JPS6112243U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6112243U JPS6112243U JP9521784U JP9521784U JPS6112243U JP S6112243 U JPS6112243 U JP S6112243U JP 9521784 U JP9521784 U JP 9521784U JP 9521784 U JP9521784 U JP 9521784U JP S6112243 U JPS6112243 U JP S6112243U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- tab
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＤＩＰ型の樹脂封止型半導体の断面構造
図、第２図はタブとリードの間隔を縮小した際の主要部
の熱応力変化を示す説明図、第３図は本考案の実施例に
おけるタブとリードの位置関係を示した平面図、第４図
は実施例の立体構造図である。
１・・・封止樹脂、２・・・リード、３・・・半導体ペ
レット、４・・・ボンデイングワイヤ、５・・・タブ、
６・・田ツクホール、７・・・ボンデイング位置、訃・
・パッケージクラツク。Figure 1 is a cross-sectional structural diagram of a conventional DIP type resin-sealed semiconductor, Figure 2 is an explanatory diagram showing changes in thermal stress in the main parts when the gap between the tab and the lead is reduced, and Figure 3 is the present invention. FIG. 4 is a plan view showing the positional relationship between the tab and the lead in the embodiment, and FIG. 4 is a three-dimensional structural diagram of the embodiment. DESCRIPTION OF SYMBOLS 1... Sealing resin, 2... Lead, 3... Semiconductor pellet, 4... Bonding wire, 5... Tab,
6...Tatsuku hole, 7...Bonding position, death...
・Package crack.
Claims (1)
装置において、タブとリードの構造を一体化し、リード
のボンデイング位置をタブ周辺の半導体ペレットの段差
領域あるいは段差領域の上部あるいは下部に設けること
を特徴とする樹脂封止型半導体装置。A resin-sealed semiconductor device consisting of a semiconductor pellet, a tab, and a lead is characterized in that the structure of the tab and the lead is integrated, and the bonding position of the lead is provided in the stepped region of the semiconductor pellet around the tab or on the top or bottom of the stepped region. Resin-sealed semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521784U JPS6112243U (en) | 1984-06-27 | 1984-06-27 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521784U JPS6112243U (en) | 1984-06-27 | 1984-06-27 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6112243U true JPS6112243U (en) | 1986-01-24 |
Family
ID=30654234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9521784U Pending JPS6112243U (en) | 1984-06-27 | 1984-06-27 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112243U (en) |
-
1984
- 1984-06-27 JP JP9521784U patent/JPS6112243U/en active Pending
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