JPS61119683A - Formation of etching mask pattern - Google Patents
Formation of etching mask patternInfo
- Publication number
- JPS61119683A JPS61119683A JP24177084A JP24177084A JPS61119683A JP S61119683 A JPS61119683 A JP S61119683A JP 24177084 A JP24177084 A JP 24177084A JP 24177084 A JP24177084 A JP 24177084A JP S61119683 A JPS61119683 A JP S61119683A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- etching mask
- mask pattern
- spherical surface
- concave spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 48
- 230000015572 biosynthetic process Effects 0.000 title description 5
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims description 26
- 238000009423 ventilation Methods 0.000 claims description 10
- 230000007261 regionalization Effects 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
この発明は、凹面および凸面にエツチングでパタンを形
成するためのエツチングマスクパタンを形成するエッチ
ングマスクパタン形成法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an etching mask pattern forming method for forming an etching mask pattern for etching patterns on concave and convex surfaces.
［発明の技術的背景とその問題点］
エツチングによって所望のパタンを形成する方法は、例
えば集積回路やプリント基板などに多く使用されている
が、このようなエツチング処理を施すにはまずエツチン
グを施す面にエツチングマスクパタンを形成することが
必要である。このエツチングマスクパタンを形成する方
法には、従来からエッチングマスクパタンを貼付する方
法、シルクスクリーン法によりエッチングマスクパタン
を印刷する方法など、種々の方法がある。このような従
来の方法は一般に平面や円筒状の面にエツチングマスク
パタンを形成するには適している反面、凹面や凸面など
にエツチングマスクパタンを形成しようとすると、作業
が困難で容易に適用できないという不具合がある。[Technical background of the invention and its problems] The method of forming a desired pattern by etching is often used, for example, in integrated circuits and printed circuit boards. It is necessary to form an etching mask pattern on the surface. There are various methods for forming this etching mask pattern, such as a conventional method of pasting an etching mask pattern and a method of printing an etching mask pattern using a silk screen method. While these conventional methods are generally suitable for forming etching mask patterns on flat or cylindrical surfaces, they are difficult to perform and cannot be easily applied when attempting to form etching mask patterns on concave or convex surfaces. There is a problem.
ところで、半球およびこの半球に狭い隙間で嵌合する凹
球面を有するカップですべり軸受けを構成し、かつ半球
面または凹球面にスパイラル溝を形成したスパイラル溝
付球面軸受けは、通常のジャーナル軸受けとスラスト軸
受とで軸受アセンブリを構成する場合に比べて、構造が
簡単であり、自動調心性があって取付精度をそれ程高く
する必要がないという優れた利点を有しているため、高
に需要が見込まれる。ところが、このスパイラル溝付球
面軸受は上述したように半球面または凹球面にスパイラ
ル溝を形成することが必要であるが、このようなスパイ
ラル溝を半球面または凹球面に機械加工によって形成す
ることは比較的むずかしいため、近年のエツチング技術
の発達に鑑みエツチング処理によってこのようなスパイ
ラル溝を形成しようとする考えがある。しかしながら、
このようなスパイラル溝を形成するのに上述したような
エツチング処理を利用するに当っては、その前提として
半球面または凹球面のような部分にエツチングマスクパ
タンを形成する必要があるが、この作業は上述したよう
に困難であるという問題がある。By the way, a spiral grooved spherical bearing, which consists of a hemisphere and a cup with a concave spherical surface that fits into this hemisphere with a narrow gap, and has a spiral groove formed on the hemisphere or concave spherical surface, is different from a normal journal bearing and a thrust bearing. Compared to configuring a bearing assembly with a bearing, it has the advantages of a simple structure, self-aligning properties, and no need for high mounting accuracy, so it is expected to be in high demand. It will be done. However, as mentioned above, this spiral grooved spherical bearing requires the formation of spiral grooves on a hemispherical or concave spherical surface, but it is not possible to form such spiral grooves on a hemispherical or concave spherical surface by machining. Since this is relatively difficult, in view of the recent development of etching technology, there is an idea to form such spiral grooves by etching. however,
When using the etching process described above to form such a spiral groove, it is necessary to form an etching mask pattern on a hemispherical or concave spherical surface, but this process As mentioned above, there is a problem in that it is difficult.
