないで、上記と同様にして非放射性誘電体線路を作
製し、ミリ波（数１０〜数１００ＧＨｚ帯）透過特性に
ついて、上記本発明のものと比較したグラフを図３に示
す。このグラフより、本発明と従来の非放射性誘電体線
路では、高周波信号の透過特性が殆ど変化ないことが判
る。つまり、誘電体線路と平行平板導体の間に絶縁性フ
ィルムを設けても高周波信号の透過特性が殆ど変わら
ず、この絶縁性フィルムに電子部品を搭載できることが
判る。
【００３７】
【発明の効果】本発明の非放射性誘電体線路は、付属電
子部品を平行平板導体内部に収容することができ、これ
により非放射性誘電体線路の厚みを画期的に薄くできる
とともに、製造が容易であるため量産に適しており、さ
らに、外部からの振動、衝撃等に対する信頼性が向上
し、さらにまた、絶縁性フィルムに印をつけることによ
り、誘電体線路等を正確な位置に容易に取り付けること
ができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-radiative dielectric line, and more particularly, to a non-radiative dielectric line incorporated in a millimeter wave integrated circuit or the like and used as a guide for high-frequency signals. About. 2. Description of the Related Art Conventional non-radiative (Non Radiative Dielec)
As shown in FIG. 4, the dielectric line is formed by arranging parallel plate conductors 2 and 3 above and below the dielectric line 1. When the interval between the plate conductors 2 and 3 is λ / 2 or less, the wavelength is λ.
Larger high-frequency signals are cut off and parallel plate conductors 2, 3
You cannot enter the space between them. And the parallel plate conductor 2,
3, the dielectric line 1 is inserted between the dielectric lines 1.
A high-frequency signal can be propagated along, and a radiation wave from the high-frequency signal is suppressed by the blocking effect of the parallel plate conductors 2 and 3. The wavelength λ is approximately equal to the wavelength of a high-frequency signal (electromagnetic wave) propagating in a vacuum. In FIG. 4, a part of the upper parallel plate conductor 3 is cut away to facilitate understanding of the dielectric line 1. In a nonradiative dielectric line conventionally used, the thickness of a parallel plate conductor is usually set at 0.5 to maintain strength.
mm or more, and the thickness of the dielectric line is usually 2 mm.
And the total thickness was about 3 mm or more. [0004] In addition, it is necessary to provide an electronic circuit having a frequency lower than that of an electromagnetic wave propagating through the non-radiative dielectric line, such as an auxiliary electronic circuit, such as a bias supply, a filter, and an interface with a computer. there were. FIG. 5 shows an example of a module in which an insulating substrate on which an electronic circuit or the like is mounted is disposed above a non-radiative dielectric line. In the figure, a dielectric line is provided between parallel plate conductors 2 and 3. 1 is interposed to form a non-radiative dielectric line, and on the non-radiative dielectric line,
An insulating substrate 4 is provided. An oscillator 5 for inputting a high-frequency signal is arranged at the front end of the dielectric line 1, and a modulator 6 for a high-frequency signal containing a semiconductor element such as a diode is provided in the middle of the dielectric line 1. Is provided. On the other hand, on the upper surface of the insulating substrate 4, attached electronic components 7 such as a modulation signal oscillator and an integrated circuit are arranged, and are connected to each other by a conductor pattern 8. The oscillation device 5 and the modulation device 6 of the non-radiative dielectric line and the conductor pattern 8 on the surface of the insulating substrate 4 are inserted through the parallel plate conductor 3 so as not to conduct.
In addition, they are connected by a conductor 9 inserted through the insulating substrate 4. That is, conventionally, the attached electronic component 7 is mounted outside the parallel plate conductors 2 and 3, and
It was connected to the internal oscillating device 5 and the like via a hole formed in the parallel plate conductor 3. This is because a bias supply line or the like inevitably crosses the dielectric line, and all electronic circuits cannot be mounted inside the parallel plate conductor. [0010] In such a conventional non-radiative dielectric line, when the non-radiative dielectric line is considered as a module, the total thickness thereof is 5 mm in consideration of the thickness of the insulating substrate 4. As described above, for example, when a nonradiative dielectric line is incorporated in a computer to be a card type, this thickness has been a bottleneck. As a solution to this problem, there has been disclosed a non-radiative dielectric waveguide in which an attached electronic component is mounted inside a parallel plate conductor (for example, IEICE 1).
