JPS61119356U - - Google Patents
Info
- Publication number
- JPS61119356U JPS61119356U JP203285U JP203285U JPS61119356U JP S61119356 U JPS61119356 U JP S61119356U JP 203285 U JP203285 U JP 203285U JP 203285 U JP203285 U JP 203285U JP S61119356 U JPS61119356 U JP S61119356U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thickness
- tie bar
- thinner
- connects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例の部分平面図、同
図ｂは同図ａのＡ―Ａ断面図、第２図ａは本考案
の他の実施例の部分平面図、同図ｂは同図ａのＡ
―Ａ断面図、第３図ａは従来のリードフレームの
平面図、同図ｂは同図ａのＡ―Ａ断面図である。
１……放熱板、２……取付穴、３……ペレツト
搭載部、４……外部リード、５ａ，６，７……放
熱板部のタイバー。
Figure 1a is a partial plan view of one embodiment of the present invention, figure b is a sectional view taken along line AA in figure a, figure 2a is a partial plan view of another embodiment of the present invention, figure b is A in figure a.
-A sectional view, FIG. 3a is a plan view of a conventional lead frame, and FIG. 3b is a sectional view taken along line A--A in FIG. 3a. 1... Heat sink, 2... Mounting hole, 3... Pellet mounting part, 4... External lead, 5a, 6, 7... Tie bar of heat sink part.
Claims (1)
多数一列に連結されてなるリードフレームにおい
て、前記放熱板を互いに連結するタイバーの厚み
が前記放熱板の厚みにより薄いことを特徴とする
リードフレーム。 A lead frame in which a large number of unit sections each consisting of a heat sink part and an external lead part are connected in a line, characterized in that the thickness of a tie bar that connects the heat sinks to each other is thinner than the thickness of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP203285U JPS61119356U (en) | 1985-01-11 | 1985-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP203285U JPS61119356U (en) | 1985-01-11 | 1985-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119356U true JPS61119356U (en) | 1986-07-28 |
Family
ID=30475326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP203285U Pending JPS61119356U (en) | 1985-01-11 | 1985-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119356U (en) |
-
1985
- 1985-01-11 JP JP203285U patent/JPS61119356U/ja active Pending