〔発明の目的］
この発明は、上記に鑑みてなされたもので、その目的と
するところは、凹面や凸面のような部分へのエッチング
マスクパタンの形成を容易に行なうことができるエツチ
ングマスクパタン形成法を提供することにある。[Objective of the Invention] The present invention has been made in view of the above, and its object is to provide an etching mask pattern formation method that can easily form an etching mask pattern on concave or convex surfaces. It is about providing law.
［発明の概要］
上記目的を達成するため、この発明は、可撓膜にエツチ
ングマスク材によるバタンを形成し、前記可撓膜のバタ
ンの形成された面側を凹面に対向させて密接させ該凹面
に前記バタンを転写することを要旨とする。またこの発
明は、可撓膜にエツチングマスク材によるバタンを形成
し、前記可撓膜のバタンの形成された面倒と反対の面側
を凹面に対向させて密接し、該可撓膜の密接した凹面に
凸面を有する部材を挿入して凸面に前記バタンを転写す
ることを要旨とする。[Summary of the Invention] In order to achieve the above object, the present invention forms a button made of an etching mask material on a flexible film, and brings the side of the flexible film on which the button is formed in close contact with a concave surface. The gist is to transfer the batten onto a concave surface. Further, in the present invention, a button formed of an etching mask material is formed on the flexible membrane, and the side of the flexible membrane opposite to the groove on which the button is formed is brought into close contact with a concave surface facing the concave surface. The gist of this method is to insert a member having a convex surface into a concave surface and transfer the batten to the convex surface.
［発明の実施例］ 以下、図面を用いてこの発明の詳細な説明する。[Embodiments of the invention] Hereinafter, the present invention will be explained in detail using the drawings.
第１図（ａ）、＜ｂ＞、（Ｃ）はこの発明の一実施例を
示ずものである。同図は部材１に形成された凹球面１ａ
にエツチングマスクパタンを形成しようとする工程を示
しているものである。そのためにまず、第１図＜ａ）に
示ずように可撓膜３の一方の面、すなわち可撓ＩＩ！
３の凹球面１ａと対向する面に例えばスクリーン印刷な
どを使用してエツチングマスク材でバタン５を形成し、
この可撓膜３をバタン５の形成された面を凹球面１ａに
対向するように配設する。なお、この状態においては可
撓膜３に形成されたバタン５はまだ硬化していない。ま
た、凹球面１ａの底部には通気孔１ｂが形成されている
。FIGS. 1(a), 1(b), and 1(c) show an embodiment of the present invention. The figure shows a concave spherical surface 1a formed on a member 1.
This figure shows the process of forming an etching mask pattern on the wafer. For this purpose, first, as shown in FIG. 1<a), one side of the flexible membrane 3, that is, the flexible membrane II!
A button 5 is formed on the surface facing the concave spherical surface 1a of 3 using an etching mask material using, for example, screen printing.
This flexible membrane 3 is arranged so that the surface on which the batten 5 is formed faces the concave spherical surface 1a. Note that in this state, the batten 5 formed on the flexible film 3 has not yet hardened. Further, a ventilation hole 1b is formed at the bottom of the concave spherical surface 1a.
第１図（ａ）に示すように、凹球面１ａの上に可撓膜３
を配設した後、次に凹球面１ａの底部に形成されている
通気孔１ｂから凹球面１ａと可撓膜３とで形成された空
間内の空気を排出する。これは例えばポンプなどを使用
して行なう。この結果、可撓膜３は第１図（ｂ）に示す
ように凹球面１ａの底部に吸引され凹球面１ａに密接す
る。可撓膜３が凹球面１ａに完全に密接すると、可撓膜
３に形成されていた未だ硬化していないバタン５が凹球
面１ａに転写される。このようにバタン５が凹球面１ａ
に転写された後、通気孔１ｂからの排気を停止し、可Ｉ
Ｑ１１ｇＩ３を取り除くと、第１図（Ｃ）に示すように
凹球面１ａに転写されたエッチングマスクパタン５−が
゛形成されて残るのである。次に、これを乾燥させて硬
化させた後、この凹球面１ａをエツチングすれば、凹球
面１ａにエッチングマスクパタン５′に応じたバタンを
形成することができるのである。As shown in FIG. 1(a), a flexible membrane 3 is placed on the concave spherical surface 1a.