996 Society Conference Proceedings C-28, C-40). In the nonradiative dielectric waveguide, an insulating substrate parallel to the parallel plate conductor is arranged between the parallel plate conductors.
This is sandwiched and fixed by a pair of dielectric waveguides, and the attached electronic components are mounted on an insulating substrate. However, in such a nonradiative dielectric line, the distance between the pair of parallel plate conductors is about 2 mm, and it is necessary to fix the insulating base in parallel with the parallel plate conductors between them. It is necessary to fix the insulating base to the dielectric line, which is difficult to manufacture and unsuitable for mass production. According to the present invention, there is provided a non-radiative dielectric line in which an electronic component attached to the non-radiative dielectric line is accommodated in a parallel plate conductor, the thickness of the non-radiative dielectric line can be reduced, and the non-radiative dielectric line can be easily manufactured. The purpose is to provide. [0015] A non-radiative dielectric line according to the present invention comprises: a dielectric line for transmitting a high-frequency signal having a wavelength λ;
A non-radiative dielectric line, comprising a pair of parallel plate conductors sandwiching the dielectric line, wherein a distance between the pair of parallel plate conductors is equal to or less than の of a wavelength λ of the high-frequency signal. Relative dielectric on the surface of the conductor on the dielectric line side
A ratio of 5 or less, an insulating film having a thickness of 0.3 mm or less is provided , and a conductor pattern is formed on the insulating film.
Formed and provided on the insulating film on the conductive pattern.
The electronic components are connected to each other. Normally, when a gap is provided between a dielectric line and a parallel plate conductor or an insulating film is interposed, a perturbation occurs in an electromagnetic wave propagating through the dielectric line, causing reflection and radiation. It is known. By making the insulating film very thin, the present inventors sandwich the insulating film between the parallel plate conductor and the dielectric line without affecting the electromagnetic wave propagating through the dielectric line. The present inventors have found that a conductive pattern can be formed on the insulating film so as to cross the dielectric line, and have reached the present invention. According to the present invention, a conductor pattern is relatively freely formed on an insulating film on the surface of a parallel plate conductor,
Attachment electronic parts can be attached to it to form an attachment electronic circuit. For this reason, the attached electronic components can be accommodated inside the parallel plate, and there is no need to arrange an insulating substrate on which the attached electronic components are mounted above the non-radiative dielectric line as in the conventional case, and the attached electronic components are provided. The thickness of the non-radiative dielectric line can be reduced to about 3 mm, for example, which is conventionally 5 mm or more. Further, unlike the related art, it is not necessary to fix the insulating substrate in parallel between the parallel plate conductors, and an insulating film is simply provided on the surface of the parallel plate conductor on the dielectric line side,
Since a conductive pattern can be formed on the insulating film and an attached electronic component can be mounted thereon, the manufacturing becomes easy and it is optimal for mass production. Further, by marking the mounting positions of components such as the dielectric line on the insulating film in advance by a known means, for example, printing, these components can be securely mounted at desired positions. . Furthermore, in the non-radiative dielectric waveguide of the present invention, the attached electronic components are not exposed on the outer surface, and the attached electronic components are arranged between the strong parallel plate conductors, so that damage or the like is caused. It is also advantageous in terms of reliability. FIG. 1 shows a basic configuration of a nonradiative dielectric line according to the present invention. In FIG. 1, a dielectric line,