After arranging the concave spherical surface 1a, the air in the space formed by the concave spherical surface 1a and the flexible membrane 3 is then exhausted from the vent hole 1b formed at the bottom of the concave spherical surface 1a. This is done, for example, using a pump or the like. As a result, the flexible membrane 3 is attracted to the bottom of the concave spherical surface 1a and comes into close contact with the concave spherical surface 1a, as shown in FIG. 1(b). When the flexible film 3 comes into complete contact with the concave spherical surface 1a, the not-yet-hardened button 5 formed on the flexible film 3 is transferred to the concave spherical surface 1a. In this way, the button 5 has a concave spherical surface 1a
After the transfer is completed, the exhaust from the ventilation hole 1b is stopped and
When Q11gI3 is removed, an etching mask pattern 5- transferred to the concave spherical surface 1a remains as shown in FIG. 1(C). Next, by drying and hardening this, and etching the concave spherical surface 1a, a pattern corresponding to the etching mask pattern 5' can be formed on the concave spherical surface 1a.
なお、可撓膜３としてはゴムなどの常温で可撓性を有す
る膜や加熱により軟化するプラスチックスの膜などを使
用することができる。As the flexible film 3, it is possible to use a film made of rubber or the like which is flexible at room temperature, a film made of plastic which becomes soft when heated, or the like.
また、可撓膜３を凹球面１ａに密接させてパタン５を凹
球面１ａに転写した後、可撓膜３を除去する方法として
は、例えば、通気孔１ｂより可撓ｇ３３に向けて空気を
送り込んで可撓膜３のみを凹球面１ａより離反させる方
法、可撓膜３のみを選択溶解できる溶剤により溶かして
除去する方法などがある。Further, after the flexible film 3 is brought into close contact with the concave spherical surface 1a and the pattern 5 is transferred to the concave spherical surface 1a, the flexible film 3 can be removed by, for example, blowing air toward the flexible g33 through the ventilation hole 1b. There are a method in which only the flexible membrane 3 is moved away from the concave spherical surface 1a, and a method in which only the flexible membrane 3 is dissolved and removed using a solvent that can selectively dissolve it.
第２図はこの発明の他の実施例の一工程を示しているも
のである。これは、第１図の）に示したように、凹球面
１ａの上にパタン５を有する可撓膜３を配設した後、可
撓ｇ！３を凹球面１ａに密接するための他の方法として
、上蓋７を用いたものを示しているものである。この上
Ｍ７はその中央部に給気孔７ａを有しており、図示のよ
うに可撓膜３の上に配設される。それから、給気孔７ａ
から矢印９で示すように加圧気体を供給すると、このυ
口圧気体により可撓膜３は凹球面１ａに向けて押され、
凹球面１ａ内の気体は通気孔１ｂから排出される。その
結果、可撓膜３は第１図（ｂ）に示すように凹球面１ａ
に密接され、パタン５が凹球面１ａに転写されるのであ
る。なお、その他の処理は第１図の場合と同じである。FIG. 2 shows a step in another embodiment of the invention. As shown in FIG. 1), after a flexible membrane 3 having a pattern 5 is disposed on the concave spherical surface 1a, the flexible g! Another method for bringing the lens 3 into close contact with the concave spherical surface 1a is to use an upper lid 7. The upper M7 has an air supply hole 7a in its center and is disposed on the flexible membrane 3 as shown. Then, the air supply hole 7a
When pressurized gas is supplied as shown by arrow 9 from
The flexible membrane 3 is pushed toward the concave spherical surface 1a by the oral pressure gas,
Gas within the concave spherical surface 1a is exhausted from the vent hole 1b. As a result, the flexible membrane 3 has a concave spherical surface 1a as shown in FIG. 1(b).
The pattern 5 is transferred onto the concave spherical surface 1a. Note that other processing is the same as in the case of FIG.
第３図（ａ）、（ｂ）は、この発明の別の実施例の工程
を示しているものであって、これは球体１１の球面１１
ａ上にエツチングマスクパタンを形成しようとするもの
である。そのため、まず可撓膜３の一方の面に前述した
ようにパタン５を形成し、このパタン５の形成された可
撓膜３をパタン５の形成されている面を部材１の凹球面
１ａに対向しないように、すなわち第１図像）の場合と
逆向きに部材１に配設する。そして、このように配設さ
れた可撓１１３の外周部を環状押え板１３によって部材
１に上に押圧固定する。それから、第１図（ｂ）で示し
たように、通気孔１ｂより凹球面１ａと可撓膜３との間
の空間の空気を排出する。その結果、可撓膜３は凹球面
１ａ側に吸引され凹球面１ａ１．：密接する。この場合
、本実施例では可撓１１３に形成されているパタン５は
可撓膜３の凹球面１ａに対向する側でなく、外側、すな
わち図において可撓ＩＩＩ ３の上側に位置付けられる
ようになっている。FIGS. 3(a) and 3(b) show the steps of another embodiment of the present invention, which shows the spherical surface 11 of the sphere 11.
The purpose is to form an etching mask pattern on a. Therefore, first, the pattern 5 is formed on one surface of the flexible film 3 as described above, and the surface on which the pattern 5 is formed is placed on the concave spherical surface 1a of the member 1. They are arranged on the member 1 so that they do not face each other, that is, in the opposite direction to the case of the first icon. Then, the outer peripheral portion of the flexible member 113 arranged in this manner is pressed and fixed upwardly onto the member 1 by the annular presser plate 13. Then, as shown in FIG. 1(b), the air in the space between the concave spherical surface 1a and the flexible membrane 3 is exhausted from the ventilation hole 1b. As a result, the flexible membrane 3 is attracted toward the concave spherical surface 1a, and the concave spherical surface 1a1. :To be in close contact. In this case, in this embodiment, the pattern 5 formed on the flexible membrane 113 is not positioned on the side facing the concave spherical surface 1a of the flexible membrane 3, but on the outside, that is, on the upper side of the flexible membrane III 3 in the figure. ing.
このように可撓ｌ１１３が凹球面１ａに密接した後、次
に第３図（ａ）に示すように球体１１を凹球面１ａ内に
挿入し、更に第３図■に示すように通気孔１ｂから矢印
１５ｒ示すように加圧気体を送り込む。After the flexible body 113 has come into close contact with the concave spherical surface 1a in this way, the sphere 11 is then inserted into the concave spherical surface 1a as shown in FIG. Pressurized gas is fed in as shown by arrow 15r.
その結果、可撓膜３は通気孔１ｂからの加圧気体によっ
て下から押され、可撓膜３は球体１１の球面１１ａに密
接し、可撓膜３に形成されていたパタン５は球体１１の
球面１１ａに転写されるのである。As a result, the flexible membrane 3 is pushed from below by the pressurized gas from the vent hole 1b, the flexible membrane 3 comes into close contact with the spherical surface 11a of the sphere 11, and the pattern 5 formed on the flexible membrane 3 is removed from the sphere 11. It is transferred onto the spherical surface 11a.
このように球体１１の球面１１ａにパタン５を転写した
後は、球体１１を上方から引いて取り出し、更に可撓膜
３は前述したような方法で取り除くことができるのであ
る。After the pattern 5 has been transferred to the spherical surface 11a of the sphere 11 in this manner, the sphere 11 can be pulled out from above and the flexible membrane 3 can be removed by the method described above.