To facilitate understanding of the insulating film, the description of the upper parallel plate conductor is omitted. In FIG. 1, reference numeral 11 denotes a dielectric line, and reference numeral 12 denotes a lower parallel plate conductor. An insulating film 13 is provided on the upper surface of the parallel plate conductor 12, that is, the surface on the side of the dielectric line 11, and a conductive pattern 14 is printed on the upper surface of the insulating film 13. Electronic components are connected to the conductor pattern 14. FIG. 2 shows a specific example of such a nonradiative dielectric line. In the figure, a dielectric line 11 is interposed between parallel plate conductors 12 to form a nonradiative dielectric line. ing. Note that, also in FIG. 2, the description of the upper parallel plate conductor is omitted. An insulating film 13 is provided on the upper surface of the lower parallel plate conductor 12, and the dielectric line 11 is disposed on the upper surface of the insulating film 13. Dielectric line 11
A high-frequency signal oscillating device 17 is disposed at the front end of the device, and a high-frequency signal modulating device 19 containing a semiconductor element such as a diode is provided in the middle of the dielectric line 11. On the other hand, a conductor pattern 14 is formed on the upper surface of the insulating film 13, and an attached electronic component 21 such as a modulation signal oscillator and an integrated circuit is connected to the conductor pattern 14. The insulating film 13 may be any material as long as it does not significantly deteriorate the propagation characteristics of the non-radiative dielectric line, but it is preferable that the relative dielectric constant is 5 or less and the thickness is 0.3 mm or less. This is, as described above, when the relative dielectric constant is greater than 5, or when the thickness is greater than 0.3 mm,
This is because the electromagnetic wave propagating through the dielectric line 11 is perturbed and causes reflection and radiation. Examples of the insulating film 13 include a resin film such as an acetate film, a Teflon film, a polyethylene sheet, and a PET film laminated paper. A glass paste, a glass-ceramic paste, or a ceramic paste may be applied and heat-treated to form an insulating film. When the insulating film 13 is provided on the parallel plate conductor 12, the insulating film 13 is attached to the parallel plate conductor 12 with an adhesive, an adhesive tape or the like. After attaching the body line 11 or the like, this may be attached to the parallel plate conductor 12 or the insulating film 13 may be attached to the parallel plate conductor 1.
2, the electronic component 21 and the dielectric line 11 may be attached to the insulating film 13. Although the thickness and material of the conductor pattern 14 and the method of forming the conductor pattern 14 on the insulating film 13 are arbitrary, it is desirable that the thickness of the portion immediately below the dielectric line 11 be 0.1 mm or less. Further, components such as the dielectric line 11 and the high-frequency electronic component 21 are attached to predetermined positions on the insulating film 13, and at this time, printing or the like is performed in order to accurately adjust the attachment positions of the components. It is desirable to indicate the mounting position on the insulating film 13 by using. The electronic component 21 may be connected to the conductor pattern 14 by any method such as a conductive paste, a conductive adhesive, and a solder. Also, dielectric line 1
Adhesive is usually used to attach 1, but any adhesive can be used as long as it maintains strength and does not degrade the characteristics. The insulating film 13 may cover the entire surface of the parallel plate conductor 12, or may cover a part of the parallel plate conductor 12. For example, an insulating film may be provided only on a portion where electronic components and conductor patterns are provided. EXAMPLE First, 100 × 100 × 8 m made of Cu
m, two parallel plate conductors having a length of 50 mm, a width of 20 mm, and a thickness of 0.08 mm are provided on the upper surface of the lower parallel plate conductor.
Acetate film with three conductor patterns (2m width)
m, 18 mm in length) were adhered with an adhesive as shown in FIG. Thereafter, a dielectric line made of cordierite and having a height of 2.25 mm × a width of 1 mm × a length of 100 mm is arranged on the lower parallel plate conductor so as to cross the insulating film. The upper parallel plate conductor was bonded to the upper surface of the dielectric line to produce a non-radiative dielectric line of the present invention as shown in FIG. Although FIG. 1 shows an example in which an insulating film is provided on the entire surface of the parallel plate conductor, in this embodiment, it is provided in a part. On the other hand, the present inventors prepared a non-radiative dielectric line in the same manner as described above without attaching an insulating film, and examined the transmission characteristics of millimeter waves (several tens to several hundreds GHz