なお、上記実施例は凹球面または凸球面にエッチングマ
スクパタンを形成する場合について説明したが、これに
限らず例えば円錐面、栴円面などのすべての凹面または
凸面に適用できるものである。In the above embodiment, the etching mask pattern is formed on a concave spherical surface or a convex spherical surface, but the present invention is not limited to this and can be applied to any concave or convex surface such as a conical surface or a circular conical surface.
また、このようなエツチングマスクパタンの形成はスパ
イラル溝付球面軸受けに応用し得るのみならず、例えば
ボールジヨイントの球面の給油溝形成に応用したり、そ
の他多くの球面部品の表面加工に広く応用できるもので
あることは勿論である。Furthermore, the formation of such an etching mask pattern can be applied not only to spiral grooved spherical bearings, but also to the formation of oil supply grooves on the spherical surface of ball joints, and to the surface processing of many other spherical parts. Of course it is possible.
［発明の効果］
以上説明したように、この発明によれば、エツチングマ
スク材によるパタンを形成した可撓膜を用いて、凹面に
エツチングマスクパタンを形成するときには面記可撓膜
のパタンの形成された面側を凹面に対向させて密接させ
ることでパタンを転写し、凸面にエツチングマスクパタ
ンを形成するときには、前記可撓膜のパタンの形成され
た面側と反対の面側を凹面に対向させて密接後に該可撓
膜の密接した凹面に凸名を有する部材を挿入することで
パタンを転写するようにしたので、従来容易にマスクバ
タンを形成することができないような凹面や凸面のよう
な面にも容易にかつ短ｖＦ間でエッチングマスクパタン
を形成することができる。[Effects of the Invention] As explained above, according to the present invention, when an etching mask pattern is formed on a concave surface using a flexible film on which a pattern is formed using an etching mask material, formation of a pattern on the surface-marked flexible film is not necessary. When forming an etching mask pattern on a convex surface, the side of the flexible film opposite to the pattern-formed side is placed opposite to the concave surface to transfer the pattern. Since the pattern is transferred by inserting a member having a convex shape into the concave surface of the flexible membrane in close contact with each other, the pattern can be transferred to a concave or convex surface on which a mask button cannot be easily formed. Etching mask patterns can be easily formed even on surfaces with short vF.
そして、このようにエッチングマスクパタンを形成した
後は、通常のエツチング処理を短時間のバッチ方式で適
用できるので、例えば溝パターンを有する凸球面および
凹球面を安価にかつ大量に生産することができ、例えば
スパイラル溝付球面軸受りの製作に適用した場合にはそ
の価格および量産性を大幅に改善できる。After forming the etching mask pattern in this way, a normal etching process can be applied in a short batch process, making it possible to produce, for example, convex and concave spherical surfaces with groove patterns at low cost and in large quantities. For example, when applied to the production of spiral grooved spherical bearings, the cost and mass productivity can be greatly improved.
第１図（ａ）、（υ、（Ｃ）はこの発明の一実施例によ
るエッチングマスクパタン形成法の工程をそれぞれ示す
断面図、第２図はこの発明の他の実施例によるエッチン
グマスクパタン形成法の一工程を示す断面図、第３図（
田、（ｂ）はこの発明の別の実施例によるエッチングマ
スクパタン形成法の工程をそれぞれ示す断面図である。
１・・・部材 １ａ・・・凹球面１ｂ・・・通
気孔 ３・・・可撓膜５・・・バタン １１
・・・球体１１ａ・・・球面
第１１！ｆ（Ｑ）
第１図（ｂ）
第１図（Ｃ）
第２図
第３図（ａ）
第８図（ｂ）
に１５FIGS. 1(a), (υ, and C) are cross-sectional views showing the steps of an etching mask pattern forming method according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the steps of an etching mask pattern forming method according to another embodiment of the present invention. A cross-sectional view showing one step of the method, Figure 3 (
Figures 1 and 2 (b) are cross-sectional views showing the steps of an etching mask pattern forming method according to another embodiment of the present invention. 1... Member 1a... Concave spherical surface 1b... Ventilation hole 3... Flexible membrane 5... Button 11
... Sphere 11a... Spherical No. 11! f(Q) Figure 1 (b) Figure 1 (C) Figure 2 Figure 3 (a) Figure 8 (b) 15
Claims (4)
し、前記可撓膜のパタンの形成された面側を凹面に対向
させて密接させ該凹面に前記パタンを転写することを特
徴とするエッチングマスクパタン形成法。(1) Etching characterized in that a pattern is formed on a flexible film using an etching mask material, and the surface side of the flexible film on which the pattern is formed faces and closely contacts a concave surface, and the pattern is transferred to the concave surface. Mask pattern formation method.