bands) of the present invention. FIG. 3 shows a graph in comparison with that of FIG. From this graph, it can be seen that the transmission characteristics of the high-frequency signal hardly change in the present invention and the conventional nonradiative dielectric line. That is, even if an insulating film is provided between the dielectric line and the parallel plate conductor, the transmission characteristics of high-frequency signals hardly change, and it can be seen that electronic components can be mounted on this insulating film. According to the non-radiative dielectric line of the present invention, the attached electronic components can be accommodated inside the parallel plate conductor, whereby the thickness of the non-radiative dielectric line can be remarkably reduced. It is suitable for mass production due to its easy manufacturing, furthermore, the reliability against external vibrations and shocks is improved, and by marking the insulating film, the dielectric line etc. can be positioned accurately. Can be easily attached to
【図面の簡単な説明】
【図１】 本発明の非放射性誘電体線路の基本構成の斜
視図である。
【図２】 本発明の具体的な非放射性誘電体線路の構成
を示す斜視図である。
【図３】 本実施例と比較例の非放射性誘電体線路の透
過損失を示す図である。
【図４】 従来の非放射性誘電体線路を示す斜視図であ
る。
【図５】 従来の非放射性誘電体線路モジュールの分解
斜視図である。
【符号の説明】
１１・・・誘電体線路
１２・・・平行平板導体
１３・・・絶縁性フィルム
１４・・・導体パターン
２１・・・電子部品BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a basic configuration of a nonradiative dielectric waveguide of the present invention. FIG. 2 is a perspective view showing a specific configuration of a non-radiative dielectric line of the present invention. FIG. 3 is a diagram illustrating transmission losses of non-radiative dielectric waveguides of the present example and a comparative example. FIG. 4 is a perspective view showing a conventional non-radiative dielectric line. FIG. 5 is an exploded perspective view of a conventional non-radiative dielectric line module. [Description of Reference Numerals] 11: dielectric line 12: parallel plate conductor 13: insulating film 14: conductor pattern 21: electronic component
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平９−64608（ＪＰ，Ａ) 特開 平９−186525（ＪＰ，Ａ) 特開 平９−23109（ＪＰ，Ａ) 特開 平11−55011（ＪＰ，Ａ) 特開 平11−46103（ＪＰ，Ａ) 特開 昭58−215804（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01P 3/16 H01P 5/08 H05K 9/00 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-64608 (JP, A) JP-A-9-186525 (JP, A) JP-A-9-23109 (JP, A) JP-A-11- 55011 (JP, A) JP-A-11-46103 (JP, A) JP-A-58-215804 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01P 3/16 H01P 5 / 08 H05K 9/00
Claims (1)
と、この誘電体線路を挟持する一対の平行平板導体とか
ら構成され、前記一対の平行平板導体の間隔が、前記高
周波信号の波長λの１／２以下である非放射性誘電体線
路において、前記平行平板導体の誘電体線路側の面に比
誘電率５以下、厚さ０．３ｍｍ以下の絶縁性フィルムを
設けてなるとともに、該絶縁性フィルム上に導体パター
ンを形成し、該導体パターンに前記絶縁性フィルム上に
設けられた電子部品を接続してなることを特徴とする非
放射性誘電体線路。(57) Claims: 1. A dielectric line for transmitting a high-frequency signal having a wavelength of λ, and a pair of parallel plate conductors sandwiching the dielectric line. interval, said at nonradiative dielectric waveguide which is a half or less of the wavelength λ of the high frequency signal, the ratio on the surface of the dielectric waveguide side of the parallel flat conductors
An insulating film having a dielectric constant of 5 or less and a thickness of 0.3 mm or less is provided , and a conductor pattern is formed on the insulating film.
Formed on the insulating film on the conductive pattern.
A non-radiative dielectric line characterized by connecting provided electronic components .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26005997A JP3420480B2 (en) | 1997-09-25 | 1997-09-25 | Non-radiative dielectric line |
| US09/104,089 US6094106A (en) | 1997-06-25 | 1998-06-24 | Non-radiative dielectric waveguide module |
| DE19828488A DE19828488B4 (en) | 1997-06-25 | 1998-06-25 | Module with a radiation-free dielectric waveguide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26005997A JP3420480B2 (en) | 1997-09-25 | 1997-09-25 | Non-radiative dielectric line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1197913A JPH1197913A (en) | 1999-04-09 |
| JP3420480B2 true JP3420480B2 (en) | 2003-06-23 |
Family
ID=17342742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26005997A Expired - Fee Related JP3420480B2 (en) | 1997-06-25 | 1997-09-25 | Non-radiative dielectric line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3420480B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5742988B2 (en) * | 2008-09-25 | 2015-07-01 | ソニー株式会社 | Millimeter wave transmission equipment |
| JP2010103982A (en) | 2008-09-25 | 2010-05-06 | Sony Corp | Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system |
-
1997
- 1997-09-25 JP JP26005997A patent/JP3420480B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1197913A (en) | 1999-04-09 |
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