パタン形成法において、前記凹面は該凹面を貫通する通
気孔を有し、当該通気孔からの排気圧力で前記可撓膜を
凹面に密接させることを特徴とするエッチングマスクパ
タン形成法。(2) In the etching mask pattern forming method according to claim 1, the concave surface has a ventilation hole passing through the concave surface, and the flexible membrane is brought into close contact with the concave surface by exhaust pressure from the ventilation hole. An etching mask pattern forming method characterized by:
し、前記可撓膜のパタンの形成された面側と反対の面側
を凹面に対向させて密接し、該可撓膜の密接した凹面に
凸面を有する部材を挿入して凸面に前記パタンを転写す
ることを特徴とするエッチングマスクパタン形成法。(3) A pattern is formed on the flexible film using an etching mask material, and the side of the flexible film opposite to the side on which the pattern is formed is brought into close contact with a concave surface facing the concave surface; An etching mask pattern forming method characterized by inserting a member having a convex surface into the convex surface and transferring the pattern to the convex surface.
パタン形成法において、前記凹面は該凹面を貫通する通
気孔を有し、前記可撓膜の凹面への密接を当該通気孔か
らの排気圧力によって行ない、前記パタンの凸面への転
写を当該通気孔からの給気圧力によって行なうことを特
徴とするエッチングマスクパタン形成法。(4) In the etching mask pattern forming method according to claim 3, the concave surface has a ventilation hole passing through the concave surface, and the flexible film is brought into close contact with the concave surface by exhaust gas from the ventilation hole. An etching mask pattern forming method characterized in that the pattern is transferred to the convex surface by pressure, and the pattern is transferred to the convex surface by air supply pressure from the ventilation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24177084A JPS61119683A (en) | 1984-11-16 | 1984-11-16 | Formation of etching mask pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24177084A JPS61119683A (en) | 1984-11-16 | 1984-11-16 | Formation of etching mask pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119683A true JPS61119683A (en) | 1986-06-06 |
Family
ID=17079263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24177084A Pending JPS61119683A (en) | 1984-11-16 | 1984-11-16 | Formation of etching mask pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119683A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0365169A1 (en) * | 1988-09-30 | 1990-04-25 | Molex Incorporated | Method of producing a printed wiring board |
| WO1998003937A1 (en) * | 1996-07-19 | 1998-01-29 | Siemens Aktiengesellschaft | Method and device for producing an electronic component, in particular for producing an induction coil for chip cards |
| WO2008024643A2 (en) * | 2006-08-11 | 2008-02-28 | Battelle Memorial Institute | Patterning non-planar surfaces |
-
1984
- 1984-11-16 JP JP24177084A patent/JPS61119683A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0365169A1 (en) * | 1988-09-30 | 1990-04-25 | Molex Incorporated | Method of producing a printed wiring board |
| WO1998003937A1 (en) * | 1996-07-19 | 1998-01-29 | Siemens Aktiengesellschaft | Method and device for producing an electronic component, in particular for producing an induction coil for chip cards |
| WO2008024643A2 (en) * | 2006-08-11 | 2008-02-28 | Battelle Memorial Institute | Patterning non-planar surfaces |
| WO2008024643A3 (en) * | 2006-08-11 | 2008-09-04 | Battelle Memorial Institute | Patterning non-planar surfaces |
| US8017308B2 (en) | 2006-08-11 | 2011-09-13 | Battelle Memorial Institute | Patterning non-planar surfaces |
| US8891065B2 (en) | 2006-08-11 | 2014-11-18 | Battelle Memorial Institute | Patterning non-planar surfaces |
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